Chalcogenide phase change material based all-optical switch and manufacturing method therefor
Disclosed in the present invention are a chalcogenide phase change material based all-optical switch and a manufacturing method therefor, relating to the field of optical communications. The all-optical switch comprises: stacked in sequence, a cover layer film, a chalcogenide phase change material film, an isolation layer film, a silicon photonic crystal, and a substrate. The silicon photonic crystal comprises a nano-porous structure such that the silicon photonic crystal has a Fano resonance effect. When the all-optical switch is used, the state of the chalcogenide phase change material film is controlled by means of laser, and the resonance state of the silicon photonic crystal is modulated to implement modulation of signal light transmissivity; the modulation range is within a communication band from 1500 nm to 1600 nm, thereby implementing an optical switch. The all-optical switch of the present invention has the characteristics of high contrast ratio, high rate and low loss.
1. A chalcogenide phase change material based all-optical switch, comprising a cover layer film ( 104 ), a chalcogenide phase change material film ( 103 ), an isolation layer film ( 102 ), and a silicon photonic crystal ( 101 ) and a substrate ( 100 ) stacked in sequence,
wherein the silicon photonic crystal ( 101 ) comprises a nano-porous structure ( 120 ), so that the silicon photonic crystal ( 101 ) has a Fano resonance effect,
wherein a radius of nanopores in the nano-porous structure ( 120 ) is 50 nm to 90 nm, and a spacing between the nanopores is 700 nm to 850 nm, a depth of the nanopores is 150 nm to 250 nm.
2. The chalcogenide phase change material based all-optical switch according to claim 1 , wherein a thickness of the chalcogenide phase change material film ( 103 ) is 5 nm to 25 nm, and the chalcogenide phase change material film ( 103 ) is a multi-component chalcogenide phase change material or a doped compound formed by doping impurities with the multi-component chalcogenide phase change material.
3. The chalcogenide phase change material based all-optical switch according to claim 2 , wherein the multi-component chalcogenide phase change material is GeTe, SbTe, Bi 2 Te 3 , GeSe, Bi 2 Se 3 , Ge 2 Sb 2 Te 5 or AgInSbTe, and the impurities are C, N, O, Ag or Cu.
4. The chalcogenide phase change material based all-optical switch according to claim 1 , wherein a thickness of the isolation layer film ( 102 ) is 15 nm to 40 nm, and the isolation layer film ( 102 ) is a SiO 2 film or a SiN x film.
5. The chalcogenide phase change material based all-optical switch according to claim 1 , wherein a thickness of the cover layer film ( 104 ) is 20 nm to 200 nm, and the cover layer film ( 104 ) is a SiO 2 /ZnS film, a SiO 2 film or a SiN X film.
6. The chalcogenide phase change material based all-optical switch according to claim 1 , wherein when the all-optical switch is in use, the state of the chalcogenide phase change material film ( 103 ) is controlled by laser, and a resonance state of the silicon photonic crystal ( 101 ) is modulated to realize modulation of signal light transmittance, a modulation range is 1500 nm to 1600 nm in a communication band, thereby realizing optical switching.
7. A manufacturing method of the chalcogenide phase change material based all-optical switch according to claim 1 , comprising:
(1) depositing a single crystal silicon material on the substrate, and etching the nanopores on the single crystal silicon material to form the silicon photonic crystal;
(2) depositing the isolation layer film with a thickness of 15 nm to 40 nm on the silicon photonic crystal;
(3) depositing the chalcogenide phase change material film with a thickness of 5 nm to 25 nm on the isolation layer film;
(4) depositing the cover layer film with a thickness of 20 nm to 200 nm and having oxidation resistance on the chalcogenide phase change material film to obtain the all-optical switch.
8. The manufacturing method of the chalcogenide phase change material based all-optical switch according to claim 7 , wherein the etching process is electron beam lithography or ion-coupled plasma etching, and the deposition process is chemical vapor deposition, physical vapor deposition, electron beam evaporation coating, pulsed laser deposition, atomic layer deposition, DC magnetron sputtering or radio frequency magnetron sputtering.