Memory system
According to the one embodiment, a memory system includes a semiconductor memory device and a memory controller. The semiconductor memory device includes: first and second memory cells stacked above a substrate; a first word line coupled to the first and second memory cells; a first bit line coupled to the first memory cell; and a second bit line coupled to the second memory cell. A first state read operation includes a first read operation for reading data from the first memory cell and a second read operation for reading data from the second memory cell. A first read voltage is applied to the first word line during a first period for executing the first read operation, and a second read voltage is applied to the first word line during a second period for executing the second read operation.
1. A memory system comprising:
a semiconductor memory device; and
a memory controller configured to control a read operation in the semiconductor memory device,
wherein the semiconductor memory device includes:
first and second memory cells stacked above a substrate;
a first word line coupled to the first and second memory cells;
a first bit line coupled to the first memory cell; and
a second bit line coupled to the second memory cell,
a first state read operation includes a first read operation for reading data from the first memory cell and a second read operation for reading data from the second memory cell, and
in the first state read operation,
a first read voltage is applied to the first word line during a first period for executing the first read operation, and
a second read voltage differing from the first read voltage is applied to the first word line during a second period for executing the second read operation.
2. The memory system according to claim 1 , wherein
each of the first and second memory cells is capable of holding data of a plurality of bits,
when reading 1-bit data from each of the first and second memory cells, at least the first state read operation and a second state read operation are executed,
the second state read operation includes a third read operation for reading data from the first memory cell and a fourth read operation for reading data from the second memory cell, and
in the second state read operation,
a third read voltage is applied to the first word line during a third period for executing the third read operation,
a fourth read voltage differing from the third read voltage is applied to the first word line during a fourth period for executing the fourth read operation, and
a first voltage difference between a fifth read voltage that is predetermined for the first state read operation and the first read voltage, a second voltage difference between the fifth read voltage and the second read voltage, a third voltage difference between a sixth read voltage that is predetermined for the second state read operation and the third read voltage, and a fourth voltage difference between the sixth read voltage and the fourth read voltage are smaller than a fifth voltage difference between the fifth read voltage and the sixth read voltage.
3. The memory system according to claim 2 , wherein
the memory controller is configured to transmit a first command set that designates the first to fourth voltage differences to the semiconductor memory device.
4. The memory system according to claim 1 , wherein
the semiconductor memory device further includes:
third and fourth memory cells stacked above the substrate; and
a second word line coupled to the third and fourth memory cells,
the third memory cell is coupled to the first memory cell, and
the fourth memory cell is coupled to the second memory cell.
5. The memory system according to claim 4 , wherein
a first voltage higher than the first and second read voltages is applied to the second word line during the first and second periods.
6. The memory system according to claim 1 , wherein
the semiconductor memory device further includes:
fifth and sixth memory cells stacked above the substrate; and
a source line coupled to the first, second, fifth and sixth memory cells,
the first word line is coupled to the fifth and sixth memory cells,
the first bit line is coupled to the fifth memory cell, and
the second bit line is coupled to the sixth memory cell.
7. The memory system according to claim 6 , wherein
the first memory cell and the fifth memory cell are arranged on a same layer, and
the second memory cell and the sixth memory cell are arranged on a same layer.
8. The memory system according to claim 6 , wherein
the semiconductor memory device further includes:
a first transistor coupled to the first bit line and the first memory cell;
a second transistor coupled to the second bit line and the second memory cell;
a third transistor coupled to the first bit line and the fifth memory cell;
a fourth transistor coupled to the second bit line and the sixth memory cell;
a first select gate line coupled to the first and second transistors; and
a second select gate line coupled to the fifth and sixth transistors.
9. The memory system according to claim 8 , wherein
a second voltage is applied to the first select gate line during the first and second periods, and
a third voltage lower than the second voltage is applied to the second select gate line during the first and second periods.
10. The memory system according to claim 1 , wherein
the semiconductor memory device further includes:
seventh and eighth memory cells stacked above the substrate;
a third bit line coupled to the seventh memory cell; and
a fourth bit line coupled to the eighth memory cell,
the first word line is coupled to the seventh and eighth memory cells,
the first memory cell and the seventh memory cell are arranged on a same layer, and
the second memory cell and the eighth memory cell are arranged on a same layer.
11. The memory system according to claim 1 , wherein
the first memory cell includes;
a semiconductor layer coupled to the first bit line, and
a charge storage layer provided between the first word line and the semiconductor layer.
12. A memory system comprising:
a semiconductor memory device; and
a memory controller configured to control a read operation in the semiconductor memory device,
wherein the semiconductor memory device includes:
first and second memory cells stacked above a substrate;
a first word line coupled to the first and second memory cells;
a first bit line coupled to the first memory cell; and
a second bit line coupled to the second memory cell, and
in the read operation of the first and second memory cells corresponding to a first state, a first sense timing at which data is read from the first memory cell via the first bit line differs from a second sense timing at which data is read from the second memory cell via the second bit line.
13. The memory system according to claim 12 , wherein
the memory controller is configured to transmit a first command set that designates the first and second sense timings to the semiconductor memory device.
14. A memory system comprising:
a semiconductor memory device; and
a memory controller configured to control a read operation in the semiconductor memory device,
wherein the semiconductor memory device includes:
first and second memory cells stacked above a substrate;
a first word line coupled to the first and second memory cells;
a first bit line coupled to the first memory cell; and
a second bit line coupled to the second memory cell, and
in the read operation of the first and second memory cells corresponding to a first state, a first voltage is applied to the first bit line, and a second voltage differing from the first voltage is applied to the second bit line.
15. The memory system according to claim 14 , wherein
the memory controller is configured to transmit a first command set that designates the first and second voltages to the semiconductor memory device.
16. The memory system according to claim 14 , wherein
in the read operation of the first and second memory cells corresponding to the first state, a first sense timing at which data is read from the first memory cell via the first bit line differs from a second sense timing at which data is read from the second memory cell via the second bit line.
17. The memory system according to claim 16 , wherein
in the read operation of the first and second memory cells corresponding to the first state, a third voltage is applied to the first bit line, and a fourth voltage differing from the third voltage is applied to the second bit line.
18. A memory system comprising:
a semiconductor memory device; and
a memory controller configured to control a read operation in the semiconductor memory device,
wherein the semiconductor memory device includes:
first and second memory cells stacked above a substrate;
a first word line coupled to the first and second memory cells;
a first bit line coupled to the first memory cell;
a second bit line coupled to the second memory cell;
a first source line coupled to the first memory cell; and
a second source line coupled to the second memory cell, and
in the read operation of the first and second memory cells corresponding to a first state, a first voltage is applied to the first source line, and a second voltage differing from the first voltage is applied to the second source line.
19. The memory system according to claim 17 , wherein
the memory controller is configured to transmit a first command set that designates the first and second voltages to the semiconductor memory device.