IP Library › Granted Patent US 11,574,826
Granted Patent B2
US 11,574,826 · App. 16/922,874 · Granted Feb 7, 2023

High-density substrate processing systems and methods

Inventors: Jason M. Schaller (Austin, TX); Steve Hongkham (San Ramon, CA); Charles T. Carlson (Austin, TX); Tuan A. Nguyen (San Jose, CA); Swaminathan T. Srinivasan (Pleasanton, CA); Khokan Chandra Paul (Cupertino, CA)
Assignee: Applied Materials, Inc.
H01L21/6719H01L21/67167H01L21/68707H01L21/68742
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Quick Facts
Patent No.
US 11,574,826
App. No.
16/922,874
Granted
Feb 7, 2023
Kind
B2
Abstract

Exemplary substrate processing systems may include a factory interface and a load lock coupled with the factory interface. The systems may include a transfer chamber coupled with the load lock. The transfer chamber may include a robot configured to retrieve substrates from the load lock. The systems may include a chamber system positioned adjacent and coupled with the transfer chamber. The chamber system may include a transfer region laterally accessible to the robot. The transfer region may include a plurality of substrate supports disposed about the transfer region. Each substrate support of the plurality of substrate supports may be vertically translatable. The transfer region may also include a transfer apparatus rotatable about a central axis and configured to engage substrates and transfer substrates among the plurality of substrate supports. The chamber system may also include a plurality of processing regions vertically offset and axially aligned with an associated substrate support.

Claims (24)

1. A substrate processing system comprising:

a factory interface;

a load lock coupled with the factory interface;

a transfer chamber coupled with the load lock, wherein the transfer chamber comprises a robot configured to retrieve substrates from the load lock; and

a chamber system positioned adjacent to and coupled with the transfer chamber, the chamber system comprising:

a transfer region laterally accessible to the robot, wherein the transfer region comprises:

a plurality of substrate supports disposed about the transfer region, each substrate support of the plurality of substrate supports vertically translatable along a central axis of the substrate support between a first position and a second position,

a transfer apparatus rotatable about an additional central axis and configured to engage the substrates and transfer the substrates among the plurality of substrate supports, and

a plurality of processing regions vertically offset from the transfer region, each processing region of the plurality of processing regions axially aligned with an associated substrate support of the plurality of substrate supports, wherein each processing region of the plurality of processing regions is defined from below by an associated substrate support in the second position;

wherein the transfer apparatus comprises an end effector having a plurality of arms being positionable in a recessed position in which the end effector does not interfere with vertical translation of the plurality of substrate supports; and

wherein the second position is vertically above the end effector.

2. The substrate processing system of claim 1 , wherein the plurality of substrate supports within the transfer region of the chamber system comprises at least four substrate supports.

3. The substrate processing system of claim 1 , wherein each processing region of the plurality of processing regions is fluidly coupled with the transfer region and fluidly isolated from above from each other processing region of the plurality of processing regions.

4. The substrate processing system of claim 1 , further comprising at least two additional chamber systems positioned adjacent and coupled with the transfer chamber.

5. The substrate processing system of claim 4 , wherein each chamber system defines two accesses along a surface of a housing of the transfer region adjacent the transfer chamber, wherein a first access of the two accesses is aligned with a first substrate support of the plurality of substrate supports, and wherein a second access of the two accesses is aligned with a second substrate support of the plurality of substrate supports.

6. The substrate processing system of claim 5 , wherein the robot comprises two arms configured to deliver or retrieve a first substrate from the first substrate support through the first access and simultaneously deliver or retrieve a second substrate from the second substrate support through the second access.

7. The substrate processing system of claim 1 , further comprising at least three additional chamber systems positioned adjacent and coupled with the transfer chamber.

8. The substrate processing system of claim 7 , wherein each chamber system defines one access along a surface of a housing of the transfer region adjacent the transfer chamber, wherein the one access is aligned with a first substrate support of the plurality of substrate supports.

9. The substrate processing system of claim 8 , wherein the robot comprises one arm configured to deliver or retrieve a substrate from the first substrate support through the one access.

10. The substrate processing system of claim 9 , wherein the one arm of the robot extends through the one access of each chamber system at an angle other than perpendicular to the one access.

11. The substrate processing system of claim 1 , wherein the chamber system is offset from the transfer chamber such that at least one of the plurality of processing regions is laterally outward of a boundary of the transfer chamber in two orthogonal directions.

12. The substrate processing system of claim 1 , further comprising an additional chamber system, wherein the chamber system and the additional chamber system are disposed about a same side of the transfer chamber, with a center of the chamber system and a center of the additional chamber system each being laterally offset from a center of the transfer chamber.

13. The substrate processing system of claim 1 , wherein the transfer region defines an access through which a light source is disposed.

14. The substrate processing system of claim 1 , wherein the transfer region defines an access through which an aligner is disposed.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2021
From: SCHALLER, JASON M.; HONGKHAM, STEVE; CARLSON, CHARLES T.; NGUYEN, TUAN A.; SRINIVASAN, SWAMINATHAN T.; PAUL, KHOKAN CHANDRA
To: APPLIED MATERIALS, INC.
Reel/Frame 055084/0951 →
Continuity (2)
Provisional Application 62873503 · Jul 12, 2019
Related Publication 20210013055A1 · Jan 14, 2021