Radio-frequency module and communication device
A radio-frequency module including a module substrate having a first main surface and a second main surface on opposite sides; a low-noise amplifier disposed on the second main surface; and a power amplifier circuit in a Doherty configuration. The power amplifier including a first phase circuit; a second phase circuit; a carrier amplifier disposed on the first main surface and including an input terminal connected to a first end of the first phase circuit and an output terminal connected to a first end of the second phase circuit; and a peaking amplifier disposed on the first main surface and including an input terminal connected to a second end of the first phase circuit and an output terminal connected to a second end of the second phase circuit.
1. A radio-frequency module comprising:
a module substrate having a first main surface and a second main surface on opposite sides;
a low-noise amplifier disposed on the second main surface;
a power amplifier circuit in a Doherty configuration and including
a first phase circuit;
a second phase circuit;
a carrier amplifier disposed on the first main surface and including an input terminal connected to a first end of the first phase circuit and an output terminal connected to a first end of the second phase circuit; and
a peaking amplifier disposed on the first main surface and including an input terminal connected to a second end of the first phase circuit and an output terminal connected to a second end of the second phase circuit;
a heat-dissipating conductor provided in the module substrate and forming a connection between the first main surface and the second main surface; and
a plurality of external connection terminals disposed on the second main surface, wherein
the heat-dissipating conductor is connected, on the first main surface to a ground electrode of the carrier amplifier and to a ground electrode of the peaking amplifier and is connected, on the second main surface, to a first external connection terminal of the plurality of external connection terminals and placed at ground potential.
2. The radio-frequency module of claim 1 , wherein
the heat-dissipating conductor includes
a first via conductor and a second via conductor that extend perpendicularly to the first and second main surfaces, and
a planar conductor that lies parallel to the first and second main surfaces and is in contact with neither the first main surface nor the second main surface.
3. The radio-frequency module of claim 2 , wherein
when the module substrate is viewed in a plan view, the first via conductor overlaps the carrier amplifier, and the second via conductor overlaps the peaking amplifier.
4. The radio-frequency module of claim 3 , wherein
the first via conductor has a first end connected, on the first main surface, to the ground electrode of the carrier amplifier and has a second end connected, on the second main surface, to the first external connection terminal.
5. The radio frequency module of claim 4 , wherein
the first via conductor, between the first end and the second end, is connected to the planar conductor.
6. The radio frequency module of claim 5 , wherein
the second via conductor has a first end connected, on the first main surface, to the ground electrode of the peaking amplifier and has a second end connected to the planar conductor.
7. The radio-frequency module of claim 1 , wherein
when the module substrate is viewed in a plan view, the carrier amplifier and the peaking amplifier are disposed between the first phase circuit and the second phase circuit.
8. The radio-frequency module of claim 1 , wherein
the carrier amplifier, the peaking amplifier, and the first phase circuit are included in a first semiconductor integrated circuit.
9. The radio-frequency module of claim 8 , wherein
the second phase circuit is not included in the first semiconductor integrated circuit.
10. The radio-frequency module of claim 9 , wherein
the second phase circuit is an integrated passive device.
11. The radio-frequency module of claim 8 , further comprising:
a control circuit configured to control the carrier amplifier and the peaking amplifier, wherein
the control circuit is stacked on the first semiconductor integrated circuit on the first main surface.
12. The radio-frequency module of claim 11 , wherein
when the module substrate is viewed in a plan view, the control circuit does not overlap the carrier amplifier.
13. The radio-frequency module of claim 12 , wherein
when the module substrate is viewed in the plan view, the control circuit does not overlap the peaking amplifier.
14. The radio-frequency module of claim 1 , further comprising:
an antenna connection terminal;
a transmitting filter that allows a transmission signal from the power amplifier circuit to pass therethrough, and
an antenna switch that performs switching between a state in which the antenna connection terminal is connected to the transmitting filter and a state in which the antenna connection terminal is not connected to the transmitting filter.
15. A radio-frequency module comprising:
a module substrate having a first main surface and a second main surface on opposite sides;
a low-noise amplifier disposed on the second main surface;
a power amplifier circuit in a Doherty configuration and including
a first phase circuit;
a second phase circuit;
a carrier amplifier disposed on the first main surface and including an input terminal connected to a first end of the first phase circuit and an output terminal connected to a first end of the second phase circuit; and
a peaking amplifier disposed on the first main surface and including an input terminal connected to a second end of the first phase circuit and an output terminal connected to a second end of the second phase circuit;
an antenna connection terminal;
a transmitting filter that allows a transmission signal from the power amplifier circuit to pass therethrough, and
an antenna switch that performs switching between a state in which the antenna connection terminal is connected to the transmitting filter and a state in which the antenna connection terminal is not connected to the transmitting filter, wherein
the second phase circuit is disposed on the first main surface, and
the antenna switch is disposed on the second main surface.
16. A radio-frequency module comprising:
a module substrate having a first main surface and a second main surface on opposite sides;
a first phase circuit;
a second phase circuit;
a carder amplifier disposed on the first main surface and including an input terminal connected to a first end of the first phase circuit and an output terminal connected to a first end of the second phase circuit,
a peaking amplifier disposed on the first main surface and includes an input terminal connected to a second end of the first phase circuit and an output terminal connected to a second end of the second phase circuit;
a heat-dissipating conductor provided in the module substrate and forming a connection between the first main surface and the second main surface; and
a plurality of external connection terminals disposed on the second main surface, wherein
the heat-dissipating conductor is connected, on the first main surface, to a ground electrode of the carrier amplifier and to a ground electrode of the peaking amplifier and is connected, on the second main surface, to a first external connection terminal of the plurality of external connection terminals.