Electronic apparatus and method for manufacturing the same
Provided is an electronic apparatus including a window, a display panel disposed below the window, a digitizer disposed below the display panel and including a first surface and a second surface opposing the first surface, a first adhesive layer disposed on the first surface, and a second adhesive layer disposed below the second surface, wherein the first adhesive layer and the second adhesive layer are two-time-cured. Accordingly, an electronic apparatus having improved folding and viewability properties may be provided.
1. An electronic apparatus comprising:
a window;
a display panel disposed below the window;
a digitizer disposed below the display panel and including a first surface and a second surface opposing the first surface;
a first adhesive layer disposed on the first surface; and
a second adhesive layer disposed below the second surface,
wherein a third surface of each of the first adhesive layer and the second adhesive layer is flatter than a fourth surface of each of the first adhesive layer and the second adhesive layer, the fourth surface faces the digitizer, and the third surface is opposite to the fourth surface.
2. The electronic apparatus of claim 1 , wherein the first adhesive layer and the second adhesive layer each have a storage modulus of about 0.01 megapascals (MPa) to about 5 MPa at −20 degrees in Celsius (° C.).
3. The electronic apparatus of claim 1 , wherein the first adhesive layer and the second adhesive layer each have a thickness of about 10 micrometers (μm) to about 50 μm in a thickness direction.
4. The electronic apparatus of claim 1 , further comprising a first sub-adhesive layer disposed on the first adhesive layer,
wherein the first sub-adhesive layer has a lower storage modulus than the first adhesive layer.
5. The electronic apparatus of claim 4 , wherein the first sub-adhesive layer has a storage modulus of about 0.01 MPa to about 1 MPa at −20° C.
6. The electronic apparatus of claim 4 , wherein a sum of the thicknesses of the first sub-adhesive layer and the first adhesive layer is about 10 μm to about 50 μm in a thickness direction.
7. The electronic apparatus of claim 1 , further comprising a second sub-adhesive layer disposed below the second adhesive layer,
wherein the second sub-adhesive layer has a lower storage modulus than the second adhesive layer.
8. The electronic apparatus of claim 7 , wherein the second sub-adhesive layer has a storage modulus of about 0.01 MPa to about 1 MPa at −20° C.
9. The electronic apparatus of claim 7 , wherein a sum of the thicknesses of the second sub-adhesive layer and the second adhesive layer is about 10 μm to about 50 μm in a thickness direction.
10. The electronic apparatus of claim 1 , wherein the digitizer comprises a plurality of first sensing coils and a plurality of second sensing coils.
11. The electronic apparatus of claim 1 , further comprising a shielding layer disposed below the second adhesive layer,
wherein the shielding layer includes magnetic metal powder.
12. The electronic apparatus of claim 1 , wherein the electronic apparatus comprises a folding area that is foldable with respect to a virtual folding axis extending in one direction, a first non-folding area extending from a first side of the folding area, and a second non-folding area extending from a second side of the folding area, and the first side is opposite to the second side.
13. The electronic apparatus of claim 1 , further comprising at least one of an input sensing panel and an optical member, wherein the at least one is disposed between the window and the display panel.
14. The electronic apparatus of claim 1 , further comprising at least one of a lower film and a cushion layer, wherein the at least one is disposed below the display panel.
15. An electronic apparatus comprising:
a window;
a display panel disposed below the window;
a first sub-adhesive layer disposed below the display panel;
a first adhesive layer disposed below the first sub-adhesive layer;
a second adhesive layer disposed below the first adhesive layer; and
a digitizer disposed between the first adhesive layer and the second adhesive layer,
wherein the first sub-adhesive layer has a lower storage modulus than the first adhesive layer.
16. The electronic apparatus of claim 15 , further comprising a second sub-adhesive layer disposed below the second adhesive layer,
wherein the second sub-adhesive layer has a lower storage modulus than the second adhesive layer.
17. A method for manufacturing an electronic apparatus, the method comprising:
disposing a display panel below a window; and
disposing a detection sensor unit below the display panel,
wherein the disposing of the detection sensor unit comprises:
stacking a digitizer between a first adhesive layer in a semi-cured state and a second adhesive layer in a semi-cured state;
increasing flatness of a first surface of each of the first adhesive layer and the second adhesive layer, wherein a second surface of each of the first adhesive layer and the second adhesive layer faces the digitizer, and the first surface is opposite to the second surface; and
providing light to the first adhesive layer and the second adhesive layer for full-curing.
18. The method of claim 17 , wherein the increasing of the flatness of the first adhesive layer and the second adhesive layer includes providing heat to the first adhesive layer and the second adhesive layer.
19. The method of claim 17 , further comprising forming a first sub-adhesive layer on the first adhesive layer.
20. The method of claim 19 , further comprising forming a second sub-adhesive layer below the second adhesive layer.