Broadband back mirror for a photonic chip
A semiconductor laser has a mirror formed in a gain chip. The mirror can be placed in the gain chip to provide a broadband reflector to support multiple lasers using the gain chip. The mirror can also be placed in the gain chip to have the semiconductor laser be more efficient or more powerful by changing an optical path length of the gain of the semiconductor laser.
1. A semiconductor device comprising:
a platform, wherein the platform comprises a first waveguide;
a chip, wherein:
the chip is defined by a perimeter;
the chip comprises a second waveguide; and
the second waveguide is optically coupled with the first waveguide;
a wall in the chip, wherein:
the wall defines a portion of a recess in the chip; and
the wall is within the perimeter of the chip;
a coating disposed on the wall, wherein:
the coating comprises a metal and a dielectric;
the dielectric is between the metal and the wall;
the metal forms a mirror in the chip; and
one end of the second waveguide terminates at the wall.
2. The semiconductor device of claim 1 , wherein the metal is aluminum.
3. The semiconductor device of claim 1 , wherein:
the platform comprises silicon; and
the chip comprises a III-V material.
4. The semiconductor device of claim 1 , wherein:
the second waveguide is a ridge waveguide; and
the second waveguide is curved.
5. The semiconductor device of claim 1 , further comprising a semiconductor material configured to guide light between the first waveguide of the platform and the second waveguide of the chip.
6. The semiconductor device of claim 1 , wherein:
the chip is a gain medium for a laser;
the chip has a bandgap; and
the dielectric is transparent to light corresponding to an energy of the bandgap of the chip.
7. The semiconductor device of claim 1 , wherein the dielectric has a thickness between 25 nm and 100 nm.
8. The semiconductor device of claim 1 , further comprising a reflector in the platform, wherein the mirror and the reflector form a resonator cavity for a laser.
9. The semiconductor device of claim 1 , wherein the chip is a gain medium for two or more lasers.
10. A method for fabricating a semiconductor device, the method comprising:
bonding a chip to a platform, wherein:
the platform is made of a semiconductor material;
the platform comprises a first waveguide;
the chip is defined by a perimeter;
the chip comprises a second waveguide; and
the second waveguide is optically aligned with the first waveguide;
etching the chip to form a wall in the chip, wherein:
the wall defines a portion of a recess in the chip; and
the wall is within the perimeter of the chip;
applying a coating to the wall, wherein:
the coating comprises a metal and a dielectric;
the dielectric is between the metal and the wall;
the metal forms a mirror; and
one end of the second waveguide terminates at the wall.
11. The method of claim 10 , wherein etching the chip to form the wall occurs after bonding the chip to the platform.
12. The method of claim 10 , wherein applying the coating comprises applying the metal to the dielectric, after applying the dielectric to the wall.
13. The method of claim 10 , wherein the second waveguide is curved.
14. The method of claim 10 , wherein the metal is aluminum.
15. The method of claim 10 , further comprising forming the perimeter of the chip by dicing a wafer.
16. A device comprising:
a platform comprising a first waveguide;
a chip, wherein the chip comprises a second waveguide, and the chip is defined by a perimeter;
a wall in the chip, wherein:
the wall defines a portion of a recess in the chip; and
the wall is within the perimeter of the chip;
a coating disposed on the wall, wherein:
the coating comprises a metal and a dielectric;
the dielectric is between the metal and the wall;
the metal forms a mirror in the chip;
the second waveguide is optically coupled with the first waveguide; and
an end of the second waveguide terminates at the wall.
17. The device as recited in claim 16 , further comprising:
a platform, wherein:
the platform is made of a first semiconductor material;
the chip is bonded to the platform; and
the chip is made of a second semiconductor material.
18. The device as recited in claim 16 , wherein:
the chip comprises two or more waveguides; and
the two or more waveguides of the chip each have an end that terminates at the mirror.
19. The device as recited in claim 16 , wherein the metal is aluminum.
20. The device as recited in claim 16 , wherein:
the second waveguide is curved.