Electronic device comprising a conformal viscoelastic or non-Newtonian coating
A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.
1. A assembled printed circuit board comprising:
a conformal coating that is made from a composition comprising:
(a) at least one hydrophobic fluid, and,
(b) one or more functionalized polysiloxanes, linear and cyclic silicones, styrene-ethylene/butylene-styrene or styrene-ethylene/propylene-styrene materials swelled with mineral oils or diesters, long chain fatty alcohols, functionalized or non-functionalized poly oligomeric silsesquioxanes, and polyolefins,
wherein the conformal coating is hydrophobic, electrically insulating and exhibits viscoelastic or non-Newtonian properties.
2. The assembled printed circuit board of claim 1 , wherein the conformal coating is able to redistribute after being applied to the assembled printed circuit board.
3. The assembled printed circuit board of claim 1 , wherein the composition further comprises one or more metal oxides, fumed functionalized silica, fluoropolymer particles, clay particles, mica, metal alkoxide particles, rare earth and transition metals, carbon-based materials selected from graphene, graphite, and carbon nanotubes, and metal organic frameworks.
4. The assembled printed circuit board of claim 1 , wherein the composition further comprises one or more surfactant, dispersant, hygroscopic material or rheological modifier.
5. The assembled printed circuit board of claim 4 , wherein at least one hygroscopic material comprising a polysaccharide gum, a carbomer, or combinations thereof.
6. The assembled printed circuit board of claim 1 , wherein the conformal coating increases resistance of the assembled printed circuit board to contaminants.
7. The assembled printed circuit board of claim 6 , wherein said contaminants are in liquid or particulate form.
8. The assembled printed circuit board of claim 7 , wherein said contaminants in liquid form comprise water, bodily fluids, or combinations thereof.
9. The assembled printed circuit board of claim 8 , which is water resistant or waterproof.
10. The assembled printed circuit board of claim 1 , wherein the assembled printed circuit board is assembled.
11. The assembled printed circuit board of claim 1 , wherein the conformal coating is located on a part of or the entirety of at least one side of the assembled printed circuit board.
12. The assembled printed circuit board of claim 11 , wherein the conformal coating covers at least one male connector, female connector or both connectors of the assembled printed circuit board without adversely affecting the electrical properties of the assembled printed circuit board.
13. An assembled printed circuit board comprising:
a conformal coating that increases resistance of the assembled printed circuit board to contaminants, wherein the conformal coating is made from a composition comprising:
(a) at least one hydrophobic fluid, and
(b) one or more functionalized polysiloxanes, linear and cyclic silicones, styrene-ethylene/butylene-styrene or styrene-ethylene/propylene-styrene materials swelled with mineral oils or diesters, long chain fatty alcohols, functionalized or non-functionalized poly oligomeric silsesquioxanes, and polyolefins,
wherein the conformal coating is hydrophobic, electrically insulating and exhibits viscoelastic or non-Newtonian properties.
14. The assembled printed circuit board of claim 13 , wherein the composition further comprises one or more metal oxides, fumed functionalized silica, fluoropolymer particles, clay particles, mica, metal alkoxide particles, rare earth and transition metals, carbon-based materials selected from graphene, graphite, and carbon nanotubes, and metal organic frameworks.
15. The assembled printed circuit board of claim 13 , wherein said contaminants are in liquid or particulate form.
16. The assembled printed circuit board of claim 15 , wherein said contaminants in liquid form comprise water, bodily fluids, or combinations thereof.
17. The assembled printed circuit board of claim 16 , which is water resistant or waterproof.
18. The assembled printed circuit board of claim 13 , wherein the conformal coating is located on a part of or the entirety of at least one side of the assembled printed circuit board.
19. The assembled printed circuit board of claim 13 , wherein the conformal coating covers at least one male connector, female connector or both connectors of the assembled printed circuit board without adversely affecting the electrical properties of the assembled printed circuit board.
20. The assembled printed circuit board of claim 13 , wherein the conformal coating is able to redistribute after being applied to the assembled printed circuit board.