Ceramic laminated substrate, module, and method of manufacturing ceramic laminated substrate
Provided is a ceramic laminated substrate which is formed on an electronic component to be mounted and is less likely to cause mounting defects even if there is irregularity in the height of solders. The ceramic laminated substrate includes: a ceramic laminate on which ceramic layers are laminated; via conductors; terminal electrodes; and a land electrode. The land electrode has a first land electrode and a second land electrode that are used to join different terminal electrodes of a single electronic component. The area of the first land electrode is smaller than the area of the second land electrode, and the first land electrode has a bump electrode and a plating layer, the second land electrode has a membrane electrode and plating layers, and the height of the first land electrode is formed higher than the height of the second land electrode.
1. A ceramic laminated substrate comprising:
a ceramic laminate having a first main surface and a second main surface, and including a plurality of laminated ceramic layers;
via conductors provided inside the laminate;
a terminal electrode provided on the first main surface; and
a land electrode for mounting an electronic component, the land electrode being provided on the second main surface,
wherein:
the land electrode has at least one first land electrode and at least one second land electrode, the second land electrode having a larger area than the first land electrode;
the first land electrode has a bump electrode provided on one of the via conductors exposed from the second main surface of the laminate, and a first plating layer provided on a surface of the bump electrode;
the second land electrode has a membrane electrode provided on at least one of other ones of the via conductors exposed from the second main surface of the laminate and having a bonding surface to one of the ceramic layers laminated on a side closest to the second main surface of the laminate, and a second plating layer provided on a surface of the membrane electrode;
a height of the first land electrode is higher than a height of the second land electrode; and
a height of the bump electrode is higher than a height of the membrane electrode.
2. The ceramic laminated substrate according to claim 1 , wherein a main component of the one of the via conductors provided under the first land electrode is identical with a main component of the bump electrode of the first land electrode.
3. The ceramic laminated substrate according to claim 2 , wherein components of the one of the via conductors provided under the first land electrode are identical with components of the bump electrode of the first land electrode.
4. The ceramic laminated substrate according to claim 1 , wherein the membrane electrode of the second land electrode includes a bonding strength improving agent added to improve a bonding strength to the one of the ceramic layers laminated on the side closest to the second main surface of the laminate.
5. The ceramic laminated substrate according to claim 4 , wherein the bonding strength improving agent is ceramic powder containing a main component identical with a main component of the one of the ceramic layers laminated on the side closest to the second main surface of the laminate.
6. The ceramic laminated substrate according to claim 1 , wherein, on the second main surface of the laminate, the first land electrode has a circular planar shape and the second land electrode has an oval planar shape.
7. A module comprising:
the ceramic laminated substrate according to claim 1 ; and
an electronic component mounted on the ceramic laminated substrate,
wherein:
the electronic component is a semiconductor device including a plurality of terminal electrodes; and
at least one of the terminal electrodes of the semiconductor device is bonded to the first land electrode, and at least one of other ones of the terminal electrodes of the semiconductor device is bonded to the second land electrode.
8. A method of manufacturing the ceramic laminated substrate according to claim 1 , comprising the steps of:
producing a plurality of first ceramic green sheets and a second ceramic green sheet, the second ceramic green sheet having a sintering temperature higher than a sintering temperature of each of the first ceramic green sheets;
forming a first through hole for forming a via conductor in the first ceramic green sheets, and filling the first through hole with a conductive paste;
forming a second through hole for forming a bump electrode in the second ceramic green sheet, and filling the second through hole with a conductive paste;
laminating the plurality of the first ceramic green sheets and further laminating at least one layer of the second ceramic green sheet on the plurality of the first ceramic green sheets, and producing an unfired ceramic laminate;
sintering the unfired ceramic laminate at a temperature higher than the sintering temperature of each of the first ceramic green sheets and lower than the sintering temperature of the second ceramic green sheet, and producing a composite laminate including the unsintered second ceramic green sheet laminated on the ceramic laminate having the plurality of the sintered first ceramic green sheets; and
removing the unsintered second ceramic green sheet from the composite laminate,
wherein the conductive paste filled in the second through hole formed in the second ceramic green sheet is fired to form the bump electrode.
9. The ceramic laminated substrate according to claim 2 , wherein, on the second main surface of the laminate, the first land electrode has a circular planar shape and the second land electrode has an oval planar shape.
10. The ceramic laminated substrate according to claim 3 , wherein, on the second main surface of the laminate, the first land electrode has a circular planar shape and the second land electrode has an oval planar shape.
11. The ceramic laminated substrate according to claim 4 , wherein, on the second main surface of the laminate, the first land electrode has a circular planar shape and the second land electrode has an oval planar shape.
12. The ceramic laminated substrate according to claim 5 , wherein, on the second main surface of the laminate, the first land electrode has a circular planar shape and the second land electrode has an oval planar shape.
13. A module comprising:
the ceramic laminated substrate according to claim 2 ; and
an electronic component mounted on the ceramic laminated substrate,
wherein:
the electronic component is a semiconductor device including a plurality of terminal electrodes; and
at least one of the terminal electrodes of the semiconductor device is bonded to the first land electrode, and at least one of other ones of the terminal electrodes of the semiconductor device is bonded to the second land electrode.
14. A module comprising:
the ceramic laminated substrate according to claim 3 ; and
an electronic component mounted on the ceramic laminated substrate,
wherein:
the electronic component is a semiconductor device including a plurality of terminal electrodes; and
at least one of the terminal electrodes of the semiconductor device is bonded to the first land electrode, and at least one of other ones of the terminal electrodes of the semiconductor device is bonded to the second land electrode.
15. A module comprising:
the ceramic laminated substrate according to claim 4 ; and
an electronic component mounted on the ceramic laminated substrate,
wherein:
the electronic component is a semiconductor device including a plurality of terminal electrodes; and
at least one of the terminal electrodes of the semiconductor device is bonded to the first land electrode, and at least one of other ones of the terminal electrodes of the semiconductor device is bonded to the second land electrode.
16. A module comprising:
the ceramic laminated substrate according to claim 5 ; and
an electronic component mounted on the ceramic laminated substrate,
wherein:
the electronic component is a semiconductor device including a plurality of terminal electrodes; and
at least one of the terminal electrodes of the semiconductor device is bonded to the first land electrode, and at least one of other ones of the terminal electrodes of the semiconductor device is bonded to the second land electrode.