Apparatus for depositing conductive and nonconductive material to form a printed circuit

1. A kit for printing a circuit on a substrate to produce a printed circuit board on the substrate, the kit comprising:

a conductive material print head containing a conductive material to be printed on said substrate;

a nonconductive material print head containing a nonconductive material to be printed on said substrate; and

a printing apparatus comprising:

a table for supporting the substrate;

a function head configured to accept installations of said conductive material print head and said nonconductive material print head such that:

one of said nonconductive material print head or said conductive material print head is carried on said function head at a given time; or

both of said nonconductive material print head and said conductive material print head are simultaneously carried on said function head;

a positioner configured to effect a movement of said function head and said table relative to one another; and

a controller configured to accept PWB data to operate said function head and said positioner to effect:

printing on said substrate said nonconductive material when said function head has said nonconductive material print head installed;

printing on the substrate of said conductive material to form printed conductors when said function head has said conductive material print head installed; and

reprinting one or more of said printed conductors in response to a test input indicating said one or more printed conductors fail testing.

2. The kit of claim 1 wherein said controller is configured to prompt a user for said test input.

3. The kit of claim 2 wherein said controller is configured to operate a display showing a screen referencing one or more of said printed conductors and configured to prompt the user for said test input corresponding to one or more of said printed conductors.

4. The kit of claim 3 wherein said display presents a diagram of said printed conductors.

5. The kit of claim 1 , further comprising:

an electrical testing device having a testing probe for testing said printed conductors at at least one point;

said function head being further configured to accept an installation of said testing probe, such that said function head carries said testing probe either alone or in combination with one or more of said conductive material print head, or said nonconductive material print head; and

wherein, when said testing probe is installed in said function head, said controller is configured to operate said positioner and said function head to effect testing of said printed conductors to produce said test input indicating said one or more printed conductors fail testing and effect said reprinting of said one or more printed conductors in response to said test input when said conductive print head is carried on said function head.

6. The kit of claim 5 , wherein said testing probe and said conductive material print head are simultaneously installed in said function head.

7. The kit of claim 5 , wherein said testing probe is integrated into said conductive material print head.

8. The kit of claim 7 , wherein said conductive material print head is an ink jet print head and said testing probe protrudes from a bottom surface of said ink jet print head.

9. The kit of claim 5 , wherein said testing probe includes two probe contacts and said testing device effects a resistance measurement.

10. The kit of claim 5 , wherein said controller is configured to obtain actual test values from testing of said printed conductors by operation of said electrical testing device, and produce said test input based on a comparison of said actual test values with expected test values.

11. The kit of claim 10 wherein said controller is configured to automatically effect the following conductor layer printing process:

said printing said printed conductors on said substrate in a layer;

obtaining said actual test values of said printed conductors of said layer and determining failed printed conductors as said test input based on comparison of said actual test values with said expected test values; and

reprinting said failed printed conductors.

12. The kit of claim 11 , Wherein said PWB data includes trace geometry data, and said expected test values are determined based on said trace geometry data and predetermined sheet resistivity data of said one or more printed conductors.

13. The kit of claim 12 , wherein said test probe includes first and second probe contacts.

14. The kit of claim 13 , further comprising a probe holder mechanism responsive to said controller and carrying said first and second probes contacts on said function head, said probe holder mechanism being configured to position said first and second probe contacts a variable distance “d” apart.

15. The kit of claim 14 , wherein:

said variable distance “d” has a maximum value; and

said controller is configured to determine conductor segments of said printed conductors where said conductors segments have segment lengths not exceeding said maximum value, and effect said testing of said printed conductors by testing individual ones of said conductor segments using expected segment test values determined based on said trace geometry data, segment length, and said predetermined sheet resistivity data.

16. The kit of claim 15 , wherein said reprinting said failed printed conductors is limited to reprinting individual ones of said conductor segments which have actual segment test values not meeting requirements of expected segment test values.

17. The kit of claim 16 , further comprising a rotation mechanism responsive to said controller and arranged to rotatably support said probe holder mechanism on said function head.

18. The kit of claim 17 , wherein said printed circuit board comprises at least first and second layers of conductors with non-conductive material separating at least portions of said first and second layers, and said controller is configured to automatically effect:

said conductor layer printing process to produce said first layer;

printing said non-conductive material separating said first and second layers; and

said conductor layer printing process to produce said second layer.

19. The kit of claim 14 , wherein said printed circuit board comprises at least first and second layers of conductors with non-conductive material separating at least portions of said first and second layers, and said controller is configured to automatically effect:

said conductor layer printing process to produce said first layer;

printing said non-conductive material separating said first and second layers; and

said conductor layer printing process to produce said second layer.

20. The kit of claim 11 , wherein said expected test values of said printed conductors are stored predetermined values.

21. The kit of claim 20 , wherein said test probe includes first and second probe contacts.

22. The kit of claim 21 , further comprising a probe holder mechanism responsive to said controller and carrying said first and second probes contacts on said function head, said probe holder mechanism being configured to position said first and second probe contacts a variable distance “d” apart.

23. The kit of claim 22 , wherein:

said variable distance “d” has a maximum value; and

said controller is configured to determine conductor segments of said printed conductors where said conductors segments have segment lengths not exceeding said maximum value, and effect said testing of said printed conductors by testing individual ones of said conductor segments.

24. The kit of claim 23 , wherein said reprinting said failed printed conductors is limited to reprinting individual ones of said conductor segments which have failed testing.

25. The kit of claim 24 , further comprising a rotation mechanism responsive to said controller and arranged to rotatably support said probe holder mechanism on said function head.

26. The kit of claim 25 , wherein said printed circuit board comprises at least first and second layers of conductors with non-conductive material separating at least portions of said first and second layers, and said controller is configured to automatically effect:

said conductor layer printing process to produce said first layer;

printing said non-conductive material separating said first and second layers; and

said conductor layer printing process to produce said second layer.

27. The kit of claim 22 , wherein said printed circuit board comprises at least first and second layers of conductors with non-conductive material separating at least portions of said first and second layers, and said controller is configured to automatically effect:

said conductor layer printing process to produce said first layer;

printing said non-conductive material separating said first and second layers; and

said conductor layer printing process to produce said second layer.

28. The kit of claim 11 , wherein said printed circuit board comprises at least first and second layers of conductors with non-conductive material separating at least portions of said first and second layers, and said controller is configured to automatically effect:

said conductor layer printing process to produce said first layer;

printing said non-conductive material separating said first and second layers; and

said conductor layer printing process to produce said second layer.

29. The kit of claim 28 wherein said electrical testing device produces said actual test values reflecting anyone of resistance, capacitance, inductance, insertion loss, return loss, or time domain reflectometry.

30. The kit of claim 29 wherein said electrical testing device effects testing via non-contact capacitive coupling.

31. The kit of claim 11 wherein said electrical testing device produces said actual test values reflecting any one of resistance, capacitance, inductance, insertion loss, return loss, or time domain reflectometry.

32. The kit of claim 31 wherein said electrical testing device effects testing via non-contact capacitive coupling.