Display device and method of manufacturing the same

1. A display device, in which a folding region, a first non-folding region located at a side of the folding region, and a second non-folding region located at another side of the folding region are defined, the display device comprising:

a display module;

a support member disposed on the display module; and

a bonding layer disposed between the display module and the support member,

wherein the support member includes a first support member disposed in the first non-folding region and a part of the folding region, and a second support member disposed in the second non-folding region and a part of the folding region,

the bonding layer is disposed over the folding region, the first non-folding region, and the second non-folding region,

the bonding layer includes a first portion disposed in the first non-folding region, a second portion disposed in the second non-folding region, and a third portion disposed in the folding region, and

an adhesive force of the third portion to the support member is less than each of an adhesive force of the second portion to the first support member and an adhesive force of the second portion to the second support member.

2. The display device of claim 1 ,

wherein the bonding layer further includes a photoinitiator, and

wherein a density of the photoinitiator in the third portion is less than each of a density of the photoinitiator in the first portion and a density of the photoinitiator in the second portion.

3. The display device of claim 2 ,

wherein the photoinitiator reacts with light in a wavelength band of about 200 nm to about 350 nm.

4. The display device of claim 1 ,

wherein the display module includes a display panel and a buffer member disposed between the display panel and the bonding layer,

wherein the buffer member has a thickness in a range of about 100 μm to about 300 μm, and

wherein the bonding layer has a thickness in a range of about 5 μm to about 50 μm.

5. The display device of claim 4 , further including:

a support substrate disposed between the bonding layer and the buffer member,

wherein the support substrate is disposed over the folding region, the first non-folding region, and the second non-folding region, and

wherein the support substrate is in contact with the bonding layer.

6. The display device of claim 5 ,

wherein the support substrate includes polyimide or polyurethane.

7. The display device of claim 5 , further comprising:

an upper bonding layer disposed between the buffer member and the support substrate,

wherein the buffer member and the support substrate are coupled with each other through the upper bonding layer.

8. The display device of claim 1 ,

wherein each of the first support member and the second support member is coupled with the display module through the bonding layer.

9. The display device of claim 8 ,

wherein the first support member and the second support member are spaced apart from each other by a predetermined distance in the folding region.

10. The display device of claim 9 ,

wherein an adhesive force between the third portion and the support member in the folding region is less than an adhesive force between the third portion and the display module in the folding region.

11. The display device of claim 10 ,

wherein when the display device in a folded state, the first support member is attached to the first portion, is separated from the third portion, and the second support member is attached to the second portion, and is separated from the third portion.

12. The display device of claim 1 ,

wherein a modulus of the third portion is greater than each of a modulus of the first portion and a modulus of the second portion.

13. A method of manufacturing a display device, the method comprising:

preparing a target panel, in which a folding region, a first non-folding region located at a side of the folding region, and a second non-folding region located at another side of the folding region are defined, and providing a buffer member on the target panel;

providing a bonding layer on the buffer member;

masking a portion of the bonding layer overlapping the first non-folding region and the second non-folding region; and

irradiating the folding region with an ultraviolet light.

14. The method of claim 13 ,

wherein the providing the bonding layer on the buffer member includes:

providing a bonding layer on a substrate;

providing a release film on the bonding layer; and

removing the substrate and attaching an exposed surface of the bonding layer onto the buffer member.

15. The method of claim 14 , further comprising:

heating the bonding layer after the providing the bonding layer on the substrate and before the providing the release film on the bonding layer.

16. The method of claim 14 , further comprising:

providing a first support member on a surface of the bonding layer in the first non-folding region and providing a second support member on the surface of the bonding layer in the second non-folding region after the attaching the exposed surface of the bonding layer onto the buffer member.

17. The method of claim 13 ,

wherein the providing the bonding layer on the buffer member includes:

providing a bonding layer on a substrate;

providing a release film on the bonding layer; and

attaching the substrate onto the buffer member through an upper bonding layer.

18. The method of claim 13 ,

wherein the bonding layer includes a photoinitiator.

19. The method of claim 18 ,

wherein a density of the photoinitiator in a portion of the bonding layer overlapping the folding region is less than a density of the photoinitiator in the portion of the bonding layer overlapping the first non-folding region and the second non-folding region.

20. The method of claim 18 ,

wherein a modulus of the photoinitiator in a portion of the bonding layer overlapping the folding region is greater than a modulus of the photoinitiator in the portion of the bonding layer overlapping the first non-folding region and the second non-folding region.