IP Library Granted Patent US 11,618,945
Granted Patent B2
US 11,618,945 · App. 16/663,423 · Granted Apr 4, 2023

Methods of producing optically-finished thin diamond substrates or windows of high aspect ratio

Inventors: Wen-Qing Xu (Medfield, MA); Thomas E. Anderson (Morristown, NJ); Giovanni Barbarossa (Saratoga, CA); Elgin E. Eissler (Renfrew, PA); Chao Liu (Butler, PA); Charles D. Tanner (Saxonburg, PA)
Assignee: II-VI DELAWARE, INC.
C23C16/274C23C16/01C23C16/511C23C16/56
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Quick Facts
Patent No.
US 11,618,945
App. No.
16/663,423
Granted
Apr 4, 2023
Kind
B2
Abstract

In a method of forming a diamond film, substrate, or window, a substrate is provided and the diamond film, substrate, or window is CVD grown on a surface of the substrate. The grown diamond film, substrate, or window has a thickness between 150-999 microns and an aspect ratio≥100, wherein the aspect ratio is a ratio of a largest dimension of the diamond film, substrate or window divided by a thickness of the diamond film. The substrate can optionally be removed or separated from the grown diamond film, substrate, or window.

Claims (20)

1. A method of forming a free-standing diamond film comprising:

(a) CVD growing on a surface of a substrate a diamond film having an aspect ratio ≥100 and a thickness between 150-999 microns, wherein the grown diamond film has a nucleation side surface and a growth side surface opposite the nucleation side surface and the nucleation side surface of the grown diamond film has an optical finish having a surface roughness (Ra)≤50 nm;

(b) removing the substrate from the grown diamond film; and

(c) polishing the surface of the substrate to an optical finish having a surface roughness (Ra)≤20 nm wherein the polishing is completed prior to the CVD growing step,

wherein the method further comprises the step of polishing the growth side surface to an optical finish having a surface roughness (Ra)≤50 nm and the polishing the growth side surface step occurs after the growing step and prior to the removing step.

2. The method of claim 1 , wherein the substrate has a thickness ≥2 mm.

3. The method of claim 1 , wherein, prior to step (a), the surface of the substrate is seeded with diamond particles.

4. The method of claim 3 , wherein the substrate is seeded with diamond particles via at least one of the following processes: (1) ultrasonic treatment of the substrate in a ultrasonic bath comprised of a submicron or micron-sized diamond powder in a liquid suspension solution; and (2) ultrasonic treatment of the substrate in a ultrasonic bath comprised of nano-crystal diamond powder having an average particle size <100 nm in a liquid suspension solution.

5. The method of claim 4 , wherein the liquid suspension solution comprises one or more of the following: water, alcohol, hydrocarbon, and organic solvent.

6. The method of claim 5 , wherein the substrate is seeded with diamond particles via a least one of the following processes: (1) ultrasonic treatment of the substrate in a bath of aqueous diamond slurries or organic diamond slurries, or (2) rubbing the substrate with diamond powders.

7. The method of claim 1 , wherein the largest dimension of the substrate is a diameter of the substrate.

8. The method of claim 1 , wherein the substrate has a thickness ≥8 mm.

9. The method of claim 1 , further including, prior to step (a), polishing the surface of the substrate to an optical finish having a surface roughness (Ra)≤2 nm.

10. The method of claim 1 , wherein polishing the growth side surface includes polishing the growth side to an optical finish having a surface roughness (Ra)≤30 nm.

11. The method of claim 1 , wherein polishing the growth side surface includes polishing the growth side to an optical finish having a surface roughness (Ra)≤20 nm.

12. The method of claim 1 , wherein polishing the growth side surface includes polishing the growth side to an optical finish having a surface roughness (Ra)≤15 nm.

13. The method of claim 1 , wherein polishing the growth side surface includes polishing the growth side to an optical finish having a surface roughness (Ra)≤10 nm.

14. The method of claim 1 , wherein the diamond film has a diamond nucleation density ≥1.0×10 5 /cm 2 .

15. The method of claim 1 , wherein the surface of the substrate has a shape of at least one of a cone, a pyramid, an asphere, a parabola, a hyperbola, and a non-planar surface.

16. The method of claim 1 , wherein the surface of the substrate is planar.

Assignments (3)
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2019
From: II-VI INCORPORATED
To: II-VI DELAWARE, INC.
Reel/Frame 051210/0411 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2019
From: XU, WEN-QING; ANDERSON, THOMAS E.; BARBAROSSA, GIOVANNI; EISSLER, ELGIN E.; LIU, CHAO; TANNER, CHARLES D.
To: II-VI INCORPORATED
Reel/Frame 050823/0401 →
Continuity (3)
Division 15093160 · Apr 7, 2016
Provisional Application 62148339 · Apr 16, 2015
Related Publication 20200071818A1 · Mar 5, 2020