IP Library › Granted Patent US 11,582,553
Granted Patent B2
US 11,582,553 · App. 17/242,093 · Granted Feb 14, 2023

Electronic module having transducers radiating ultrasonic waves

Inventors: Chih Lung Lin (Kaohsiung, TW); Kuei-Hao Tseng (Kaohsiung, TW); Kai Hung Wang (Kaohsiung, TW)
Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
H04R1/403G02C11/10H04R1/24H04R1/26H04R3/12H04R2201/401
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,582,553
App. No.
17/242,093
Granted
Feb 14, 2023
Kind
B2
Abstract

An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.

Claims (15)

1. An electronic module, comprising:

a substrate having a first surface and a second surface opposite to the first surface;

a set of transducers disposed adjacent to the first surface of the substrate, wherein the set of transducers are arranged in an array; and

an electronic component disposed adjacent to the second surface of the substrate and configured to control the set of transducers;

wherein the substrate comprises an adjustable substrate and the electronic module further comprising an encapsulant configured to support the adjustable substrate.

2. The electronic module of claim 1 , wherein the electronic component is configured to adjust at least one of a frequency, an amplitude, a phase, and an emission direction of ultrasonic waves radiated by the set of transducers.

3. The electronic module of claim 2 , wherein the electronic component comprises a storage device to store audio data/information to be transmitted through the set of transducers.

4. The electronic module of claim 1 , wherein the electronic component is aligned with the center of the array of the set of transducers.

5. The electronic module of claim 4 , wherein the set of transducers are arranged in a two-dimensional array.

6. The electronic module of claim 5 , wherein ultrasonic waves radiated by the set of transducers have substantially the same phase.

7. The electronic module of claim 6 , wherein a normal line of the electronic component is substantially aligned with a normal line of a transducer of the set of transducers located at the center of the array.

8. The electronic module of claim 1 , further comprising another electronic component configured to control at least another set of transducers.

9. The electronic module of claim 1 , wherein a shape of the encapsulant is defined based on a shape of the adjustable substrate after being adjusted.

10. The electronic module of claim 9 , wherein a lateral surface of the encapsulant is non-coplanar with a lateral surface of the adjustable substrate.

11. The electronic module of claim 1 , wherein the substrate comprises a flexible printed circuit (FPC).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 11, 2021
From: LIN, CHIH LUNG; TSENG, KUEI-HAO; WANG, KAI HUNG
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 056520/0432 →
Continuity (1)
Related Publication 20220345812A1 · Oct 27, 2022