Structural body and method of manufacturing the same
A structural body according to an embodiment includes a conductive substrate. A main surface of the conductive substrate includes a first region and a second region adjacent to the first region and lower in height than the first region. The first region is provided with one or more recesses having a bottom, a position of which is lower than a position of the second region. A surface region of the conductive substrate on a side of the main surface includes a porous structure at a position between the second region and the one or more recesses.
1. A structural body, comprising:
a conductive substrate containing a semiconductor material; and
an insulating layer, wherein
the conductive substrate has a main surface including a first region and a second region, the second region being adjacent to the first region and lower in height than the first region,
the first region is provided with one or more recesses having a bottom, a position of the bottom being lower than a position of the second region,
the conductive substrate has a surface region on a side of the main surface, the surface region including a porous structure at a position between the second region and the one or more recesses, and
the second region is entirely covered with the insulating layer.
2. The structural body according to claim 1 , wherein
the main surface is provided with one or more grooves thereon, and
the second region is a bottom portion of the one or more grooves.
3. The structural body according claim 1 , further comprising:
a first electrode located above the first region; and
a second electrode electrically insulated from the first electrode, wherein
the main surface further includes a third region that is adjacent to the first region with the second region interposed therebetween, and
the second electrode is located above the third region.
4. The structural body according claim 3 , further comprising:
a conductive layer covering a sidewall and a bottom surface of the one or more recesses and electrically connected to the first electrode; and
a dielectric layer interposed between the conductive substrate and the conductive layer, and electrically insulating the conductive substrate and the conductive layer from each other,
wherein the conductive substrate is electrically connected to the second electrode.
5. The structural body according claim 1 , wherein a ratio D 2 /D 1 of a shortest distance D 2 from the one or more recesses to the second region with respect to a depth D 1 of the one or more recesses is within a range from 0.01 to 1.
6. The structural body according claim 1 , wherein a difference D 4 in height between the first region and the second region is half or smaller than a depth D 1 of the one or more recesses.