Cooling module with serial fluid management
Embodiments are disclosed of a cooling apparatus with one or more cold plates, each adapted to be thermally coupled to a heat-generating electronic component on a piece of IT equipment. A fluid control module is mounted to the substrate and fluidly coupled to the cold plates. The fluid control module includes a fluid inlet with an inlet mechanism adapted to enable and disable the fluid inlet; the inlet mechanism enables the fluid inlet when energized and disables the fluid inlet when de-energized. The fluid control module also includes a fluid outlet with an outlet mechanism adapted to enable and disable the fluid outlet; the outlet mechanism enables the fluid outlet when energized and disables the fluid outlet when de-energized. A dedicated power supply is electrically coupled to the inlet mechanism and the outlet mechanism, and when the inlet mechanism is de-energized, the outlet mechanism is also de-energized after a delay.
1. A cooling apparatus comprising:
one or more cold plates mounted on a substrate, each cold plate adapted to be thermally coupled to a heat-generating electronic component on a piece of IT equipment;
a fluid control module mounted to the substrate and fluidly coupled to the one or more cold plates, the fluid control module including:
a fluid inlet including an inlet mechanism adapted to enable and disable the fluid inlet, wherein the inlet mechanism enables the fluid inlet when energized and disables the fluid inlet when de-energized, and
a fluid outlet including an outlet mechanism adapted to enable and disable the fluid outlet, wherein the outlet mechanism enables the fluid outlet when energized and disables the fluid outlet when de-energized,
wherein when the inlet mechanism is de-energized, the outlet mechanism is deenergized after a delay; and
a power supply electrically coupled to the inlet mechanism and the outlet mechanism.
2. The apparatus of claim 1 wherein the power supply is an IT power supply of the piece of IT equipment to which the one or more cold plates are thermally coupled.
3. The apparatus of claim 2 , further comprising one or more leak-detection sensors positioned on the substrate and communicatively coupled to a baseboard management controller (BMC) on the piece of IT equipment, the BMC also being coupled to the IT power supply.
4. The apparatus of claim 3 , further comprising an auxiliary power supply coupled to the outlet mechanism to implement the delay.
5. The apparatus of claim 1 wherein the power supply is a power module mounted to the substrate and adapted to be coupled to a rack power source by a pair of clips.
6. The apparatus of claim 5 , further comprising:
one or more leak detection sensors mounted on the substrate;
a switch coupled to the one or more leak detection sensors and coupled in an electrical connection between the power module, the inlet mechanism, and the outlet mechanism; and
an auxiliary power supply coupled to the outlet mechanism to implement the delay.
7. The apparatus of claim 5 wherein the power module includes a disconnect mechanism adapted to connect and disconnect the clips to the rack power source, wherein the disconnect mechanism physically connects the clips to the rack power source when energized and physically disconnects the clips from the rack power source when de-energized.
8. The apparatus of claim 7 , further comprising:
one or more leak detection sensors mounted on the substrate;
a first switch coupled to the one or more leak detection sensors and coupled in an electrical connection between the power module and the inlet mechanism;
a second switch coupled to the one or more leak detection sensors and coupled in an electrical connection between the power module and the disconnect mechanism;
wherein the delay is implemented by opening the first switch, then opening the second switch at the end of the delay period.
9. The apparatus of claim 7 , further comprising:
one or more leak detection sensors mounted on the substrate;
a switch coupled to the one or more leak detection sensors and coupled in an electrical connection between the power module and the disconnect mechanism; and
an auxiliary power supply coupled to the outlet mechanism to implement the delay.
10. The apparatus of claim 1 wherein disabling the fluid inlet comprises disconnecting the fluid inlet from a fluid supply and disabling the fluid outlet comprises disconnecting the fluid outlet from a fluid return.
11. A cooling system comprising:
a piece of information technology (IT) equipment;
a cooling module coupled to the piece of IT equipment, the cooling module comprising:
one or more cold plates mounted on a substrate, each cold plate adapted to be thermally coupled to a heat-generating electronic component on a piece of IT equipment;
a fluid control module mounted to the substrate and fluidly coupled to the one or more cold plates, the fluid control module including:
a fluid inlet including an inlet mechanism adapted to enable and disable the fluid inlet, wherein the inlet mechanism enables the fluid inlet when energized and disables the fluid inlet when de-energized, and
a fluid outlet including an outlet mechanism adapted to enable and disable the fluid outlet, wherein the outlet mechanism enables the fluid outlet when energized and disables the fluid outlet when de-energized,
wherein when the inlet mechanism is de-energized, the outlet mechanism is deenergized after a delay; and
a power supply electrically coupled to the inlet mechanism and the outlet mechanism.
12. The cooling system of claim 11 wherein the power supply is an IT power supply of the piece of IT equipment to which the one or more cold plates are thermally coupled.
13. The cooling system of claim 12 , further comprising one or more leak-detection sensors positioned on the substrate and communicatively coupled to a board management controller (BMC) on the piece of IT equipment, the BMC also being coupled to the IT power supply.
14. The cooling system of claim 13 , further comprising an auxiliary power supply coupled to the outlet mechanism to implement the delay.
15. The cooling system of claim 11 wherein the power supply is a power module mounted to the substrate and adapted to be coupled to a rack power source by a pair of clips.
16. The cooling system of claim 15 , further comprising:
one or more leak detection sensors mounted on the substrate;
a switch coupled to the one or more leak detection sensors and coupled in an electrical connection between the power module, the inlet mechanism, and the outlet mechanism; and
an auxiliary power supply coupled to the outlet mechanism to implement the delay.
17. The cooling system of claim 15 wherein the power module includes a disconnect mechanism adapted to connect and disconnect the clips to the rack power source, wherein the disconnect mechanism physically connects the clips to the rack power source when energized and physically disconnects the clips from the rack power source when de-energized.
18. The cooling system of claim 17 , further comprising:
one or more leak detection sensors mounted on the substrate;
a first switch coupled to the one or more leak detection sensors and coupled in an electrical connection between the power module and the inlet mechanism;
a second switch coupled to the one or more leak detection sensors and coupled in an electrical connection between the power module and the disconnect mechanism;
wherein the delay is implemented by opening the first switch, then opening the second switch at the end of the delay period.
19. The cooling system of claim 17 , further comprising:
one or more leak detection sensors mounted on the substrate;
a switch coupled to the one or more leak detection sensors and coupled in an electrical connection between the power module and the disconnect mechanism; and
an auxiliary power supply coupled to the outlet mechanism to implement the delay.
20. The cooling system of claim 11 wherein disabling the fluid inlet comprises disconnecting the fluid inlet from a fluid supply and disabling the fluid outlet comprises disconnecting the fluid outlet from a fluid return.