Semiconductor device and method of manufacturing the same
A semiconductor device is provided. The semiconductor device includes a substrate a substrate, a first electrode structure on the substrate, the first electrode structure including first insulating patterns and first electrode patterns, the first insulating patterns alternately stacked with the first electrode patterns, a second electrode pattern on a sidewall of the first electrode structure, and a data storage film on a sidewall of the second electrode pattern. The data storage film has a variable resistance.
1. A semiconductor device comprising:
a substrate;
a first electrode structure on the substrate, the first electrode structure including first insulating patterns and first electrode patterns, the first insulating patterns alternately stacked with the first electrode patterns;
a second electrode pattern on a sidewall of the first electrode structure; and
a data storage film on a top surface of the second electrode pattern and on a sidewall of the second electrode pattern,
wherein the data storage film has a variable resistance,
the first electrode structure comprises a plurality of first electrode structures arranged in a first direction, and
the second electrode pattern extends in a second direction, crosses the plurality of first electrode structures in the second direction, and overlaps the plurality of first electrode structures in a third direction perpendicular to an upper surface of the substrate,
wherein the data storage film extends on the first electrode patterns and is configured to electrically connect the first electrode pattern to the second electrode pattern.
2. The semiconductor device of claim 1 , wherein an oxygen vacancy is inside the data storage film, and the oxygen vacancy changes the resistance of the data storage film.
3. The semiconductor device of claim 2 , wherein the data storage film includes a dielectric film in which the oxygen vacancy is mobile.
4. The semiconductor device of claim 1 , wherein the data storage film includes a phase change material.
5. The semiconductor device of claim 1 , further comprising:
a second insulating pattern between the second electrode pattern and the first electrode structure.
6. The semiconductor device of claim 1 , wherein the second electrode pattern extends along a surface of the first electrode structure, and the first electrode structure is between the second electrode pattern and the substrate.
7. The semiconductor device of claim 6 , wherein the second electrode pattern has a uniform thickness.
8. The semiconductor device of claim 1 , wherein a distance between the top surface of the second electrode pattern and an upper surface of the substrate is uniform.
9. The semiconductor device of claim 1 , wherein the second electrode pattern comprises a plurality of second electrode patterns arranged in a first direction, and
the first electrode structure extends in a second direction crossing the plurality of second electrode patterns and overlaps the plurality of second electrode patterns in a third direction perpendicular to an upper surface of the substrate.
10. The semiconductor device of claim 1 , wherein the second electrode pattern extends on the substrate, and
the data storage film exposes the second electrode pattern on the substrate.
11. The semiconductor device of claim 1 , further comprising:
a selection device structure on a side opposite to the first electrode structure with respect to the second electrode pattern,
wherein when the data storage film has unipolar resistance switching-type characteristics, the selection device structure comprises at least one of a PN junction diode or a Schottky diode, and
when the data storage film has bipolar resistance switching-type characteristics, the selection device structure comprises at least one of a non-linear selection device or a threshold switching device.
12. The semiconductor device of claim 1 , wherein the data storage film is directly on the top surface of the second electrode pattern and directly on the sidewall of the second electrode pattern.
13. A semiconductor device comprising:
a substrate including a cell array region and a connection region;
a first electrode structure extending from the cell array region to the connection region;
a second electrode structure on a sidewall of the first electrode structure in the cell array region; and
a data storage film in the cell array region, the data storage film covering the first electrode structure and a top surface of the second electrode structure,
wherein the first electrode structure comprises a plurality of steps in the connection region,
the data storage film has a variable resistance,
the first electrode structure comprises a plurality of first electrode structures arranged in a first direction,
the second electrode structure extends in a second direction, crosses the plurality of first electrode structures in the second direction, and overlaps the plurality of first electrode structures in a third direction perpendicular to an upper surface of the substrate, and
the data storage film extends on the first electrode structure and is configured to electrically connect the first electrode structure to the second electrode structure.
14. The semiconductor device of claim 13 , wherein the first electrode structure includes first insulating patterns and first electrode patterns that are alternately stacked on the substrate, and
upper surfaces of the first electrode patterns are exposed in the connection region and are arranged along an extension direction of the first electrode structure.
15. The semiconductor device of claim 14 , wherein the second electrode structure includes a second insulating pattern and a second electrode pattern that extend on the substrate.
16. The semiconductor device of claim 1 , wherein the data storage film is conformal over the second electrode pattern.
17. The semiconductor device of claim 1 , wherein the data storage film is on a first sidewall of the first electrode structure and on a second sidewall of the second electrode pattern, the first sidewall extending in a first direction, the second sidewall extending in a second direction that crosses the first direction.
18. The semiconductor device of claim 1 , wherein the data storage film includes a first horizontal portion on a surface of the substrate, a second vertical portion on the sidewall of the first electrode structure, and a second vertical portion on the sidewall of the second electrode pattern.
19. The semiconductor device of claim 18 , wherein the data storage film includes a third horizontal portion on an upper surface of the first electrode structure, and
the data storage film includes a fourth horizontal portion on the top surface of the second electrode pattern.