Maskless air gap enabled by a single damascene process
A method for fabricating an integrated circuit comprises forming one or more conductive features supported by pillars of a first insulating layer in a first metal layer. One or more vias are formed in a via layer, the one or more vias over and on the first metal layer and in electrical connection with ones of the one or more conductive features. Subsequent to via formation, air gaps are between adjacent ones of the one or more conductive features in the first metal layer to separate the one or more conductive features. A second insulating layer is formed over the one or more conductive features and over the one or more vias, such that the second insulating layer covers the first metal layer and the via layer while bridging over the air gaps, wherein tops the air gaps are substantially coplanar with tops of the one or more conductive features.
1. An integrated circuit structure, comprising:
one or more conductive features supported by pillars of a first insulating layer in a first metal layer;
one or more vias in a via layer, the one or more vias over and on the first metal layer and in electrical connection with ones of the one or more conductive features;
air gaps between adjacent ones of the one or more conductive features in the first metal layer to separate the one or more conductive features; and
a second insulating layer over the one or more conductive features and over the one or more vias, such that the second insulating layer covers the first metal layer, the pillars of the first insulating layer, and the via layer while bridging over the air gaps, wherein tops the air gaps are substantially coplanar with tops of the one or more conductive features.
2. The integrated circuit structure of claim 1 , wherein the air gaps have a pitch of less than approximately 50 nm.
3. The integrated circuit structure of claim 2 , wherein the air gaps have a pitch of approximately 10 to 45 nm.
4. The integrated circuit structure of claim 1 , wherein the one or more conductive features comprise a conductive material layer on a base layer.
5. The integrated circuit structure of claim 4 , wherein the base layer comprise a conductive seed layer on a conductive barrier layer.
6. The integrated circuit structure of claim 1 , wherein the one or more conductive features in the first metal layer supported by the pillars of the first insulating layer further include a first etch stop layer beneath the pillars of the first insulating layer.
7. The integrated circuit structure of claim 1 , further comprising:
a second etch stop layer along a top surface of the one or more conductive features and the vias, and along sidewalls formed by the one or more conductive features and the first insulating layer beneath the one or more conductive features.
8. The integrated circuit structure of claim 7 , wherein the second insulating layer is over the second etch stop layer.
9. The integrated circuit structure of claim 1 , further comprising:
one or more additional conductive features in a third metal layer over the via layer, wherein at least a portion of the vias electrically connect the one or more additional conductive features with the one or more conductive features in the first metal layer.