Ultrasonic transducer
A system, method, and apparatus for reducing ringing effects associated with a transducer comprises a transducer body, a transducer cap, a piezoelectric element formed in the cap, and a damping material formed around the piezoelectric element wherein the damping material suppresses a ringing effect associated with the transducer, while an O-ring is used together with damping material to support high pressure applications up to 230 bars.
1. A transducer apparatus, comprising:
a transducer comprising a transducer body and a transducer cap;
a piezoelectric element formed in said transducer cap;
a damping material and an O-ring formed around said piezoelectric element, wherein said damping material suppresses a ringing effect associated with said transducer; and
a potting material configured in said transducer body, wherein said potting material is separated from said piezoelectric element by said damping material.
2. The transducer apparatus of claim 1 , wherein said damping material comprises an adhesive silicone sealant and heat-sink compound.
3. The transducer apparatus of claim 2 , wherein said adhesive silicone sealant and heat-sink compound comprises at least one of:
an adhesive room temperature vulcanization silicone; and
a heatsink silicone compound.
4. The transducer apparatus of claim 1 , wherein said O-ring is configured to allow said apparatus to withstand high pressure.
5. The transducer apparatus of claim 4 , wherein said O-ring is formed of a material comprising at least one of:
rubber;
silicone; and
fluorine rubber Nitrile-butadiene (NBR).
6. The transducer apparatus of claim 1 , wherein said potting material comprises a hardened and cured epoxy.
7. The transducer apparatus of claim 1 , wherein a mouth of said transducer body has a diameter of at least 50% of a diameter of said piezoelectric element comprising a disc.
8. The transducer apparatus of claim 1 , wherein said damping material is disposed in said transducer cap.
9. The transducer apparatus of claim 1 , wherein said damping material is disposed in said transducer body.
10. The apparatus of claim 1 , wherein said damping material and said potting material are in contact with each other.
11. A transducer system, comprising:
a transducer body;
a transducer cap;
a piezoelectric element formed in said cap;
an O-ring formed between said transducer body and said transducer cap;
a damping material comprising an adhesive silicone sealant and heat-sink compound formed around said piezoelectric element, wherein said damping material suppresses a ringing effect associated with said transducer; and
a potting material configured in said transducer body, wherein said potting material is separated from said piezoelectric element by said damping material.
12. The transducer system of claim 11 , wherein said adhesive silicone sealant and heat-sink compound comprises at least one of:
an adhesive room temperature vulcanization silicone; and
a heatsink silicone compound.
13. The transducer system of claim, 12 wherein said O-ring is formed of a material comprising at least one of:
rubber;
silicone; and
fluorine rubber Nitrile-butadiene (NBR).
14. The transducer system of claim 11 , wherein said potting material comprises epoxy.
15. The transducer system of claim 11 , wherein a mouth of said transducer body has a diameter of at least 50% of a diameter of said piezoelectric element comprising a disc.
16. The transducer system of claim 11 , wherein said damping material is disposed in at least one of:
said transducer cap; and
said transducer body.
17. The system of claim 11 , wherein said damping material and said potting material are in contact with each other.
18. A transducer, comprising:
a piezoelectric element formed in a transducer cap;
a transducer body wherein a mouth of said transducer body has a diameter of at least 50% of a diameter of said piezoelectric element comprising a disc;
an O-ring formed between said transducer body and said transducer cap;
a damping material comprising an adhesive silicone sealant and heat-sink compound formed around said piezoelectric element, wherein said damping material suppresses a ringing effect associated with said transducer; and
a potting material configured in said transducer body, wherein said potting material is separated from said piezoelectric element by said damping material.
19. The transducer of claim 18 , wherein said adhesive silicone sealant and heat-sink compound comprises at least one of:
an adhesive room temperature vulcanization silicone; and
a heatsink silicone compound.
20. The transducer of claim 18 , wherein said O-ring is formed of a material comprising at least one of:
rubber;
silicone; and
fluorine rubber Nitrile-butadiene (NBR).