Electrical devices and methods of manufacture
A die can be applied to a front conductive layer. Openings can be formed in the conductive layer over contact points on the die. The openings can be filled with a conductive material to electrically couple the conductive layer to the contact points on the die. The front conductive layer can be etched to form a first conductive pattern. Conductive standoffs can be formed on portions of the front conductive layer. An additional front conductive layer can be laminated onto the front side. Openings can be formed in the additional front conductive layer over the standoffs. The openings can be filled with a conductive material to electrically couple the additional conductive layer to the underlying standoffs. The additional conductive layer can be etched to form a second conductive pattern.
1. An electrical device comprising:
a die that has electrical circuitry and one or more contacts on a first side for sending or receiving signals to or from the electrical circuitry;
a first conductive layer over the first side of the die and electrically coupled to the one or more contacts, wherein insulating gaps in the first conductive layer provide a first circuit pattern;
one or more conductive standoffs over the first conductive layer and electrically coupled to one or more portions of the first conductive layer;
a second conductive layer over the one or more conductive standoffs, wherein one or more portions of the second conductive layer are electrically coupled to the one or more conductive standoffs, and wherein insulating gaps in the second conductive layer provide a second circuit pattern; and
insulating material between the first conductive layer and the second conductive layer and next to the one or more conductive standoffs.
2. The electrical device of claim 1 , wherein the insulating material extends into a portion of the area between the second conductive layer and the one or more conductive standoffs.
3. The electrical device of claim 1 , comprising:
a portion of insulating material between the one or more conductive standoffs and the second conductive layer; and
one or more openings through the portion of insulating material, wherein the one or more openings include conductive material to electrically couple the one or more conductive standoffs to the second conductive layer, wherein the one or more standoffs have a first area, and wherein the one or more openings have a second area that is smaller than the first area.
4. The electrical device of claim 1 , wherein one of the conductive standoffs has a first area, and wherein the conductive standoff is electrically coupled to the second conductive layer at a second area that is smaller than the first area.
5. The electrical device of claim 1 , wherein the one or more conductive standoffs are plated onto the first conductive layer.
6. The electrical device of claim 1 , comprising:
a third conductive layer over a second side of the die, wherein insulating gaps in the third conductive layer provide a third circuit pattern, wherein the first conductive layer and the third conductive layer both extend laterally past an edge of the die;
an insulating spacer next to the die and between the first conductive layer and the third conductive layer; and
one or more holes through the third conductive layer, through the spacer, and at least to the first conductive layer, wherein the one or more holes include a conductive material to electrically couple the first conductive layer and the third conductive layer.
7. The electrical device of claim 6 , wherein at least one of the one or more contacts on the first side of the die are electrically accessible from a portion of the third conductive layer on the second side of the die.
8. The electrical device of claim 1 , comprising:
a third conductive layer over a second side of the die and electrically coupled to one or more contacts on the second side of the die, wherein insulating gaps in the third conductive layer provide a third circuit pattern;
one or more additional conductive standoffs over the third conductive layer and electrically coupled to one or more portions of the third conductive layer;
a fourth conductive layer over the one or more additional conductive standoffs, wherein one or more portions of the fourth conductive layer are electrically coupled to the one or more additional conductive standoffs, and wherein insulating gaps in the fourth conductive layer provide a fourth circuit pattern; and
insulating material between the third conductive layer and the fourth conductive layer and next to the one or more additional conductive standoffs.
9. The electrical device of claim 8 , comprising:
an insulating spacer next to the die and between the first conductive layer and the fourth conductive layer, wherein the first conductive layer and the fourth conductive layer both extend laterally past an edge of the die;
one or more holes through the fourth conductive layer, through the spacer, and at least to the first conductive layer, wherein the one or more holes include a conductive material to electrically couple the first conductive layer and the fourth conductive layer.