Resin composition and article made therefrom
A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and 20 parts by weight to 80 parts by weight of a polyolefin resin; the polyolefin resin includes styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
1. A resin composition, comprising:
(A) 100 parts by weight of a vinyl-containing polyphenylene ether resin;
(B) 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and
(C) 20 parts by weight to 80 parts by weight of a polyolefin resin, which comprises styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof;
wherein, in Formula (1),
Y is
and X comprises X1, X2, X3, X4 or X5, wherein X1 to X5 are shown below:
R 1 to R 4 are each an allyl group.
2. The resin composition of claim 1 , wherein the vinyl-containing polyphenylene ether resin comprises a vinylbenzyl-containing biphenyl polyphenylene ether resin, a methacrylate-containing polyphenylene ether resin, a vinylbenzyl-containing bisphenol A polyphenylene ether resin, a chain-extended vinyl-containing polyphenylene ether resin or a combination thereof.
3. The resin composition of claim 1 , characterized by not comprising an ethylene-propylene-diene terpolymer.
4. The resin composition of claim 1 , further comprising a maleimide resin, a bis(vinylphenyl) compound, an acrylate compound or a combination thereof.
5. The resin composition of claim 1 , further comprising flame retardant, inorganic filler, curing accelerator, polymerization inhibitor, solvent, silane coupling agent, coloring agent, toughening agent, core-shell rubber or a combination thereof.
6. An article made from the resin composition of claim 1 , comprising a prepreg, a resin film, a laminate or a printed circuit board.
7. The article of claim 6 , having a difference of glass transition temperature calculated according to a glass transition temperature as measured by reference to IPC-TM-650 2.4.24.4 of less than or equal to 10° C.
8. The article of claim 6 , having a difference rate of dissipation factor calculated according to a dissipation factor as measured by reference to JIS C2565 at 10 GHz of less than or equal to 134%.
9. The article of claim 6 , having a comparative tracking index as measured by reference to ASTM D3638 of greater than or equal to 500V.
10. The article of claim 6 , having a copper foil peeling strength as measured by reference to IPC-TM-650 2.4.8 of greater than or equal to 3.0 lb/in.