Unsaturated monomers and oligomers free of phenolics
Various embodiments disclosed relate to a resin having a structure of at least one of Formula I and Formula II: In Formula I or Formula II R 1 , R 3 , R 4 , R 5 , and R 6 can each be independently selected from the group consisting of hydrogen and substituted or unsubstituted (C 1 -C 10 )alkyl. R 2 is (C 1 -C 10 ) alkylene. L is a substituted or unsubstituted (C 1 -C 10 )alkylene or (C 3 -C 10 )cycloalkylene. In Formula I or Formula II, n or m is greater than or equal to 0, and wherein the resin has an average molecular weight of less than 10,000 g/mol.
1. A method of making a resin, comprising:
reacting a resin according to Formula III:
with a resin according to Formula IV:
2. The resin of claim 1 , wherein the resin has a reduced potential to release phenolic compounds compared to corresponding resins comprising bisphenol A (BPA).
3. The resin of claim 1 , wherein the resin is substantially free of repeating units derived from bisphenol A.
4. A method of making a resin according to Formula III of claim 1 , the method comprising:
reacting a molecule according to Formula V with a molecule according to Formula VI:
wherein X is selected from the group consisting of F, OH, Cl, Br, and I.
5. The method of claim 4 , wherein Formula VI is:
6. A cured product of a curable composition, the curable composition comprising a compound produced by the method of claim 1 .
7. The cured product of claim 6 , wherein about 1 wt % to about 100 wt % of the curable composition is the structures produced by the method of claim 1 .
8. A method of forming the cured product according to claim 6 , comprising:
curing a curable composition according to claim 6 .
9. The method of forming the cured product of claim 8 , wherein the curable composition further comprises an initiator component.
10. The method of forming the cured product of claim 9 , wherein the initiator component ranges from about 0.1 wt % to about 25 wt % of the curable composition.
11. The method of forming the cured product of claim 8 , wherein the curable composition further comprises a reactive diluent.
12. The method of forming the cured product of claim 11 , wherein the reactive diluent ranges from about 0.01 wt % to about 70 wt % of the curable composition.
13. The method of forming the cured product of claim 8 , wherein the curable composition further comprises an accelerator.
14. The method of forming the cured product of claim 8 , further comprising exposing the curable composition to visible or ultraviolet radiation.