Display device using semiconductor light emitting diode
The present invention relates to a display device and, in particular, to a display device using a semiconductor light emitting diode. A display device according to the present invention comprises a substrate having a plurality of metal pads; and a plurality of semiconductor light emitting diodes electrically connected to the metal pads through self-assembly. The present invention is characterized in that: the semiconductor light emitting diodes respectively include a conductive semiconductor layer, a conductive electrode formed on one surface of the conductive semiconductor layer, and a passivation layer enclosing the semiconductor light emitting diode and provided with a through hole for exposing the conductive electrode; one end portion of the semiconductor light emitting diodes is divided into a first portion in which the conductive electrode is exposed, and a second portion in which the passivation layer is exposed; and the maximum width of the metal pad is set to a range of the width to twice the width of the second portion.
1. A display device, comprising:
a substrate having a plurality of metal pads; and
a plurality of semiconductor light emitting devices electrically connected to the metal pads,
wherein the substrate comprises:
a lower wiring made of a conductive material; and
an insulating layer covering the lower wiring,
wherein the metal pads are connected to the lower wiring and include corresponding protruding portions protruding through the insulating layer to be exposed outside of the insulating layer to face an end portion of a respective semiconductor light emitting device facing the substrate,
wherein the respective semiconductor light emitting device comprises:
an n-type semiconductor layer, an active layer and a p-type semiconductor layer;
a conductive electrode on the p-type semiconductor layer; and
a passivation layer configured to surround the respective semiconductor light emitting device and including a through hole through which the conductive electrode is exposed,
wherein the end portion of the respective semiconductor light emitting device facing the substrate is partitioned into a first portion in which the conductive electrode is exposed and a second portion in which the passivation layer is exposed,
wherein the passivation layer comprises a side surface portion covering a side surface of the respective semiconductor light emitting device and an extension portion extending from the side surface portion to cover the end portion,
wherein the conductive electrode comprises a protruding portion protruding through the through hole of the passivation layer and overlapping outer surfaces of the passivation layer,
wherein the protruding portion of the conductive electrode directly contacts a corresponding metal pad, and
wherein a width of the protruding portion of the conductive electrode is greater than a width of the corresponding metal pad.
2. The display device of claim 1 , wherein a maximum width of the corresponding metal pad is a diameter or a diagonal distance of a portion of the corresponding metal pad exposed to the outside.
3. The display device of claim 2 , wherein the portion of the corresponding metal pad exposed to the outside has a shape in which the end portion is reduced to 25 to 75%.
4. The display device of claim 3 , wherein the first portion is formed in the same shape as the portion of the corresponding metal pad exposed to the outside.
5. The display device of claim 2 , wherein the portion of the corresponding metal pad exposed to the outside is disposed at the center of the end portion.
6. The display device of claim 1 , wherein the corresponding metal pad comprises an alloy made of at least two or more combinations of Bi, In, Pb, Sn and Ag.
7. The display device of claim 6 , wherein the conductive electrode comprises a plurality of metal layers made of different metals.
8. The display device of claim 1 , wherein the semiconductor light emitting device includes an n-type electrode and a p-type electrode.
9. The display device of claim 1 , wherein an insulating material is filled between the semiconductor light emitting devices to form a planarizing layer, and an upper wiring electrically connected to the n-type electrode is disposed in the planarizing layer.
10. The display device of claim 1 , wherein as a maximum width of the corresponding metal pad is set to a range of a width of the second portion to twice the width, a plurality of conductive electrodes are restricted from being brought into contact with the corresponding metal pad.
11. The display device of claim 1 , wherein a width of the second portion is a maximum width of the passivation layer being overlapped with the active layer.
12. The display device of claim 1 , wherein a width of the second portion is a maximum width of the passivation layer being overlapped with the n-type semiconductor layer.
13. The display device of claim 12 , wherein a maximum width of the metal pad is set to a range of the width of the second portion to twice the width of the second portion.