IP Library › Granted Patent US 11,555,657
Granted Patent B2
US 11,555,657 · App. 17/375,626 · Granted Jan 17, 2023

Electronic device having heat collection/diffusion structure

Inventors: Haejin Lee (Seoul, KR); Kyungha Koo (Seoul, KR); Chunghyo Jung (Suwon-si, KR); Se-Young Jang (Seongnam-si, KR); Jungje Bang (Suwon-si, KR); Jaeheung Ye (Suwon-si, KR); Chi-Hyun Cho (Yongin-si, KR)
Assignee: Samsung Electronics Co., Ltd.
F28D15/0275F28D15/0233G06F1/203H01L23/427H04M1/0277H05K7/2039H05K7/20336H05K9/0024H05K9/0081
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Quick Facts
Patent No.
US 11,555,657
App. No.
17/375,626
Granted
Jan 17, 2023
Kind
B2
Abstract

An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Claims (70)

1. A portable communication device comprising:

a display module;

a printed circuit board disposed below the display module;

an electronic component disposed on a surface of the printed circuit board such that a top surface of the electronic component is facing the display module;

a first thermal interfacing material disposed on the top surface of the electronic component;

a shielding member disposed on the surface of the printed circuit board and enclosing the electronic component to mitigate electromagnetic interference associated with the electronic component, the shielding member including:

a shield frame mounted to the printed circuit board, the shield frame including a side portion and a top portion, the side portion surrounding a side periphery of the electronic component and the top portion extended from the side portion and including an opening formed by an inner periphery of the top portion; and

a shield cover disposed over the shield frame such that the shield cover covers the opening and the first thermal interfacing material;

a second thermal interfacing material disposed on the shield cover of the shielding member;

a heat transfer member including a thermally conductive frame and a fluid disposed therein, the heat transfer member disposed over the second thermal interfacing material such that the fluid is to be vaporized by heat and to be moved from a first portion of the heat transfer member to a second portion of the heat transfer member; and

a support member for mechanically supporting the display module, the support member having a first side facing the display module and a second side facing the printed circuit board,

wherein an entire length of the heat transfer member is disposed at the second side of the support member, and

wherein the first portion of the heat transfer member is disposed between the second thermal interfacing material and the support member.

2. The portable communication device of claim 1 ,

wherein the second side of the support member includes a recess that extends towards the first side of the support member from the second side of the support member, and

wherein at least a portion of the heat transfer member is disposed in the recess.

3. The portable communication device of claim 1 , wherein the shield cover has a thickness that is thinner than a thickness of the side portion of the shield frame.

4. The portable communication device of claim 1 , wherein the shield cover has a thickness that is thinner than a thickness of the top portion of the shield frame.

5. The portable communication device of claim 1 , further comprising:

a component disposed in proximity of a side surface of the portable communication device; and

a heat transfer protection structure disposed between the component and the heat transfer member such that the heat transfer protection structure mitigates at least a portion of heat from being transferred from the heat transfer member to the component.

6. The portable communication device of claim 1 , wherein the shield cover comprises a metal film or metal sheet.

7. The portable communication device of claim 1 ,

wherein a first one of the first thermal interfacing material or the second thermal interfacing material includes a liquid thermal interfacing material, and

wherein a second one of the first thermal interfacing material or the second thermal interfacing material includes a solid thermal interfacing material.

8. The portable communication device of claim 1 , wherein the first thermal interfacing material is a different material than the second thermal interfacing material.

9. The portable communication device of claim 1 , further comprising:

a heat collection device disposed directly on the second thermal interfacing material and configured to receive heat from the second thermal interfacing material.

10. The portable communication device of claim 1 , further comprising:

a bonding material for bonding at least one or more portions of the heat transfer member to the support member, the bonding material being disposed between the at least one or more portions of the heat transfer member and the support member.

11. The portable communication device of claim 1 , wherein the support member is disposed on a left side, a right side, and a top side of the heat transfer member.

12. The portable communication device of claim 2 , further comprising:

a battery that is accommodated in a cutout portion of the printed circuit board,

wherein the recess is formed in the second side of the support member to face the printed circuit board, without overlapping with the battery, when viewed in a direction substantially perpendicular to the surface of the printed circuit board.

13. The portable communication device of claim 12 , wherein the support member includes an area for accommodating the battery and the recess is formed in the second side of the support member outside the area for accommodating the battery.

14. A portable communication device comprising:

a display module;

a printed circuit board disposed below the display module;

a battery;

a first component disposed on a surface of the printed circuit board such that a top surface of the first component is facing the display module;

a first thermal interfacing material disposed on the top surface of the first component;

a shielding member disposed on the surface of the printed circuit board and enclosing the first component to mitigate electromagnetic interference associated with the first component, the shielding member including:

a shield frame mounted to the printed circuit board, the shield frame including a side portion and a top portion, the side portion surrounding a side periphery of the first component and the top portion extended from the side portion and including an opening formed by an inner periphery of the top portion; and

a shield cover disposed over the shield frame such that the shield cover covers the opening and the first thermal interfacing material;

a second thermal interfacing material disposed on the shield cover of the shielding member;

a heat transfer member including a thermally conductive frame and a fluid disposed therein, the heat transfer member disposed over the second thermal interfacing material such that the fluid is to be vaporized by heat and to be moved from a first portion of the heat transfer member to a second portion of the heat transfer member;

a second component disposed in proximity of a side surface of the portable communication device; and

a heat transfer protection structure disposed between the second component and the heat transfer member such that the heat transfer protection structure mitigates at least a portion of heat from being transferred from the heat transfer member to the second component,

wherein an entire length of the heat transfer member does not overlap with the battery, when viewed in a direction substantially perpendicular to the surface of the printed circuit board.

15. The portable communication device of claim 14 , wherein the heat transfer protection structure comprises at least one opening formed in an inner support member.

16. The portable communication device of claim 14 , wherein the first thermal interfacing material is a different material than the second thermal interfacing material.

17. A portable communication device comprising:

a display module;

a printed circuit board disposed below the display module;

a battery;

a first component disposed on a surface of the printed circuit board such that a top surface of the first component is facing the display module;

a first thermal interfacing material disposed on the top surface of the first component;

a shielding member disposed on the surface of the printed circuit board and enclosing the first component to mitigate electromagnetic interference associated with the first component;

a second thermal interfacing material disposed on the shielding member;

a heat transfer member including a thermally conductive frame and a fluid disposed therein, the heat transfer member disposed over the second thermal interfacing material such that the fluid is to be vaporized by heat and to be moved between a first portion of the heat transfer member and a second portion of the heat transfer member;

a second component disposed in proximity of a side surface of the portable communication device;

a heat transfer protection structure disposed between the second component and the heat transfer member such that the heat transfer protection structure mitigates at least a portion of heat from being transferred from the heat transfer member to the second component; and

a support member for mechanically supporting the display module, the support member having a first side facing the display module and a second side facing the printed circuit board,

wherein the first portion of the heat transfer member is disposed between the second thermal interfacing material and the support member, and

wherein an entire length of the heat transfer member is disposed at the second side of the support member without overlapping with the battery, when viewed in a direction substantially perpendicular to the surface of the printed circuit board.

18. The portable communication device of claim 17 ,

wherein the second side of the support member includes a recess that extends towards the first side of the support member from the second side of the support member, and

wherein at least a portion of the heat transfer member is disposed in the recess.

19. The portable communication device of claim 17 , wherein the heat transfer protection structure comprises at least one opening formed in an inner support member.

20. The portable communication device of claim 18 , wherein the support member includes an area for accommodating the battery and the recess is formed in the second side of the support member outside the area for accommodating the battery.

Priority Claims (2)
KR 10-2016-0019155 · Feb 18, 2016 · national
KR 10-2016-0144165 · Nov 1, 2016 · national
Continuity (3)
Continuation 17094293 · Nov 10, 2020
Continuation 15999729
Related Publication 20210341229A1 · Nov 4, 2021
Cited By (1)
US 12,610,449