Semiconductor device and manufacturing method thereof

1. A semiconductor device, comprising:

a semiconductor module, including

a semiconductor chip,

a case which stores the semiconductor chip, the case having a front surface,

a plurality of external terminals which are electrically connected to the semiconductor chip and extend upward from the front surface of the case, and

a reference pin which extends upward from the front surface of the case;

a positioning member having a front surface and a rear surface thereof that are opposite to each other, the rear surface facing the front surface of the case, the positioning member including

a reference hole penetrating therethrough to accommodate the reference pin of the semiconductor module, and

a plurality of supporting holes formed therein to respectively accommodate the plurality of external terminals of the semiconductor module; and

a printed board including a plurality of terminal holes that respectively correspond to the plurality of external terminals, the printed board being disposed on the front surface of the case via the positioning member, the plurality of external terminals of the semiconductor module being respectively attached to the plurality of terminal holes.

2. The semiconductor device according to claim 1 , wherein the reference hole has a holding part configured to hold the reference pin, such that the rear surface of the positioning member is maintained at a predetermined height from the front surface of the case.

3. The semiconductor device according to claim 2 ,

wherein the positioning member has a positioning element on the front surface thereof, the positioning element having an upper end that is lower than upper ends of the plurality of external terminals, and

wherein the printed board has an insertion hole into which the positioning element is inserted.

4. The semiconductor device according to claim 1 , wherein in a plan view of the semiconductor device, the plurality of external terminals are aligned, and the plurality of supporting holes are aligned.

5. The semiconductor device according to claim 4 , wherein in the plan view of the semiconductor device, the reference pin and the plurality of external terminals are aligned, and the reference hole and the plurality of supporting holes are aligned.

6. The semiconductor device according to claim 1 , wherein the positioning member is made of glass, ceramic, or a resin material.

7. A semiconductor device manufacturing method comprising:

preparing a semiconductor module including

a semiconductor chip,

a case which stores the semiconductor chip, the case having a front surface,

a plurality of external terminals electrically connected to the semiconductor chip, and extending upward from the front surface of the case, and

a reference pin extending upward from the front surface of the case, and

a positioning member having a reference hole and a plurality of supporting holes penetrating therethrough, the positioning member having a front surface and a rear surface opposite to each other;

attaching the positioning member to the semiconductor module by

setting the rear surface of the positioning member to face the front surface of the case, and

inserting the reference pin and the plurality of external terminals respectively into the reference hole and the plurality of supporting holes, such that the reference pin is held in the reference hole, and the rear surface of the positioning member is maintained at a first height from the front surface of the case;

heating the semiconductor module to which the positioning member has been attached;

separately preparing a printed board having a plurality of terminal holes that respectively correspond to the plurality of external terminals;

mounting the printed board on the front surface of the positioning member, and inserting the plurality of external terminals, extending from the front surface of the positioning member, into the plurality of terminal holes in the printed board; and

pressing the printed board toward the front surface of the case to attach the printed board to the plurality of external terminals.

8. The semiconductor device manufacturing method according to claim 7 ,

wherein the positioning member has a positioning element on the front surface thereof, and

wherein, the attaching includes attaching the positioning member to the semiconductor module such that an upper end of the positioning element is higher than upper ends of the plurality of external terminals.

9. The semiconductor device manufacturing method according to claim 8 , wherein the attaching includes

maintaining the positioning member at the first height, and

maintaining a length of each of the external terminals between the rear surface of the positioning member and the front surface of the case to be at least one third of an entire length of said each external terminal.

10. The semiconductor device manufacturing method according to claim 7 , wherein the pressing includes moving the positioning member and the printed board toward the front surface of the case and allowing the reference hole to hold the reference pin at a second height, which is lower than the first height, from the front surface of the case, such that the positioning member is maintained at the second height.