IP Library Granted Patent US 11,565,508
Granted Patent B2
US 11,565,508 · App. 17/042,680 · Granted Jan 31, 2023

Moisture barrier laminate

Inventors: Misato Kawanishi (Yokohama, JP); Shunya Nangou (Yokohama, JP); Shinpei Okuyama (Yokohama, JP); Keisuke Takayama (Yokohama, JP); Yoshihiro Ohta (Yokohama, JP)
Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
B32B27/08B32B7/02B32B27/20B32B27/306B32B27/308B32B27/40B32B2250/03B32B2250/24B32B2264/1021B32B2264/1022B32B2264/1023B32B2264/1024B32B2307/302B32B2307/412B32B2307/7244B32B2307/7246B32B2307/732B32B2333/08B32B2367/00B32B2375/00B32B2457/206B32B2457/208
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Quick Facts
Patent No.
US 11,565,508
App. No.
17/042,680
Granted
Jan 31, 2023
Kind
B2
Abstract

An object of the present invention is to provide a moisture barrier laminate including a moisture trapping layer that maximizes its moisture trapping performance and exhibits an excellent moisture barrier property. The moisture barrier laminate of the present invention includes a gas barrier film substrate A having a gas barrier layer a 1 and a moisture trapping layer B formed on the film substrate A as a base. On a surface of the moisture trapping layer B opposite to the film substrate A, a protective resin layer C having a moisture permeability in a range of 4.0×10 to 5.0×10 4 g/m 2 ·day at 40° C. and 90% RH is laminated.

Claims (19)

1. A moisture barrier laminate comprising:

a gas barrier film substrate A as a base having a gas barrier layer;

a moisture trapping layer B formed on the film substrate A;

a protective resin layer C having a moisture permeability in a range of 4.0×10 to 5.0×10 4 g/m 2 /day at 40° C. and 90% RH, the protective resin layer C being laminated on a surface of the moisture trapping layer B opposite to the film substrate A; and

a desiccant sheet adhered onto a surface of the protective resin layer C opposite the moisture trapping layer B,

wherein the desiccant sheet is adhered onto the protective resin layer C via an adhesive, and

the adhesive has a moisture permeability higher than that of the protective resin layer C, and exhibits an adhering force of not more than 0.3 N/25 mm to the protective resin layer C.

2. The moisture barrier laminate according to claim 1 , wherein the moisture trapping layer B keeps a water content of not more than 0.15 g/g in a measurement at 230° C. in accordance with JIS-7251.

3. The moisture barrier laminate according to claim 1 , wherein the moisture trapping layer B contains a hygroscopic polymer.

4. The moisture barrier laminate according to claim 1 , wherein the moisture trapping layer B comprises a hygroscopic matrix of an ionic polymer in which a moisture absorbent having an ultimate humidity lower than the ultimate humidity of the matrix is dispersed.

5. The moisture barrier laminate according to claim 1 , wherein the ionic polymer contained in the moisture trapping layer B is a cationic polymer.

6. The moisture barrier laminate according to claim 1 , wherein the protective resin layer C is formed of an acrylic resin, a urethane resin or a polyester resin.

7. The moisture barrier laminate according to claim 1 , wherein the protective resin layer C has a thickness in a range of 0.1 to 15 μm.

8. The moisture barrier laminate according to claim 1 , wherein the protective resin layer C comprises a particulate metal oxide blended as a refractive index modifier.

9. The moisture barrier laminate according to claim 8 , wherein the metal oxide is silica, alumina, titania or zirconia.

10. The moisture barrier laminate according to claim 8 , wherein a transparent conductive film is provided on the protective resin layer C.

11. An electronic device member comprising the moisture barrier laminate according to claim 1 .

12. The moisture barrier laminate according to claim 1 , wherein the desiccant sheet comprises a hygroscopic resin layer in which a desiccant is dispersed, and a surface protective resin layer; and wherein the hygroscopic resin layer faces the protective resin layer C.

13. The moisture barrier laminate according to claim 1 , wherein the desiccant sheet is peelably adhered onto the protective resin layer C.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2020
From: KAWANISHI, MISATO; NANGOU, SHUNYA; OKUYAMA, SHINPEI; TAKAYAMA, KEISUKE; OHTA, YOSHIHIRO
To: TOYO SEIKAN GROUP HOLDINGS, LTD.
Reel/Frame 054367/0722 →
Priority Claims (1)
JP JP2018-065053 · Mar 29, 2018 · national
Continuity (1)
Related Publication 20210122147A1 · Apr 29, 2021