IP Library › Granted Patent US 11,552,412
Granted Patent B2
US 11,552,412 · App. 17/524,650 · Granted Jan 10, 2023

Building block for space-based phased array

Inventors: Timothy Patrick Wink (Castle Rock, CO); James F. Mulvey (Castle Pines, CO); Eric P. Osborne (Littleton, CO); Thomas R. Stephenson (Littleton, CO)
Assignee: LOCKHEED MARTIN CORPORATION
H01Q21/064H01P1/20H01Q1/28H01Q13/02H01Q13/0283H01Q15/24H01Q21/0087B64G1/66
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Quick Facts
Patent No.
US 11,552,412
App. No.
17/524,650
Granted
Jan 10, 2023
Kind
B2
Abstract

An apparatus includes an aperture layer coupled to a polarizer layer. The aperture layer includes an antenna and a filter. A circuit layer is mechanically and thermally coupled to the aperture layer. The antenna includes a square horn antenna made of a polymer material. The filter includes a waveguide filter having a first and a second piece separately molded. The waveguide filter includes a folded-back waveguide coupled to the horn antenna at one end and to the circuit layer at another end.

Claims (27)

1. A method of providing an array module for a phased array, the method comprising:

forming a horn antenna using a polymer material;

forming a waveguide filter including separately molding a first piece and a second piece;

coupling the horn antenna to the waveguide filter to form an aperture layer; and

coupling the aperture layer to a circuit layer,

wherein:

the horn antenna comprises a square horn, and

forming the waveguide filter comprises forming a folded-back waveguide for coupling to the horn antenna at one end and to the circuit layer at another end.

2. The method of claim 1 , further comprising forming a polarizer layer by stacking a plurality of films and separating the films using foam spacers.

3. The method of claim 1 , wherein separately molding the first and the second piece comprise using a glass filled polymer, and wherein the method further comprises bonding the first piece to the second piece using a silver filed epoxy.

4. The method of claim 1 , further comprising coating the horn antenna and the waveguide filter using multiple copper layers and an anti-corrosion finish layer.

5. The method of claim 1 , wherein forming the horn antenna comprises using a glass-filled resin, and wherein a thin wall thickness of the horn antenna is less than about 0.5 mm, and wherein an aperture of the horn antenna is within a range of about 50-70 mm.

6. The method of claim 1 , further comprising coupling the circuit layer to a tile layer using a subarray distribution layer, wherein the subarray distribution layer includes radio-frequency (RF), optical, digital and DC power components.

7. The method of claim 1 , further comprising electrically coupling a tile layer to a host system using electrical connectors of the tile layer to communicate signals including RF, optical, power and control signals to and from the host system, wherein the host system includes a space vehicle.

8. A phase array comprising:

a plurality of subarrays, each of the plurality of subarrays comprising a plurality of array modules, each array module comprising:

an aperture layer comprising a horn antenna and a waveguide filter; and

a circuit layer coupled to the aperture layer;

wherein:

each of the plurality of subarrays is thermally and spatially isolated with a clearance gap to reduce thermal distortion effects,

the waveguide filter comprises a first and a second piece separately molded, and

the waveguide filter comprises a folded-back waveguide coupled to the horn antenna at one end and to the circuit layer at another end.

9. The phase array of claim 8 , wherein the horn antenna comprises a square horn antenna made of a polymer material including a glass-filled resin and has a thin wall thickness of less than about 1 mm, and wherein an aperture of the square horn antenna is within a range of about 50-70 mm.

10. The phase array of claim 8 , wherein a count of the plurality of array modules is scalable with varying horn aperture spacing, and wherein a design of the plurality of array modules allows application of automated manufacturing techniques.

11. The phase array of claim 8 , wherein each of the plurality of array modules is has a multilayer structure with mechanical couplings that pass through the multilayer structure to form a continuous heat load path with reduced number of fasteners.

12. The phase array of claim 8 , wherein each of the first and the second piece comprise a molded glass filled polymer and are bonded together using a silver filed epoxy, and wherein the waveguide filter comprises multiple plated copper layers and an anti-corrosion finish layer.

13. The phase array of claim 8 , wherein the circuit layer is coupled to a tile layer using a subarray distribution layer, wherein the circuit layer is independently testable, and wherein the phased array further comprises interposers configured to electrically connect circuit layers of the plurality of array modules.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 28, 2021
From: WINK, TIMOTHY PATRICK; MULVEY, JAMES F.; OSBORNE, ERIC P.; STEPHENSON, THOMAS R.
To: LOCKHEED MARTIN CORPORATION
Reel/Frame 058489/0367 →
Continuity (2)
Division 15953368 · Apr 13, 2018
Related Publication 20220069478A1 · Mar 3, 2022
Cited By (2)
US 12,261,366 US 12,689,129