Communication module
A feed line connects an RFIC and a radiating element. A baseband ground plane (BB ground) is connected to a ground terminal of a BBIC. A radio frequency ground plane (RF ground) is placed in such a manner as to overlap the BB ground. The RF ground serves as a return path of the feed line. A first inter-ground connection circuit connects the BB ground and the RF ground. Furthermore, a second inter-ground connection circuit connects the BB ground and the RF ground. Connecting parts between these grounds and the second inter-ground connection circuit are arranged closer to the edges of these grounds than connecting parts between these grounds and the first inter-ground connection circuit. The connecting part between the ground and the second inter-ground connection circuit is placed on one side of a certain imaginary straight line that passes substantially the geometric center of the ground.
1. A communication module comprising:
a baseband integrated circuit that performs processing of a baseband signal;
a radio frequency integrated circuit that performs processing of a radio frequency signal based on a control signal and a low frequency signal supplied from the baseband integrated circuit;
a radiating element;
a feed line that connects the radio frequency integrated circuit and the radiating element;
a baseband ground plane connected to a ground terminal of the baseband integrated circuit;
a radio frequency ground plane arranged to overlap the baseband ground plane, the radio frequency ground plane serving as a return path of the feed line;
a first inter-ground connection circuit that connects the baseband ground plane and the radio frequency ground plane; and
at least one second inter-ground connection circuit that connects the baseband ground plane and the radio frequency ground plane, wherein
a first connecting part between the baseband ground plane and the second inter-ground connection circuit and a second connecting part between the radio frequency ground plane and the second inter-ground connection circuit are arranged closer to respective edges of the baseband ground plane and the radio frequency ground plane than a third connecting part between the baseband ground plane and the first inter-ground connection circuit and a fourth connecting part between the radio frequency ground plane and the first inter-ground connection circuit, and
the first connecting part and the second connecting part are arranged on a first side of a first imaginary straight line that passes a geometric center of the baseband ground plane and a second side of a second certain imaginary straight line that passes a geometric center of the radio frequency ground plane, respectively.
2. The communication module according to claim 1 , wherein
an impedance of the second inter-ground connection circuit is higher than an impedance of the first inter-ground connection circuit.
3. The communication module according to claim 1 , wherein
the second inter-ground connection circuit includes an inter-layer portion and an intra-layer portion,
the inter-layer portion extends in a thickness direction that separates the baseband ground plane and the radio frequency ground plane, and
the intra-layer portion is:
placed at a same position as at least one of the baseband ground plane or the radio frequency ground plane in the thickness direction,
connects the inter-layer portion and at least one of the baseband ground plane or the radio frequency ground plane, and
has at least one of a capacitance component or an inductance component.
4. The communication module according to claim 2 , wherein
the second inter-ground connection circuit includes an inter-layer portion and an intra-layer portion,
the inter-layer portion extends in a thickness direction that separates the baseband ground plane and the radio frequency ground plane, and
the intra-layer portion is:
placed at a same position as at least one of the baseband ground plane or the radio frequency ground plane in the thickness direction,
connects the inter-layer portion and at least one of the baseband ground plane or the radio frequency ground plane, and
has at least one of a capacitance component or an inductance component.
5. The communication module according to claim 1 , wherein the first inter-ground connection circuit connects inner parts of the baseband ground plane and the radio frequency ground plane.
6. The communication module according to claim 1 , wherein the second inter-ground connection circuit connects the baseband ground plane and the radio frequency ground plane at their respective edges.
7. The communication module according to claim 1 , wherein a first shortest distance from the second inter-ground connection circuit to a first edge of radio frequency ground plane is shorter than a second shortest distance from the first inter-ground connection circuit to a second edge of the radio frequency ground plane.
8. The communication module according to claim 1 , wherein the second inter-ground connection circuit comprises at least one conductor post.
9. The communication module according to claim 8 , wherein the first shortest distance from the second inter-ground connection circuit to the first edge of radio frequency ground plane is 2.5 times a diameter of the conductor post of the second inter-ground connection circuit or lower.
10. The communication module according to claim 1 , wherein a plurality of second inter-ground connection circuits are arranged along an edge corresponding to a short side of the radio frequency ground plane.
11. The communication module according to claim 1 , wherein a plurality of second inter-ground connection circuits are arranged along two mutually adjacent edges of the radio frequency ground plane at substantially equal intervals.
12. The communication module according to claim 1 , wherein the baseband integrated circuit and the radio frequency integrated circuit are arranged on different multilayer substrates stacked on top of each other in a thickness direction.
13. The communication module according to claim 1 , wherein the baseband integrated circuit and the radio frequency integrated circuit are arranged on a bottom surface of a common multilayer substrate.
14. The communication module according to claim 1 , wherein the radiating element is arranged above the feed line.
15. A communication module comprising:
a baseband integrated circuit that performs processing of a baseband signal;
a radio frequency integrated circuit that performs processing of a radio frequency signal based on a control signal and a low frequency signal supplied from the baseband integrated circuit;
a radiating element;
a feed line that connects the radio frequency integrated circuit and the radiating element;
a baseband ground plane connected to a ground terminal of the baseband integrated circuit;
a radio frequency ground plane arranged to overlap the baseband ground plane, the radio frequency ground plane serving as a return path of the feed line;
a first inter-ground connection circuit that connects the baseband ground plane and the radio frequency ground plane;
a baseband ground terminal that connects the baseband ground plane to a land of an external board;
a radio frequency ground terminal; and
a second inter-ground connection circuit that connects the radio frequency ground plane and the radio frequency ground terminal, wherein
a first connecting part between the radio frequency ground plane and the second inter-ground connection circuit is placed closer to an edge of the radio frequency ground plane than a second connecting part between the radio frequency ground plane and the first inter-ground connection circuit, and
the first connecting part is placed on one side of an imaginary straight line that passes a geometric center of the radio frequency ground plane.
16. The communication module according to claim 15 , wherein the second inter-ground connection circuit comprises at least one conductor post.
17. The communication module according to claim 16 , wherein the second inter-ground connection circuit comprises a first conductor post inside a first sealing resin layer, a via conductor inside a multilayer substrate, and a second conductor post inside a second sealing resin layer.
18. The communication module according to claim 17 , wherein the via conductor is not connected to the baseband ground plane.
19. The communication module according to claim 17 , wherein the via conductor passes through an opening formed in the baseband ground plane.
20. The communication module according to claim 15 , wherein the first inter-ground connection circuit connects inner parts of the baseband ground plane and the radio frequency ground plane.
21. The communication module according to claim 15 , wherein an impedance of the second inter-ground connection circuit is higher than an impedance of the first inter-ground connection circuit.
22. The communication module according to claim 15 , wherein the radiating element is arranged above the feed line.