DC chopper for MMC cell with integrated chopper resistor
This disclosure proposes a topology that integrates a DC chopper into the Modular Multilevel Converter (MMC) cells of a power converter. The integrated DC chopper may include chopper resistors that may also be advantageously integrated into a heat sink for a power module including at least the power transistors of the MMC cell. Embodiments herein also describe a method for using an MMC cell's IGBTs and chopper resistors for providing a safe discharge of both cell capacitors and DC-link capacitors in different operating conditions.
1. A modular multilevel converter (MMC), comprising:
a plurality of MMC cells, a first MMC cell of the plurality of MMC cells comprising:
a first main transistor and a second main transistor connected in series between a first voltage rail and a second voltage rail;
a first direct current (DC) chopper directly connected to the first voltage rail and to the second voltage rail and comprising a first dump resistor directly connected to the second voltage rail and to a first node between a first controllable chopper transistor and a second controllable chopper transistor of the first DC chopper, wherein the first DC chopper further comprises a diode connected in parallel with the first dump resistor and the second controllable chopper transistor of the first DC chopper; and
a first cell capacitor directly connected to the first voltage rail and to the second voltage rail in parallel to the first DC chopper; and
a second MMC cell of the plurality of MMC cells comprising:
a third main transistor and a fourth main transistor connected in series between a third voltage rail and the second voltage rail;
a second DC chopper directly connected to the third voltage rail and to the second voltage rail and comprising a second dump resistor directly connected to the second voltage rail and to a second node between a third controllable chopper transistor and a fourth controllable chopper transistor of the second DC chopper, wherein the second DC chopper further comprises a diode connected in parallel with the second dump resistor and the third controllable chopper transistor of the second DC chopper; and
a second cell capacitor directly connected to the first third voltage rail and to the second voltage rail in parallel to the second DC chopper, wherein the first dump resistor and the second dump resistor are directly connected together in series at the second voltage rail.
2. The MMC according to claim 1 , wherein at least two the first main transistor and the second main transistor are connected in parallel with the first DC chopper.
3. The MMC according to claim 1 , further comprising a bleed resistor connected between the first voltage rail and the second voltage rail and in parallel with the first DC chopper.
4. A method for de-energizing a modular multilevel converter (MMC), the method comprising:
receiving an instruction to de-energize a phase leg of the MMC, the MMC comprising a plurality of MMC cells;
configuring power transistors in the plurality of MMC cells of the phase leg to guide current through a plurality of direct current (DC) choppers integrated into the plurality of MMC cells; and
determining a period of time to de-energize the MMC using resistors in the plurality of DC choppers, the MMC comprising:
a first MMC cell of the plurality of MMC cells comprising:
a first main transistor and a second main transistor connected in series between a first voltage rail and a second voltage rail;
a first DC chopper of the plurality of DC choppers directly connected to the first voltage rail and to the second voltage rail and comprising a first dump resistor directly connected to the second voltage rail and to a first node between a first controllable chopper transistor and a second controllable chopper transistor of the first DC chopper, wherein the first DC chopper further comprises a diode connected in parallel with the first dump resistor and the second controllable chopper transistor of the first DC chopper; and
a first cell capacitor directly connected to the first voltage rail and to the second voltage rail in parallel to the first DC chopper; and
a second MMC cell of the plurality of MMC cells comprising:
a third main transistor and a fourth main transistor connected in series between a third voltage rail and the second voltage rail;
a second DC chopper of the plurality of DC choppers directly connected to the third voltage rail and to the second voltage rail and comprising a second dump resistor directly connected to the second voltage rail and to a second node between a third controllable chopper transistor and a fourth controllable chopper transistor of the second DC chopper, wherein the second DC chopper further comprises a diode connected in parallel with the second dump resistor and the third controllable chopper resistor of the second DC chopper; and
a second cell capacitor directly connected to the third voltage rail and to the second voltage rail in parallel to the second DC chopper, wherein the first dump resistor and the second dump resistor are directly connected together in series at the second voltage rail.
5. A modular multilevel converter (MMC) power module, comprising:
a first set of at least two main transistors connected in series between a first voltage rail and a second voltage rail;
a second set of at least two main transistors connected in series between a third voltage rail and the second voltage rail;
a first direct current (DC) chopper directly connected to the first voltage rail and to the second voltage rail, the first DC chopper comprising a first controllable chopper transistor directly connected to the first voltage rail, a second controllable chopper transistor directly connected to the second voltage rail, and a first dump resistor directly connected to the second voltage rail and to a first node between the first controllable chopper transistor and the second controllable chopper transistor of the first DC chopper, wherein the first DC chopper further comprises a diode connected in parallel with the first dump resistor and the second controllable chopper transistor of the first DC chopper;
a first cell capacitor directly connected to the first voltage rail and to the second voltage rail in parallel to the first DC chopper;
a second DC chopper directly connected to the third voltage rail and to the second voltage rail, the second DC chopper comprising a third controllable chopper transistor directly connected to the second voltage rail, a fourth controllable chopper transistor directly connected to the third voltage rail, and a second dump resistor directly connected to the second voltage rail and to a second node between the third controllable chopper transistor and the fourth controllable chopper transistor of the second DC chopper, wherein the second DC chopper further comprises a diode connected in parallel with the second dump resistor and the third controllable chopper transistor of the second DC chopper; and
a second cell capacitor directly connected to the second voltage rail and to the third voltage rail in parallel to the second DC chopper, wherein the first dump resistor and the second dump resistor are directly connected together in series at the second voltage rail.
6. The MMC power module according to claim 5 , wherein the first set of at least two main transistors is connected in parallel with the first DC chopper.
7. The MMC power module according to claim 5 , further comprising a bleed resistor connected between the first voltage rail and the second voltage rail and in parallel with the first DC chopper.