Bamboo-like copper crystal particles having a highly preferred orientation
An electroplating copper layer includes bamboo-like copper crystal particles having a highly preferred orientation. The bamboo-like copper crystal particles have a long axis direction and a short axis direction, and the bamboo-like copper crystal particles have a length of 20 nm to 5 μm in the long axis direction and a length of 20 nm to 2 μm in the short axis direction. The bamboo-like copper crystal particles have a uniform particle size, and the electroplating copper layer has a major diffraction peak at a 2θ angle of about 44°.
1. An electroplated copper layer comprising:
a first plurality of copper crystal particles having a first orientation, the first orientation being a direction perpendicular to a copper substrate on which the electroplated copper layer is deposited; and
a second plurality of copper crystal particles having a second orientation, the second orientation and the first orientation forms an angle of greater than 0° and less than 45°, and the second plurality of copper crystal particles constituting 50-90% of a total of the first plurality of copper crystal particles and the second plurality of copper crystal particles,
wherein the first plurality of copper crystal particles have a length of 20 nm to 5 μm in the first orientation and the second plurality of copper crystal particles have a length of 20 nm to 2 μm in the second orientation; and
where the electroplated copper layer is prepared by a method comprising:
providing a substrate;
conducting a direct current copper electroplating on the substrate in a copper plating solution at a plating current density of 3 to 30 A/dm 2 ; and
depositing the copper crystal particles on the substrate to form the electroplated copper layer,
wherein the copper plating solution includes copper plating additives and a copper plating base solution;
wherein the copper base solution includes copper sulfate, sulfuric acid, and a trace amount of hydrochloric acid or sodium chloride, and the copper base solution has a concentration of copper ions of 40-60 g/L, a concentration of sulfate ions of 80-120 g/L, and a concentration of chloride ions of 40-60 ppm;
wherein the copper plating additives include an accelerator, a suppressor, and a non-dye leveler, the accelerator has a concentration of 3 to 5 mL/L, the suppressor has a concentration of 5 to 15 mL/L, and the non-dye leveler has a concentration of 25 to 35 mL/L; and
wherein the non-dye leveler is
2. The electroplated copper layer of claim 1 , wherein the electroplated copper layer has a major diffraction peak at a 2θ angle of about 44°.