Method for manufacturing light-emitting device
To provide a method for manufacturing a lightweight light-emitting device having a light-emitting region on a curved surface. The light-emitting region is provided on a curved surface in such a manner that a light-emitting element is formed on a flexible substrate supported in a plate-like shape and the flexible substrate deforms or returns.
1. A semiconductor device comprising:
an exterior unit comprising glass;
a light-emitting panel over the exterior unit;
a circuit for driving the light-emitting panel over the light-emitting panel;
a metal plate over the light-emitting panel;
an adhesive bonding the metal plate to the exterior unit;
a secondary battery over the metal plate; and
an outer lid over the secondary battery,
wherein the outer lid overlaps with the metal plate without the secondary battery provided therebetween,
wherein the light-emitting panel comprises a light-emitting element over a first substrate, the first substrate being flexible;
wherein the light-emitting panel comprises a curved edge portion,
wherein a terminal portion is provided on a portion of the curved edge portion which is not bent,
wherein the terminal portion is electrically connected to the circuit,
wherein the terminal portion faces the light-emitting panel,
wherein the metal plate comprises a region not overlapping with the circuit, and
wherein the secondary battery does not overlap with the terminal portion.
2. The semiconductor device according to claim 1 , further comprising:
a flexible printed circuit.
3. The semiconductor device according to claim 2 ,
wherein the terminal portion is provided on the portion of the curved edge portion which is not bent, and
wherein the terminal portion is electrically connected to the circuit.
4. A semiconductor device comprising:
a glass plate;
a display panel over the glass plate;
a circuit for driving the display panel over the display panel;
a metal plate over the display panel;
an adhesive bonding the metal plate to the glass plate; and
a secondary battery over the metal plate and overlapping with the display panel,
wherein the display panel comprises a light-emitting element over a first substrate, the first substrate being flexible,
wherein the display panel comprises a curved edge portion,
wherein a terminal portion is provided on a portion of the curved edge portion which is not bent,
wherein the terminal portion is electrically connected to the circuit,
wherein the metal plate comprises a region not overlapping with the circuit, and
wherein the secondary battery does not overlap with the terminal portion.
5. The semiconductor device according to claim 4 , further comprising:
a flexible printed circuit.
6. The semiconductor device according to claim 5 ,
wherein the terminal portion is provided on the portion of the curved edge portion which is not bent, and
wherein the terminal portion is electrically connected to the circuit.
7. A semiconductor device comprising:
an exterior unit;
a light-emitting panel over the exterior unit;
a circuit over the light-emitting panel;
a layer comprising a metal over the circuit;
a secondary battery over the layer comprising a metal; and
a first lid over the secondary battery,
wherein each of the light-emitting panel and the circuit is provided in a first space formed between the exterior unit and the layer comprising a metal,
wherein the secondary battery is provided in a second space formed between the layer comprising a metal and the first lid,
wherein a light-emitting region of the light-emitting panel comprises a curved edge portion, and
wherein the light-emitting panel comprises a curved edge portion on which a terminal portion is provided.
8. The semiconductor device according to claim 7 , further comprising:
a flexible printed circuit.