IP Library Granted Patent US 11,568,935
Granted Patent B2
US 11,568,935 · App. 17/329,317 · Granted Jan 31, 2023

Semiconductor storage device

Inventors: Kazuhiko Satou (Yokohama, JP); Ryo Fukuda (Yokohama, JP); Masaru Koyanagi (Ota, JP); Kensuke Yamamoto (Yokohama, JP); Masato Dome (Yokohama, JP); Kei Shiraishi (Kawasaki, JP); Junya Matsuno (Yokohama, JP); Kenro Kubota (Fujisawa, JP)
Assignee: Kioxia Corporation
G11C16/0483G11C16/26H03K19/0005H03K19/20
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Quick Facts
Patent No.
US 11,568,935
App. No.
17/329,317
Granted
Jan 31, 2023
Kind
B2
Abstract

A semiconductor storage device including an output pad, a first circuit connected to the output pad, a second circuit connected to the first circuit, a third circuit configured to output a first setting signal for controlling the first circuit accordance with a characteristic variation of the first circuit, and a fourth circuit configured to generate a second setting signal for controlling the second circuit in accordance with the first setting signal received from the third circuit and output the second setting signal to the second circuit.

Claims (45)

1. A semiconductor storage device comprising:

an output pad;

a first circuit connected to the output pad;

a second circuit connected to the first circuit;

a third circuit configured to output a first setting signal for controlling the first circuit in accordance with a characteristic variation of the first circuit; and

a fourth circuit configured to generate a second setting signal for controlling the second circuit in accordance with the first setting signal received from the third circuit and output the second setting signal to the second circuit.

2. The semiconductor storage device according to claim 1 , wherein the second circuit controls the first circuit.

3. The semiconductor storage device according to claim 1 , wherein

the first setting signal adjusts an output resistance of the first circuit, and

the second setting signal adjusts an output timing of the first circuit.

4. The semiconductor storage device according to claim 1 , further comprising a temperature sensor,

wherein the fourth circuit adjusts the second setting signal based on information related to a temperature output from the temperature sensor.

5. The semiconductor storage device according to claim 1 , further comprising a detection circuit configured to detect a supply voltage, a voltage having the same magnitude with the supply voltage being supplied to the first circuit,

wherein the fourth circuit adjusts the second setting signal based on information related to the supply voltage output from the detection circuit.

6. The semiconductor storage device according to claim 1 , wherein

the first circuit has m output transistors (m is a natural number), and

the first setting signal controls ON/OFF of each of the m output transistors.

7. The semiconductor storage device according to claim 6 , wherein

the second circuit has m driver circuits configured to drive the m output transistors, respectively, and

the second setting signal controls an output waveform of each of the m driver circuits.

8. The semiconductor storage device according to claim 7 , wherein

each of the m output transistors includes a variable resistance transistor, and

the second setting signal controls a resistance of the variable resistance transistor in ON state.

9. The semiconductor storage device according to claim 1 , further comprising

a fifth circuit connected to the second circuit, wherein

the fifth circuit drives the second circuit in accordance with output-subject data and the first setting signal,

the second circuit drives the first circuit in accordance with a first drive signal from the fifth circuit and the second setting signal, and

the first circuit drives the output pad in accordance with a second drive signal from the second circuit.

10. The semiconductor storage device according to claim 9 , wherein

each of the output pad, the first circuit, the second circuit and the fifth circuit is provided in plurality,

the first circuits are connected to the output pads, respectively,

the second circuits are connected to the first circuits, respectively, and

the fifth circuits are connected to the second circuits, respectively.

11. The semiconductor storage device according to claim 10 , wherein

each of the fifth circuits includes

a first NAND gate which receive a corresponding one of the output-subject data and a timing control signal, and

a second NAND gate which receive an output signal from the first NAND gate and a corresponding one of the first setting signals, and output the first drive signal to the second circuit.

12. The semiconductor storage device according to claim 11 , wherein

each of the second circuits includes

a driver circuit configured to output the second drive signal to the first circuit, and

a variable resistance transistor connected to one end of the driver circuit and configured to receive the second control signal.

13. The semiconductor storage device according to claim 10 , further comprising a memory cell array including a plurality of memory cells,

wherein the firth circuits are driven in accordance with data read out from the memory cells, respectively.

14. The semiconductor storage device according to claim 13 , further comprising a temperature sensor configured to output a temperature corresponding to a temperature of the memory cell array,

wherein the fourth circuit adjusts the second setting signal based on a temperature code output from the temperature sensor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2021
From: SATOU, KAZUHIKO; FUKUDA, RYO; KOYANAGI, MASARU; YAMAMOTO, KENSUKE; DOME, MASATO; SHIRAISHI, KEI; MATSUNO, JUNYA; KUBOTA, KENRO
To: KIOXIA CORPORATION
Reel/Frame 058304/0619 →
Priority Claims (1)
JP JP2020-139304 · Aug 20, 2020 · national
Continuity (1)
Related Publication 20220059165A1 · Feb 24, 2022