Organic light-emitting display panel comprising via hole in non-display area, method for preparing the same and display device

1. A method for preparing an organic light-emitting display panel, comprising:

providing a substrate, wherein the substrate comprises a non-display area and a display area surrounding the non-display area;

forming a barrier layer on the substrate and forming a pixel circuit on the barrier layer, wherein an orthographic projection of the pixel circuit on the substrate and an orthographic projection of the non-display area on the substrate do not overlap;

patterning the barrier layer in the non-display area to form at least one via hole penetrating the barrier layer;

patterning the substrate by using the barrier layer as a mask in the non-display area to form a groove; wherein the groove is in a position corresponding to the via hole on the substrate, an opening width of a side of the groove close to the barrier layer is larger than a width of the via hole, and the groove and the barrier layer form an undercut structure;

forming a light emitting layer on the pixel circuit, wherein the light emitting layer is disconnected at a side wall of the undercut structure; and

forming a thin film encapsulation layer covering the light emitting layer and the side wall of the undercut structure on the light emitting layer;

wherein a position of an opening of the undercut structure is configured to be cut to form a camera area, and an edge of camera area falls into the undercut structure;

wherein a disconnected part, arranged in the undercut structure, of the light emitting layer contacts a bottom of the undercut structure.

2. The method according to claim 1 , wherein said forming the pixel circuit on the substrate comprises:

forming a plurality of films of the pixel circuit on the substrate, and sequentially patterning the plurality of films, wherein the plurality of films comprise a metal layer, a semiconductor layer and an insulating layer;

wherein in the non-display area, the metal layer is removed in an exposure process.

3. The method according to claim 1 , wherein said patterning the substrate by using the barrier layer as a mask comprises:

etching the substrate in a dry etching process by using the barrier layer as the mask.

4. The method according to claim 1 , wherein said forming the light emitting layer on the pixel circuit comprises:

forming the light emitting layer on the pixel circuit by an evaporation method.

5. The method according to claim 1 , wherein the thin film encapsulation layer comprises at least one organic layer and at least one inorganic layer which are alternately stacked.

6. The method according to claim 5 , wherein the thin film encapsulation layer comprises a first inorganic layer, an organic layer, and a second inorganic layer arranged on a side, facing away from the first inorganic layer, of the organic layer; and

said forming the thin film encapsulation layer on the light emitting layer comprises:

forming the first inorganic layer on the light emitting layer by a vapor deposition method;

forming the organic layer on the first inorganic layer by means of ink-jet printing; and

forming the second inorganic layer on the organic layer by the vapor deposition method.

7. The method according to claim 1 , wherein in a direction perpendicular to the barrier layer, a thickness of the groove ranges from 2 μm to 5 μm, or the thickness of the groove ranges from 20% to 80% of a thickness of the substrate.

8. The method according to claim 1 , wherein in a direction parallel to the barrier layer, a width of side erosion of a side, near the pixel circuit, of the undercut structure ranges from 0.3 μm to 3 μm.

9. The method according to claim 1 , wherein the substrate is a flexible substrate.

10. The method according to claim 1 , wherein an inorganic insulating layer in the pixel circuit is reused as the barrier layer.

11. The method according to claim 1 , wherein a material of the barrier layer is a silicon nitride material or a silicon oxide material.

12. An organic light-emitting display panel, comprising:

a substrate, wherein the substrate comprises a non-display area and a display area surrounding the non-display area;

a barrier layer, wherein the barrier layer is arranged on the substrate, and the non-display area comprises at least one via hole, wherein a position, corresponding to the via hole, of the substrate comprises a groove, and the groove and the barrier layer form an undercut structure;

a pixel circuit, wherein an orthographic projection of the pixel circuit on the substrate and an orthographic projection of the non-display area on the substrate do not overlap;

a light emitting layer, wherein the light emitting layer is arranged on a side, facing away from the substrate, of the pixel circuit, and the light emitting layer is disconnected at a side wall of the undercut structure; and

a thin film encapsulation layer, wherein the thin film encapsulation layer covers the light emitting layer and the side wall of the undercut structure;

wherein a position of an opening of the undercut structure is configured to be cut to form a camera area, and an edge of camera area falls into the undercut structure;

wherein a disconnected part, arranged in the undercut structure, of the light emitting layer contacts a bottom of the undercut structure.

13. The organic light-emitting display panel according to claim 12 , wherein in a direction perpendicular to the barrier layer, a thickness of the groove ranges from 2 μm to 5 μm, or the thickness of the groove ranges from 20% to 80% of a thickness of the substrate.

14. The organic light-emitting display panel according to claim 12 , wherein in a direction parallel to the barrier layer, a width of side erosion of a side, near the pixel circuit, of the undercut structure ranges from 0.3 μm to 3 μm.

15. The organic light-emitting display panel according to claim 12 , wherein the thin film encapsulation layer comprises at least one organic layer and at least one inorganic layer which are alternately stacked.

16. A display device, comprising the organic light-emitting display panel according to claim 12 .