IP Library Granted Patent US 11,610,926
Granted Patent B2
US 11,610,926 · App. 17/228,329 · Granted Mar 21, 2023

Image sensing device with structural reinforcement layer

Inventors: Yun Hui Yang (Icheon-si, KR); Tae Gyu Park (Icheon-si, KR); Dong Bin Park (Icheon-si, KR)
Assignee: SK hynix Inc.
H01L27/14627H01L27/14621H01L27/14623H01L27/14645H01L27/14685
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Quick Facts
Patent No.
US 11,610,926
App. No.
17/228,329
Granted
Mar 21, 2023
Kind
B2
Abstract

An image sensing device that includes a reinforced structure is disclosed. The image sensing device includes a semiconductor substrate structured to include a pixel region including a plurality of unit pixels and a peripheral region located outside the pixel region, a plurality of microlenses disposed over the semiconductor substrate in the pixel region, a structural reinforcement layer disposed over the semiconductor substrate in the peripheral region, and a lens capping layer structured to cover the microlenses and at least of the structural reinforcement layer. The structural reinforcement layer includes a plurality of fingers each finger vertically structured to have a rounded upper end and laterally extend to have a predetermined length toward the pixel region. The fingers are consecutively arranged and connected to each other in a lateral direction, and side surfaces of fingers are in contact with side surfaces of immediately adjacent fingers.

Claims (32)

1. An image sensing device comprising:

a semiconductor substrate structured to include a pixel region, which includes a plurality of unit pixels, and a peripheral region located outside the pixel region;

a plurality of microlenses disposed over the semiconductor substrate in the pixel region;

a structural reinforcement layer disposed over the semiconductor substrate in the peripheral region; and

a lens capping layer structured to cover the microlenses and at least part of the structural reinforcement layer,

wherein the structural reinforcement layer includes:

a plurality of fingers each finger vertically structured to have a rounded upper end and laterally extend to have a predetermined length toward the pixel region,

wherein the plurality of fingers is consecutively arranged and connected to each other in a lateral direction, and side surfaces of fingers are in contact with side surfaces of immediately adjacent fingers.

2. The image sensing device according to claim 1 , wherein each of the fingers includes:

a body portion structured to be in contact with side surfaces of body portions of the immediately adjacent fingers; and

an edge portion formed to protrude from the body portion and have a rounded protruded portion.

3. The image sensing device according to claim 2 , wherein the lens capping layer includes an edge located at the body portion.

4. The image sensing device according to claim 1 , further comprising a plurality of extra microlenses disposed in the peripheral region between the structural reinforcement layer and the microlenses in the pixel region.

5. The image sensing device according to claim 4 , wherein at least one of the extra microlenses is connected to the microlenses in the pixel region, and the extra microlenses are spaced apart from the structural reinforcement layer by a predetermined distance.

6. The image sensing device according to claim 4 , wherein the extra microlenses are continuously arranged to be connected to the microlenses in the pixel region and the structural reinforcement layer.

7. The image sensing device according to claim 1 , further comprising:

an over-coating layer located below the microlenses in the pixel region and the structural reinforcement layer.

8. The image sensing device according to claim 1 , further comprising a light shielding layer structured to shield the semiconductor substrate in the peripheral region from light.

9. The image sensing device according to claim 1 , wherein the structural reinforcement layer is formed in an annular shape surrounding the microlenses.

10. An image sensing device comprising:

a planarization layer formed over a lower structure including sensor pixels structured to detect incident light to output electrical signals indicative of an image of the incident light;

a plurality of microlenses disposed over the planarization layer to converge incident light onto the sensor pixels;

a structural reinforcement layer disposed over the planarization layer to surround the microlenses; and

a lens capping layer disposed over the microlenses and the structural reinforcement layer,

wherein the structural reinforcement layer includes a plurality of fingers, each of which has a body portion that has a curvature in a short-axis direction and extends to a predetermined length without a curvature in a long-axis direction perpendicular to the short-axis direction,

wherein the plurality of fingers is consecutively arranged adjacent to each other.

11. The image sensing device according to claim 10 , wherein:

the body portion of each finger is structured to vertically extend to a predetermined height, and includes a rounded upper end in the short-axis direction.

12. The image sensing device according to claim 10 , wherein each of the fingers further includes an edge portion formed to protrude from the body portion in the long-axis direction such that side surfaces of the protruding portion are formed to have a curvature in the short-axis direction and the long-axis direction.

13. The image sensing device according to claim 10 , wherein the lens capping layer includes an edge located at the body portion.

14. The image sensing device according to claim 10 , wherein the microlenses are arranged in a manner that outermost microlenses from among the microlenses are spaced apart from the structural reinforcement layer by a predetermined distance.

15. The image sensing device according to claim 10 , wherein the microlenses are arranged in a manner that outermost microlenses from among the microlenses are arranged to be connected to the structural reinforcement layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 12, 2021
From: YANG, YUN HUI; PARK, TAE GYU; PARK, DONG BIN
To: SK HYNIX INC.
Reel/Frame 055895/0341 →
Priority Claims (1)
KR 10-2020-0085538 · Jul 10, 2020 · national
Continuity (1)
Related Publication 20220013564A1 · Jan 13, 2022
Cited By (1)
US 12,727,268