Solid-state imaging element and solid-state imaging device

1. A solid-state imaging element comprising:

a photoelectric conversion layer;

a first electrode and a second electrode opposed to each other with the photoelectric conversion layer interposed therebetween;

a semiconductor layer provided between the first electrode and the photoelectric conversion layer;

an accumulation electrode opposed to the photoelectric conversion layer with the semiconductor layer interposed therebetween;

an insulating film provided between the accumulation electrode and the semiconductor layer;

a barrier layer provided between the semiconductor layer and the photoelectric conversion layer; and

a light-shielding film that covers the first electrode with the photoelectric conversion layer interposed therebetween.

2. The solid-state imaging element according to claim 1 , wherein

the photoelectric conversion layer includes an organic semiconductor material, and

the semiconductor layer includes a semiconductor material having mobility higher than mobility of the organic semiconductor material.

3. The solid-state imaging element according to claim 1 , further comprising a semiconductor substrate having a first surface and a second surface that are opposed to each other, wherein

the first electrode, the semiconductor layer, the barrier layer, the photoelectric conversion layer, and the second electrode are provided in this order on the first surface of the semiconductor substrate.

4. The solid-state imaging element according to claim 3 , further comprising an inorganic photoelectric conversion section provided in the semiconductor substrate.

5. The solid-state imaging element according to claim 1 , further comprising:

a semiconductor substrate having a first surface and a second surface that are opposed to each other; and

a multilayer wiring line provided between the second surface of the semiconductor substrate and the first electrode.

6. The solid-state imaging element according to claim 1 , further comprising a transfer electrode provided opposed to the semiconductor layer with the insulating film interposed therebetween, the transfer electrode controlling movement of signal charges in the semiconductor layer.

7. The solid-state imaging element according to claim 1 , further comprising a discharge electrode provided apart from the first electrode and electrically coupled to the semiconductor layer.

8. The solid-state imaging element according to claim 1 , wherein the barrier layer includes silicon oxide, silicon nitride, silicon oxynitride, or an organic material.

9. A solid-state imaging element comprising:

a photoelectric conversion layer;

a first electrode and a second electrode opposed to each other with the photoelectric conversion layer interposed therebetween;

a semiconductor layer provided between the first electrode and the photoelectric conversion layer, wherein a junction plane between the semiconductor layer and the photoelectric conversion layer provides a potential barrier;

an accumulation electrode opposed to the photoelectric conversion layer with the semiconductor layer interposed therebetween;

an insulating film provided between the accumulation electrode and the semiconductor layer; and

a light-shielding film that covers the first electrode with the photoelectric conversion layer interposed therebetween.

10. The solid-state imaging element according to claim 9 , wherein

the photoelectric conversion layer includes an organic semiconductor material, and

the semiconductor layer includes a semiconductor material having mobility higher than mobility of the organic semiconductor material.

11. The solid-state imaging element according to claim 9 , further comprising a semiconductor substrate having a first surface and a second surface that are opposed to each other, wherein

the first electrode, the semiconductor layer, the photoelectric conversion layer, and the second electrode are provided in this order on the first surface of the semiconductor substrate.

12. The solid-state imaging element according to claim 9 , further comprising:

a semiconductor substrate having a first surface and a second surface that are opposed to each other; and

a multilayer wiring line provided between the second surface of the semiconductor substrate and the first electrode.

13. The solid-state imaging element according to claim 12 , further comprising an inorganic photoelectric conversion section provided in the semiconductor substrate.

14. The solid-state imaging element according to claim 9 , further comprising a transfer electrode provided opposed to the semiconductor layer with the insulating film interposed therebetween, the transfer electrode controlling movement of signal charges in the semiconductor layer.

15. The solid-state imaging element according to claim 9 , further comprising a discharge electrode provided apart from the first electrode and electrically coupled to the semiconductor layer.

16. A solid-state imaging device comprising:

a plurality of solid-state imaging elements, the solid-state imaging elements each including:

a photoelectric conversion layer;

a first electrode and a second electrode opposed to each other with the photoelectric conversion layer interposed therebetween;

a semiconductor layer provided between the first electrode and the photoelectric conversion layer;

an accumulation electrode opposed to the photoelectric conversion layer with the semiconductor layer interposed therebetween;

an insulating film provided between the accumulation electrode and the semiconductor layer;

a barrier layer provided between the semiconductor layer and the photoelectric conversion layer; and

a shielding electrode opposed to the semiconductor layer with the insulating film interposed therebetween, the shielding electrode being arranged between the accumulation electrodes that are adjacent to each other.

17. The solid-state imaging device according to claim 16 , further comprising a plurality of pixels in which respective ones of the solid-state imaging elements are provided, wherein the semiconductor layer is provided separately for each of the pixels.

18. The solid-state imaging device according to claim 16 , further comprising a plurality of pixels in which respective ones of solid-state imaging elements are provided, wherein the photoelectric conversion layer is provided separately for each of the pixels.

19. The solid-state imaging device according to claim 16 , wherein the barrier layer includes silicon oxide, silicon nitride, silicon oxynitride, or an organic material.

20. A solid-state imaging device comprising:

a plurality of solid-state imaging elements, the solid-state imaging elements each including;

a photoelectric conversion layer;

a first electrode and a second electrode opposed to each other with the photoelectric conversion layer interposed therebetween;

a semiconductor layer provided between the first electrode and the photoelectric conversion layer, wherein a junction plane between the semiconductor layer and the photoelectric conversion layer provides a potential barrier;

an accumulation electrode opposed to the photoelectric conversion layer with the semiconductor layer interposed therebetween;

an insulating film provided between the accumulation electrode and the semiconductor layer; and

a shielding electrode opposed to the semiconductor layer with the insulating film interposed therebetween, the shielding electrode being arranged between the accumulation electrodes that are adjacent to each other.