Wire bonding apparatus and wire bonding method

1. A wire bonding apparatus bonding a wire to a bonding portion of a workpiece by generating an ultrasonic vibration in a state of pressing the wire onto the bonding portion, the apparatus comprising:

a bonding tool causing the wire to contact the bonding portion of the workpiece and applying a load;

an ultrasonic horn generating the ultrasonic vibration;

a load sensor continuously detecting the load applied from the bonding tool to the bonding portion of the workpiece; and

a controller controlling an operation of the bonding tool and the ultrasonic horn, the controller analyzing data of the load output from the load sensor between when the wire contacts the bonding portion of the workpiece and when the ultrasonic vibration is generated, and controlling the operation of the bonding tool and the ultrasonic horn based on an analysis result;

wherein the controller calculates a determination value from the load detected by the load sensor between when the wire contacts the bonding portion of the workpiece and when the ultrasonic vibration is generated, and controls the operation of the bonding tool and the ultrasonic horn based on the determination value; and

wherein the determination value is a time integral of the load in an arbitrary time interval of a load signal waveform based on a bump in the bonding portion of the workpiece and detected by the load sensor between when the wire contacts the bonding portion of the workpiece and when the ultrasonic vibration is generated.

2. The apparatus according to claim 1 , wherein when the determination value is within a reference range that is preset, the controller performs a bonding operation of bonding the wire to the bonding portion by causing the ultrasonic vibration to be generated from the ultrasonic horn in a state in which the load is applied from the bonding tool to the bonding portion, and

when the determination value is outside the reference range, the controller stops the operation of the bonding tool and the ultrasonic horn without performing the bonding operation.

3. The apparatus according to claim 1 , wherein

when the determination value is within a reference range that is preset, the controller performs a bonding operation of bonding the wire to the bonding portion by causing the ultrasonic vibration to be generated from the ultrasonic horn in a state in which the load is applied from the bonding tool to the bonding portion, and

when the determination value is outside the reference range, the controller stops the operation of the bonding tool and the ultrasonic horn after performing the bonding operation.

4. The apparatus according to claim 1 , wherein

when the determination value is within a reference range that is preset, the controller uses a first condition to perform a bonding operation of bonding the wire to the bonding portion by causing the ultrasonic vibration to be generated from the ultrasonic horn in a state in which the load is applied from the bonding tool to the bonding portion, and

when the determination value is outside the reference range, the controller uses a second condition to perform the bonding operation, the second condition being different from the first condition.

5. The apparatus according to claim 4 , wherein

the first condition and the second condition are different from each other for at least an output of the ultrasonic vibration generated from the ultrasonic horn.

6. The apparatus according to claim 4 , wherein

the first condition and the second condition are different from each other for at least a duration that the bonding operation is performed.

7. The apparatus according to claim 4 , wherein

the first condition and the second condition are different from each other for at least the load applied from the bonding tool to the bonding portion.