IP Library Granted Patent US 11,605,883
Granted Patent B2
US 11,605,883 · App. 15/994,723 · Granted Mar 14, 2023

Antenna module including a flexible substrate

Inventors: Young Bal Kim (Suwon-si, KR); Wan Soo Kim (Suwon-si, KR); Sang Hoon Kim (Suwon-si, KR)
Assignee: Samsung Electro-Mechanics Co., Ltd.
H01Q1/38H01Q1/2283H01Q1/243H01Q1/248H01Q9/285H01Q21/08H01Q21/28H01Q21/061H01Q21/062
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Quick Facts
Patent No.
US 11,605,883
App. No.
15/994,723
Granted
Mar 14, 2023
Kind
B2
Abstract

An antenna module includes an integrated circuit (IC), a substrate having a first region having one or more antenna disposed on a surface thereof and a second region flexibly bent and electrically connected to the IC to provide an electrical connection path to the one or more antenna and the IC, a set substrate electrically connected to the IC, and a set module disposed on the set substrate between the set substrate and the first region.

Claims (25)

1. An antenna module, comprising:

an integrated circuit (IC);

a first substrate, comprising a first region comprising one or more first antenna disposed on a first surface of the first substrate, and a second region, comprising flexible properties, and electrically connected to the IC to provide an electrical connection path to the one or more first antenna and the IC;

a set substrate, electrically connected to the IC; and

a set module, disposed on the set substrate between the set substrate and the first region,

wherein the IC is separated from the set module by the first substrate interposed therebetween, and

wherein the first substrate is disposed to be spatially separate from the set substrate.

2. The antenna module of claim 1 , further comprising:

a rigid substrate connected to the second region and disposed on the set substrate,

wherein the IC is disposed on the rigid substrate.

3. The antenna module of claim 1 , further comprising:

an electronic component disposed on one of a first surface of the second region and a second surface of the second region,

wherein the IC is disposed on the first surface of the second region or the second surface of the second region, and is electrically connected to the electronic component.

4. The antenna module of claim 1 , wherein the set module is configured to generate a signal,

wherein the set substrate is configured to transmit the signal to the IC, and

wherein the IC is configured to convert the signal into a radio frequency (RF) signal in a millimeter wave (mmWave) band.

5. The antenna module of claim 1 , wherein the set module comprises a DC-DC converter configured to generate power, and

wherein the set substrate is configured to transmit the power to the IC.

6. The antenna module of claim 1 , wherein at least one of the one or more first antenna comprises a patch antenna, and

wherein a width of the first region is greater than a width of the second region.

7. The antenna module of claim 6 , wherein the at least one first antenna is disposed in an n by n array, where n is a natural number of 2 or more.

8. The antenna module of claim 6 , further comprising one or more second antenna disposed on the first surface of the first region,

wherein the one or more second antenna comprises one or more of a dipole antenna and a monopole antenna.

9. The antenna module of claim 1 , further comprising a second substrate comprising a third region comprising one or more second antenna disposed on a surface thereof and a fourth region flexibly bent and electrically connected to the IC to provide an electrical connection path to the one or more second antenna and the IC.

10. The antenna module of claim 1 , wherein the second region of the first substrate is connected to a side surface of the IC.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2018
From: KIM, YOUNG BAL; KIM, WAN SOO; KIM, SANG HOON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 045956/0375 →
Priority Claims (2)
KR 10-2017-0096446 · Jul 28, 2017 · national
KR 10-2017-0115767 · Sep 11, 2017 · national
Continuity (1)
Related Publication 20190036207A1 · Jan 31, 2019
Cited By (1)
US 12,683,634