Method of manufacturing a multi-layer PZT microactuator using wafer-level processing
A multi-level piezoelectric actuator is manufactured using wafer level processing. Two PZT wafers are formed and separately metallized for electrodes. The metallization on the second wafer is patterned, and holes that will become electrical vias are formed in the second wafer. The wafers are then stacked and sintered, then the devices are poled as a group and then singulated to form nearly complete individual PZT actuators. Conductive epoxy is added into the holes at the product placement step in order to both adhere the actuator within its environment and to complete the electrical via thus completing the device. Alternatively: the first wafer is metallized; then the second wafer having holes therethrough but no metallization is stacked and sintered to the first wafer; and patterned metallization is applied to the second wafer to both form electrodes and to complete the vias. The devices are then poled as a group, and singulated.
1. A method of manufacturing a multi-layer piezoelectric actuator, the method comprising:
providing alignment means for aligning first and second wafers of piezoelectric material;
forming a plurality of through-holes in the second wafer separate from the alignment means;
forming a first conductive layer on the first wafer, the first conductive layer extending over a plurality of inchoate actuator locations on the first wafer;
forming a second conductive layer on the second wafer, the second conductive layer extending over a plurality of inchoate actuator locations on the second wafer but does not extend to the through-holes;
after the first and second conductive layers have been formed, stacking the second layer onto the first layer and adhering the first and second wafers thereto such that the through-holes extend through the second wafer to the first conductive layer on the first wafer, the stacked first and second wafers defining a wafer stack with the first conductive layer being sandwiched between the two piezoelectric layers; and then
singulating the wafer stack in both x- and y-dimensions to singulate the wafer stack along two dimensions into individual piezoelectric actuators, the individual piezoelectric actuators having first and second piezoelectric actuator layers, the through-holes defining electrical access to electrodes defined by the sandwiched first conductive layer.
2. The method of claim 1 further comprising:
firing the piezoelectric material to harden the piezoelectric material; and
poling the piezoelectric actuators.
3. The method of claim 2 wherein the firing and poling steps are performed on the wafer stack before the singulating step, such that the firing and poling steps are performed at a wafer level of manufacturing.
4. The method of claim 1 wherein the first piezoelectric actuator layer has a first electrode on one side thereof defined by the sandwiched first conductive layer, but does not have a second electrode on a second and opposite side thereof, such that the first piezoelectric actuator layer remains substantially piezoelectrically inactive thereby acting as a constraining layer resisting expansion and contraction of the second piezoelectric actuator layer.
5. The method of claim 1 further comprising:
filling one of said through-holes with conductive adhesive, thereby defining an electrical via of conductive adhesive to the sandwiched first conductive layer.
6. The method of claim 1 wherein the singulating step further comprises:
dicing through the stacked wafer along lines that are near but not through the through-holes, such that the through-holes remain closed-ended in the x- and y-directions.
7. The method of claim 1 wherein the singulating step further comprises:
dicing through the stacked wafer along lines that intersect the through-holes such that the through-holes become open-ended in at least one of the x- and y-directions.
8. The method of claim 1 wherein the step of forming a second conductive layer on the second wafer, is performed before stacking the second layer on to the first layer.
9. The method of claim 1 wherein:
the step of forming the second conductive layer on the second wafer, is performed after the stacking of the second wafer on the first wafer; and
the method further comprises applying conductive material into the through-holes to define electrical vias through the second wafer, the conductive material in the through-holes comprising a same material as does the second conductive layer, the steps of forming the second conductive layer and applying the conductive material into the through-holes being performed as part of a same processing step carried out at a wafer level of processing.
10. The method of claim 9 wherein the steps of forming the second conductive layer and applying the conductive material into the through-holes comprising sputtering of metal.