Image sensor and imaging device
The incidence of incident light transmitted through a photoelectric conversion unit onto a charge holding unit, a pixel in the adjacency, and the like can be blocked in a pixel. An image sensor includes a pixel, a wiring layer, and an incident light attenuation unit. The pixel includes a photoelectric conversion unit that is formed in a semiconductor substrate and performs photoelectric conversion based on incident light, and a pixel circuit that generates an image signal according to a charge generated by the photoelectric conversion. The wiring layer is arranged on a surface of the semiconductor substrate different from a surface onto which the incident light is incident, and transports either the image signal or a signal applied to the pixel circuit. The incident light attenuation unit attenuates the incident light transmitted through the photoelectric conversion unit.
1. An image sensor, comprising:
a pixel including:
a photoelectric conversion unit configured to perform photoelectric conversion based on incident light, wherein the photoelectric conversion unit is in a semiconductor substrate, and
a pixel circuit configured to generate an image signal based on a charge generated by the photoelectric conversion;
a wiring layer configured to transport either the image signal or a signal applied to the pixel circuit, wherein the wiring layer is on a surface of the semiconductor substrate different from a surface onto which the incident light is incident; and
an incident light attenuation unit configured to attenuate the incident light transmitted through the photoelectric conversion unit, wherein the incident light attenuation unit includes:
a lid portion having an opening portion that is arranged between the semiconductor substrate and the wiring layer and allows light transmitted through the photoelectric conversion unit to be incident; and
a wall portion enclosing the opening portion.
2. The image sensor according to claim 1 , wherein the incident light attenuation unit includes the wall portion formed simultaneously with the wiring layer.
3. The image sensor according to claim 1 , wherein the incident light attenuation unit further includes a bottom portion adjacent to the wall portion and arranged to face the lid portion.
4. The image sensor according to claim 3 , wherein the incident light attenuation unit includes the bottom portion formed simultaneously with the wiring layer.
5. The image sensor according to claim 1 , wherein the opening portion is arranged in the incident light attenuation unit at a position shifted according to an incident angle of the incident light.
6. The image sensor according to claim 1 , wherein the pixel circuit further includes:
a charge holding unit configured to hold the generated charge, and
an image signal generation unit configured to generate the image signal based on the held charge.
7. The image sensor according to claim 6 , further comprising a light-shielding wall that is arranged between the photoelectric conversion unit and the charge holding unit, wherein the light-shielding wall provides shielding from the incident light.
8. The image sensor according to claim 6 , further comprising a shading film that is arranged near the charge holding unit on a surface of the semiconductor substrate onto which the incident light is incident, wherein the shading film provides shielding from the incident light.
9. An imaging device, comprising:
a pixel including:
a photoelectric conversion unit configured to perform photoelectric conversion based on incident light, wherein the photoelectric conversion unit is in a semiconductor substrate, and
a pixel circuit configured to generate an image signal based on a charge generated by the photoelectric conversion;
a wiring layer configured to transport either the image signal or a signal applied to the pixel circuit, wherein the wiring layer is on a surface of the semiconductor substrate different from a surface onto which the incident light is incident;
an incident light attenuation unit configured to attenuate the incident light transmitted through the photoelectric conversion unit, wherein the incident light attenuation unit includes:
a lid portion having an opening portion that is arranged between the semiconductor substrate and the wiring layer and allows light transmitted through the photoelectric conversion unit to be incident; and
a wall portion enclosing the opening portion; and
a processing circuit configured to process the transported image signal.