Rotary body module and chemical mechanical polishing apparatus having the same
A chemical mechanical polishing apparatus includes a fixing portion; and a rotary body module including a rotating shaft rotatably installed on the fixing portion, a first rotating unit connected to the rotating shaft and on which a wafer is mounted, and a second rotating unit disposed around the first rotating unit and on which a retainer ring is mounted, wherein the fixing portion comprises a first driving member disposed above the first rotating unit and a second driving member disposed above the second rotating unit, wherein the first and second driving members are comprised of a magnet or an electromagnet, wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit, and wherein the first rotating unit and the second rotating unit are independently tilted.
1. A chemical mechanical polishing apparatus comprising:
a fixing portion; and
a rotary body module including a rotating shaft rotatably provided on the fixing portion, a first rotating unit connected to the rotating shaft and on which a wafer is mounted, and a second rotating unit disposed around the first rotating unit and on which a retainer ring is mounted,
wherein the fixing portion comprises a first driving member disposed above the first rotating unit and a second driving member disposed above the second rotating unit,
wherein the first and second driving members are comprised of a magnet or an electromagnet,
wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit, and
wherein the first rotating unit and the second rotating unit are independently tilted.
2. The chemical mechanical polishing apparatus according to claim 1 , wherein the fixing portion comprises a first displacement sensor provided in the first driving member, and a second displacement sensor provided in the second driving member.
3. The chemical mechanical polishing apparatus according to claim 1 , wherein the second rotating unit is connected to the first rotating unit.
4. The chemical mechanical polishing apparatus according to claim 1 , wherein the first and second magnets are arranged to sequentially stack an anode and a cathode in a longitudinal direction of the rotating shaft.
5. The chemical mechanical polishing apparatus according to claim 1 , wherein the first rotating unit comprises:
a first body;
a first flexible member connecting the first body and the rotating shaft;
a first sealing member sealing a space formed by the first body and the rotating shaft; and
a membrane provided on a lower end portion of the first body and including a lower surface on which the wafer is mounted.
6. The chemical mechanical polishing apparatus according to claim 5 , wherein the second rotating unit comprises:
a second body including a lower surface on which the retainer ring is mounted;
a second flexible member connecting the first body and the second body; and
a second sealing member sealing a space formed by the first body and the second body, together with the second flexible member.
7. The chemical mechanical polishing apparatus according to claim 6 , wherein the first and second flexible members are comprised of any one of an engineering plastic material and a stainless steel (SUS) material.
8. The chemical mechanical polishing apparatus according to claim 6 , wherein the first and second sealing members are comprised of an elastic material.
9. The chemical mechanical polishing apparatus according to claim 8 , wherein the first and second sealing members are comprised of silicone or rubber.
10. The chemical mechanical polishing apparatus according to claim 1 , wherein the first rotating unit and the second rotating unit are separately connected to the rotating shaft.
11. A rotary body module comprising:
a rotating shaft attached to a fixing portion;
a first rotating unit connected to the rotating shaft and on which a wafer is mounted;
a second rotating unit disposed around the first rotating unit and on which a retainer ring is mounted;
a first driving member disposed above the first rotating unit; and
a second driving member disposed above the second rotating unit,
wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit, and
wherein the first rotating unit and the second rotating unit are configured to be independently tilted.
12. The rotary body module according to claim 11 , wherein the first driving member disposed above the first rotating unit and the second driving member are provided on the fixing portion.
13. The rotary body module according to claim 12 , wherein the first and second driving members are comprised of a magnet or an electromagnet.
14. The rotary body module according to claim 11 , wherein the first rotating unit comprises:
a first body;
a first flexible member connecting the first body and the rotating shaft;
a first sealing member sealing a space formed by the first body and the rotating shaft; and
a membrane provided on a lower surface of the first body and on which the wafer is mounted.
15. The rotary body module according to claim 14 , wherein the second rotating unit comprises:
a second body including a lower surface on which the retainer ring is mounted;
a second flexible member connecting the first body and the second body; and
a second sealing member sealing a space formed by the first body and the second body, together with the second flexible member.