Semiconductor device with low dark noise
A semiconductor device includes a germanium region, a doped region in the germanium region, wherein the doped region is of a first conductivity type; and a counter-doped region in the germanium region and adjacent to the doped region, wherein the counter-doped region is of a second conductivity type different from the first conductivity type.
1. A semiconductor device, comprising:
a silicon substrate; and
a germanium region formed on the silicon substrate, the germanium region comprising:
a detection region having a first side and a second side opposite to the first side, the detection region configured to receive an optical signal and generate electrical signals comprising electrons and holes;
a first doped region arranged adjacent to the first side of the detection region, wherein the first doped region is n-type and is configured to collect electrons, and wherein the first doped region is coupled to first circuitry configured to collect a portion of the electrons collected by the first doped region;
a counter-doped region at least partially surrounding the first doped region, wherein the counter-doped region is p-type; and
a second doped region arranged adjacent to the second side of the detection region, wherein the second doped region is p-type and is configured to collect holes, and wherein the second doped region is coupled to an electrical ground to discharge a portion of the holes from the second doped region to the electrical ground without passing through the silicon substrate.
2. The semiconductor device of claim 1 , further comprising the first circuitry that comprises a readout circuitry.
3. The semiconductor device of claim 1 , wherein the detection region is intrinsic.
4. The semiconductor device of claim 1 , wherein a peak doping of the first doped region and a peak doping of the second doped region is between 1×10 19 cm −3 to 5×10 21 cm −3 .
5. The semiconductor device of claim 4 , wherein a peak doping of the counter-doped region is between 5×10 18 cm −3 and 5×10 20 cm −3 .
6. The semiconductor device of claim 1 , wherein the semiconductor device is an image sensor.
7. The semiconductor device of claim 6 , wherein the image sensor is configured to operate at a frame rate not more than 1000 frames per second (fps).