Power-combining devices with increased output power
Power-combining devices, and more particularly spatial power-combining devices with increased output power are disclosed. Increased output power may be realized by increasing a number of transmission paths for amplification that are associated with each amplifier assembly of a spatial power-combining device. Each transmission path may include an input antenna structure, an amplifier, and an output antenna structure for providing amplification of signals that pass therethrough. In this manner, a total number of transmission paths for amplification may be increased without having to increase a total number of amplifier assemblies. Further improvements to electrical separation and stability between neighboring amplifier assemblies may be provided by electrically grounded conductive sheets that are arranged between neighboring amplifier assemblies.
1. A spatial power-combining device comprising a plurality of amplifier assemblies, each amplifier assembly of the plurality of amplifier assemblies comprising:
a body structure comprising a first face and a second face, wherein the second face is on an opposite side of the body structure than the first face;
a first amplifier that is arranged on the first face;
a second amplifier that is arranged on the second face; and
a conductive sheet that covers the first amplifier on the first face, wherein the conductive sheet is electrically grounded to the body structure.
2. The spatial power-combining device of claim 1 , wherein each amplifier assembly further comprises:
a first input antenna structure and a first output antenna structure that are coupled to the first amplifier; and
a second input antenna structure and a second output antenna structure that are coupled to the second amplifier.
3. The spatial power-combining device of claim 2 , wherein:
the first input antenna structure, the first amplifier, and the first output antenna structure are arranged on a first substrate; and
the second input antenna structure, the second amplifier, and the second output antenna structure are arranged on a second substrate.
4. The spatial power-combining device of claim 3 , wherein:
the first face forms a first recess and the first substrate resides within the first recess; and
the second face forms a second recess and the second substrate resides within the second recess.
5. The spatial power-combining device of claim 3 , wherein the first substrate is arranged parallel with the first face and the second substrate is arranged parallel with the second face.
6. The spatial power-combining device of claim 3 , wherein the first substrate is arranged nonparallel with the first face and the second substrate is arranged nonparallel with the second face.
7. The spatial power-combining device of claim 3 , wherein the first substrate is arranged parallel with the first face and the second substrate is arranged nonparallel with the second face.
8. The spatial power-combining device of claim 1 , wherein each amplifier assembly of the plurality of amplifier assemblies forms a wedge shape and the plurality of amplifier assemblies is radially arranged to form a center waveguide section.
9. The spatial power-combining device of claim 1 , wherein the first face of each amplifier assembly of the plurality of amplifier assemblies is arranged to abut the second face of a neighboring amplifier assembly of the plurality of amplifier assemblies.
10. The spatial power-combining device of claim 1 , further comprising an electromagnetic absorber that is arranged on at least a portion of the conductive sheet in a position that is registered with the first amplifier.
11. The spatial power-combining device of claim 1 , wherein:
the first face forms a first recess and the first amplifier resides within the first recess;
the second face forms a second recess and the second amplifier resides within the second recess; and
a portion of the conductive sheet is arranged within the first recess and another portion of the conductive sheet is arranged within the second recess of a neighboring amplifier assembly of the plurality of amplifier assemblies.
12. The spatial power-combining device of claim 1 , wherein the conductive sheet forms a planar shape between neighboring amplifier assemblies of the plurality of amplifier assemblies.
13. The spatial power-combining device of claim 1 , wherein the conductive sheet forms a nonplanar shape between neighboring amplifier assemblies of the plurality of amplifier assemblies.
14. The spatial power-combining device of claim 1 , further comprising an additional conductive sheet that covers the second amplifier on the second face, wherein the additional conductive sheet is electrically grounded to the body structure.
15. The spatial power-combining device of claim 1 , wherein the first amplifier comprises a first monolithic microwave integrated circuit (MMIC) amplifier and the second amplifier comprises a second MMIC amplifier.
16. A spatial power-combining device comprising a plurality of amplifier assemblies, each amplifier assembly of the plurality of amplifier assemblies comprising:
a body structure, wherein a recess is formed in a face of the body structure;
an amplifier that is arranged within the recess; and
a conductive sheet that is electrically grounded to the body structure, wherein the conductive sheet covers the amplifier within the recess.
17. The spatial power-combining device of claim 16 , wherein a portion of the conductive sheet resides outside of the recess.
18. The spatial power-combining device of claim 16 , wherein the conductive sheet is arranged entirely within the recess.
19. The spatial power-combining device of claim 16 , wherein each amplifier assembly further comprises:
an input antenna structure and an output antenna structure that are coupled to the first amplifier; and
a substrate that supports the amplifier, the input antenna structure, and the output antenna structure.
20. The spatial power-combining device of claim 19 , wherein the substrate and the amplifier are entirely arranged within the recess.
21. The spatial power-combining device of claim 19 , wherein each amplifier assembly further comprises one or more electromagnetic interference gaskets that are arranged between the substrate and the conductive sheet.
22. The spatial power-combining device of claim 21 , wherein the one or more electromagnetic interference gaskets are arranged to provide a uniform spacing between the substrate and the conductive sheet.
23. The spatial power-combining device of claim 21 , wherein the conductive sheet is electrically grounded to the body structure through the one or more electromagnetic interference gaskets.
24. The spatial power-combining device of claim 16 , wherein the body structure forms a wedge shape and the conductive sheet forms a planar shape.
25. The spatial power-combining device of claim 16 , wherein the body structure and the conductive sheet form wedge shapes.
26. The spatial power-combining device of claim 25 , wherein the recess is sloped such that a depth of the recess increases across the face of the body structure.
27. The spatial power-combining device of claim 26 , wherein a side of the conductive sheet is parallel with the recess.