Semiconductor apparatus having first and second bonding members, display apparatus, photoelectric conversion apparatus, electronic device, illumination apparatus, and moving body

1. A semiconductor apparatus comprising:

an element substrate including an effective pixel region having a plurality of effective pixels on one principal surface side of a first substrate, and a peripheral region positioned around the effective pixel region;

a second substrate; and

a first bonding member and a second bonding member configured to bond the element substrate and the second substrate,

wherein the second bonding member contains a material different from a material of the first bonding member,

wherein, in a planar view with respect to the one principal surface, the second substrate is disposed within the element substrate,

wherein the first bonding member is disposed between the peripheral region and the second substrate,

wherein the second bonding member is provided between the effective pixel region and the second substrate, and

wherein, in a planar view with respect to the one principal surface, at least a part of an end portion of the second substrate is positioned on the first bonding member.

2. The semiconductor apparatus according to claim 1 , wherein at least one of the first bonding member and the second bonding member is provided over a region having an area of ⅓ or more of an area of a region of the element substrate that does not overlap the second substrate, in a planar view with respect to the one principal surface.

3. The semiconductor apparatus according to claim 1 ,

wherein an external connection terminal is disposed on the element substrate,

wherein a structural member is disposed in a portion of the element substrate that does not overlap the second substrate in a planar view with respect to the one principal surface, and

wherein the structural member is disposed between the second bonding member and the external connection terminal in a planar view with respect to the one principal surface.

4. The semiconductor apparatus according to claim 3 , wherein at least one of the first bonding member, the second bonding member, and the structural member is disposed in a region having an area of ⅓ or more of an area of a region of the element substrate that does not overlap the second substrate and excludes the external connection terminal in a planar view with respect to the one principal surface.

5. The semiconductor apparatus according to claim 1 , wherein the first bonding member contains a spacer.

6. The semiconductor apparatus according to claim 5 , wherein the structural member has a thickness of double or more of a particle diameter of the spacer.

7. The semiconductor apparatus according to claim 5 , wherein a particle diameter of the spacer contained in the first bonding member is 1 to 50 μm.

8. The semiconductor apparatus according to claim 1 , wherein the second bonding member does not contain a spacer.

9. The semiconductor apparatus according to claim 1 , wherein an elasticity modulus of the first bonding member is higher than an elasticity modulus of the second bonding member.

10. The semiconductor apparatus according to claim 1 , wherein an elasticity modulus of the first bonding member is 500 MPa or more.

11. The semiconductor apparatus according to claim 1 , wherein an elasticity modulus of the second bonding member is 100 MPa or less.

12. The semiconductor apparatus according to claim 1 , wherein the first bonding member covers a part of a side surface of the second substrate.

13. The semiconductor apparatus according to claim 1 ,

wherein, in a planar view with respect to the one principal surface, the element substrate has a polygonal shape, and

wherein, in a planar view of one principal surface of the element substrate, the first bonding member includes two portions separated at a corner portion of the second substrate.

14. The semiconductor apparatus according to claim 1 , wherein, in a planar view with respect to the one principal surface, the second bonding member extends up to a portion of the element substrate that does not overlap the second substrate.

15. The semiconductor apparatus according to claim 1 ,

wherein an insulating layer covering at least a part of the peripheral region and the effective pixel region is disposed, and

wherein the first bonding member is provided on the insulating layer in a portion of the element substrate that does not overlap the second substrate in a planar view with respect to the one principal surface.

16. The semiconductor apparatus according to claim 1 ,

wherein at least one of the plurality of effective pixels includes an organic electroluminescence (EL) element, and a transistor connected to the organic EL element.

17. An illumination apparatus comprising:

a light source including the semiconductor apparatus according to claim 1 ; and

a light diffusion unit or an optical filter configured to let through light emitted by the light source,

wherein at least one of the plurality of effective pixels includes an organic EL element.

18. A moving body comprising:

an illumination device including the semiconductor apparatus according to claim 1 ; and

a fuselage on which the illumination device is provided,

wherein at least one of the plurality of effective pixels includes an organic EL element.

19. A photoelectric conversion apparatus comprising:

an optical unit including a plurality of lenses;

an image sensor configured to receive light having passed through the optical unit; and

a display unit configured to display an image captured by the image sensor,

wherein the display unit includes a semiconductor apparatus including

an element substrate including an effective pixel region having a plurality of effective pixels on one principal surface side of a first substrate, and a peripheral region positioned around the effective pixel region,

a second substrate, and

a first bonding member and a second bonding member configured to bond the element substrate and the second substrate,

wherein the second bonding member contains a material different from a material of the first bonding member,

wherein, in a planar view with respect to the one principal surface, the second substrate is disposed within the element substrate,

wherein the first bonding member is disposed between the peripheral region and the second substrate,

wherein the second bonding member is provided between the effective pixel region and the second substrate, and

wherein, in a planar view with respect to the one principal surface, at least a part of an end portion of the second substrate is positioned on the first bonding member, and

wherein at least one of the plurality of effective pixels includes an organic EL element.

20. An electronic device comprising:

a display unit including a semiconductor apparatus including

an element substrate including an effective pixel region having a plurality of effective pixels on one principal surface side of a first substrate, and a peripheral region positioned around the effective pixel region,

a second substrate, and

a first bonding member and a second bonding member configured to bond the element substrate and the second substrate,

wherein the second bonding member contains a material different from a material of the first bonding member,

wherein, in a planar view with respect to the one principal surface, the second substrate is disposed within the element substrate,

wherein the first bonding member is disposed between the peripheral region and the second substrate,

wherein the second bonding member is provided between the effective pixel region and the second substrate, and

wherein, in a planar view with respect to the one principal surface, at least a part of an end portion of the second substrate is positioned on the first bonding member;

a casing on which the display unit is provided; and

a communication unit provided in the casing and configured to communicate with an external device,

wherein at least one of the plurality of effective pixels includes an organic EL element.