Semiconductor device having a through silicon via and methods of manufacturing the same

1. A semiconductor device, comprising:

circuit devices disposed on a first surface of a substrate;

a first insulating interlayer covering the circuit devices disposed on the first surface of the substrate;

a pad pattern disposed on a surface of the first insulating interlayer, the pad pattern comprising a first copper pattern;

a second insulating interlayer covering the pad pattern disposed on the surface of the first insulating interlayer; and

a through silicon via extending from a second surface of the substrate that is a surface different from the first surface of the substrate, the through silicon via passing through the substrate and the first insulating interlayer, and contacting the first copper pattern of the pad pattern,

wherein the through silicon via comprises a first portion passing through the substrate and the first insulating interlayer, and a second portion under the first portion and extending to an inner portion of the pad pattern,

wherein a portion of a bottom of the first portion contacts an upper portion of the pad pattern, and

wherein an entire sidewall and a bottom of the second portion contact the pad pattern.

2. The semiconductor device of claim 1 , wherein the bottom of the second portion contact the first copper pattern of the pad pattern.

3. The semiconductor device of claim 1 , wherein a width of the first portion is greater than a width of the second portion, at a portion adjacent to a boundary between the first portion and the second portion.

4. The semiconductor device of claim 1 , wherein a boundary of the through silicon via has a bent portion between the first portion and the second portion.

5. The semiconductor device of claim 1 , wherein the pad pattern comprises the first copper pattern, a first seed copper pattern and a first barrier pattern,

wherein a stacked structure of the first seed copper pattern and the first barrier pattern is conformally formed on an upper surface and a sidewall of the first copper pattern, and

wherein the first barrier pattern is exposed at an upper surface of the pad pattern.

6. The semiconductor device of claim 1 , wherein the through silicon via is formed in a via hole, and

wherein the via hole includes a first hole passing through the substrate and the first insulating interlayer and a second hole communicating with the first hole and having an inner width different from that of the first hole.

7. The semiconductor device of claim 6 , wherein the through silicon via comprises a second barrier pattern, a second seed copper pattern, and a second copper pattern, and

wherein a stacked structure of the second barrier pattern and the second seed copper pattern is conformally formed on a surface of the via hole, and the second copper pattern is formed on the second seed copper pattern to fill the via hole.

8. The semiconductor device of claim 7 , wherein the upper portion of the pad pattern directly contacts the second barrier pattern of the bottom of the first portion.

9. The semiconductor device of claim 1 , further comprising an insulation liner disposed on a sidewall of the through silicon via.

10. The semiconductor device of claim 9 , wherein a bottom surface of the insulation liner is interposed between an upper surface of the first insulating interlayer and an upper surface of the pad pattern.

11. A semiconductor device, comprising:

a first insulating interlayer disposed on a first surface of a substrate;

a pad pattern disposed on a surface of the first insulating interlayer, the pad pattern comprising a first copper pattern, a first seed copper pattern and a first barrier pattern, and the first barrier pattern being exposed at an upper surface of the pad pattern; and

a through silicon via extending from a second surface of the substrate that is a surface different from the first surface of the substrate, the through silicon via passing through the substrate and the first insulating interlayer, and contacting the first copper pattern of the pad pattern,

wherein the through silicon via comprises a first portion passing through the substrate and the first insulating interlayer, and a second portion under the first portion and extending to an inner portion of the pad pattern,

wherein a portion of a bottom of the first portion contacts the first barrier pattern of the upper surface of the pad pattern, and

wherein an entire sidewall and a bottom of the second portion contact the first copper pattern, the first seed copper pattern and the first barrier pattern in the pad pattern.

12. The semiconductor device of claim 11 , wherein a width of the first portion is greater than a width of the second portion, at a portion adjacent to a boundary between the first portion and the second portion.

13. The semiconductor device of claim 11 , wherein the through silicon via comprises a second barrier pattern, a second seed copper pattern, and a second copper pattern,

wherein a stacked structure of the second barrier pattern and the second seed copper pattern covers a sidewall and a lower surface of the second copper pattern, and

wherein the second barrier pattern directly contacts the pad pattern.

14. The semiconductor device of claim 11 , further comprising an insulation liner disposed on a sidewall of the through silicon via.

15. The semiconductor device of claim 14 , wherein a bottom surface of the insulation liner is interposed between an upper surface of the first insulating interlayer and the upper surface of the pad pattern.

16. A semiconductor device, comprising:

circuit devices disposed on a first surface of a substrate;

a first insulating interlayer covering the circuit devices disposed on the first surface of the substrate;

a pad pattern disposed on a surface of the first insulating interlayer, the pad pattern comprising a first copper pattern, a first seed copper pattern and a first barrier pattern, the first seed copper pattern and the first barrier pattern covering the first copper pattern, and the first barrier pattern being exposed at an upper surface of the pad pattern;

a second insulating interlayer covering the pad pattern disposed on the surface of the first insulating interlayer; and

a through silicon via extending from a second surface of the substrate that is a surface different from the first surface of the substrate, the through silicon via passing through the substrate and the first insulating interlayer, and contacting the first copper pattern of the pad pattern,

wherein the through silicon via comprises a first portion passing through the substrate and the first insulating interlayer, and a second portion under the first portion and extending to an inner portion of the pad pattern,

wherein the through silicon via comprises a second barrier pattern, a second seed copper pattern, and a second copper pattern, and a stacked structure of the second barrier pattern and the second seed copper pattern covers a sidewall and a lower surface of the second copper pattern,

wherein a portion of the second barrier pattern of a bottom of the first portion contacts the first barrier pattern of the upper surface of the pad pattern, and

wherein an entire sidewall and a bottom of the second portion contact the pad pattern.

17. The semiconductor device of claim 16 , wherein the bottom of the second portion contact the first copper pattern of the pad pattern.

18. The semiconductor device of claim 16 , wherein a width of the first portion is greater than a width of the second portion, at a portion adjacent to a boundary between the first portion and the second portion.

19. The semiconductor device of claim 16 , further comprising an insulation liner disposed on a sidewall of the through silicon via.

20. The semiconductor device of claim 19 , wherein a bottom surface of the insulation liner is interposed between an upper surface of the first insulating interlayer and the upper surface of the pad pattern.