Radio-frequency module and communications device
A radio-frequency module includes a mount board, an electronic component, an external connection terminal, and an acoustic wave filter. The mount board has a first principal surface and a second principal surface facing each other. The electronic component is arranged on the first principal surface of the mount board. The external connection terminal is arranged on the second principal surface of the mount board. The acoustic wave filter is arranged on the second principal surface of the mount board. The acoustic wave filter is a bare-chip acoustic wave filter. The radio-frequency module is suppressed in height along a thickness of the mount board.
1. A radio-frequency module comprising:
a mount board having a first principal surface on one side of the mount board and a second principal surface on an opposite side of the mount board;
an electronic component arranged on the first principal surface of the mount board;
an external connection terminal arranged on the second principal surface of the mount board; and
a bare-chip acoustic wave filter arranged on the second principal surface of the mount board,
wherein
the bare-chip acoustic wave filter includes:
a piezoelectric substrate having a first principal substrate surface and a second principal substrate surface on opposite sides of the piezoelectric substrate;
an interdigital transducer (IDT) electrode provided on the first principal substrate surface of the piezoelectric substrate; and
a plurality of pad electrodes provided over the first principal substrate surface of the piezoelectric substrate, wherein
the radio-frequency module further includes a plurality of bumps bonded to the plurality of pad electrodes and the mount board, and
the IDT electrode is arranged in a space between the piezoelectric substrate and the mount board by the plurality of pad electrodes, the plurality of bumps, the piezoelectric substrate, and the mount board.
2. The radio-frequency module of claim 1 , further comprising a resin film arranged on the second principal surface of the mount board and covering at least an outer peripheral surface of the piezoelectric substrate, wherein
the space is surrounded with the bare-chip acoustic wave filter, the second principal surface of the mount board, and the resin film.
3. The radio-frequency module of claim 2 , wherein
the resin film covers the second principal substrate surface of the piezoelectric substrate.
4. The radio-frequency module of claim 3 , further comprising a resin layer arranged on the second principal surface of the mount board and at least partially covering the resin film.
5. The radio-frequency module of claim 4 , wherein
the bare-chip acoustic wave filter includes a reception filter, and
the radio-frequency module further includes an IC chip arranged on the second principal surface of the mount board and including a low-noise amplifier configured to amplify a radio-frequency signal that has passed through the reception filter.
6. The radio-frequency module of claim 5 , wherein
a first distance between the second principal surface of the mount board and a surface, facing away from the mount board, of the bare-chip acoustic wave filter is shorter than a second distance between the second principal surface of the mount board and a surface, facing away from the mount board, of the IC chip.
7. The radio-frequency module of claim 3 , wherein
the bare-chip acoustic wave filter includes a reception filter, and
the radio-frequency module further includes an IC chip arranged on the second principal surface of the mount board and including a low-noise amplifier configured to amplify a radio-frequency signal that has passed through the reception filter.
8. The radio-frequency module of claim 7 , wherein
a first distance between the second principal surface of the mount board and a surface, facing away from the mount board, of the bare-chip acoustic wave filter is shorter than a second distance between the second principal surface of the mount board and a surface, facing away from the mount board, of the IC chip.
9. The radio-frequency module of claim 2 , further comprising a resin layer arranged on the second principal surface of the mount board and at least partially covering the resin film.
10. The radio-frequency module of claim 9 , wherein
the bare-chip acoustic wave filter includes a reception filter, and
the radio-frequency module further includes an IC chip arranged on the second principal surface of the mount board and including a low-noise amplifier configured to amplify a radio-frequency signal that has passed through the reception filter.
11. The radio-frequency module of claim 10 , wherein
a first distance between the second principal surface of the mount board and a surface, facing away from the mount board, of the bare-chip acoustic wave filter is shorter than a second distance between the second principal surface of the mount board and a surface, facing away from the mount board, of the IC chip.
12. The radio-frequency module of claim 2 , wherein
the bare-chip acoustic wave filter includes a reception filter, and
the radio-frequency module further includes an IC chip arranged on the second principal surface of the mount board and including a low-noise amplifier configured to amplify a radio-frequency signal that has passed through the reception filter.
13. The radio-frequency module of claim 12 , wherein
a first distance between the second principal surface of the mount board and a surface, facing away from the mount board, of the bare-chip acoustic wave filter is shorter than a second distance between the second principal surface of the mount board and a surface, facing away from the mount board, of the IC chip.
14. The radio-frequency module of claim 1 , further comprising a resin layer arranged on the second principal surface of the mount board and covering an outer peripheral surface of the piezoelectric substrate, wherein
the space is surrounded with the bare-chip acoustic wave filter, the second principal surface of the mount board, and the resin layer.
15. The radio-frequency module of claim 1 , wherein
the bare-chip acoustic wave filter includes a reception filter, and
the radio-frequency module further includes an IC chip arranged on the second principal surface of the mount board and including a low-noise amplifier configured to amplify a radio-frequency signal that has passed through the reception filter.
16. The radio-frequency module of claim 15 , wherein
a first distance between the second principal surface of the mount board and a surface, facing away from the mount board, of the bare-chip acoustic wave filter is shorter than a second distance between the second principal surface of the mount board and a surface, facing away from the mount board, of the IC chip.
17. The radio-frequency module of claim 1 , wherein
the bare-chip acoustic wave filter includes a reception filter, and
the radio-frequency module further includes an IC chip arranged on the second principal surface of the mount board and including a low-noise amplifier configured to amplify a radio-frequency signal that has passed through the reception filter.
18. The radio-frequency module of claim 17 , wherein
a first distance between the second principal surface of the mount board and a surface, facing away from the mount board, of the bare-chip acoustic wave filter is shorter than a second distance between the second principal surface of the mount board and a surface, facing away from the mount board, of the IC chip.
19. A communications device comprising:
a radio-frequency module; and
a signal processor circuit configured to perform signal processing on a radio-frequency signal passing through the bare-chip acoustic wave filter of the radio-frequency module, wherein the radio-frequency module including
a mount board having a first principal surface on one side of the mount board and a second principal surface on an opposite side of the mount board,
an electronic component arranged on the first principal surface of the mount board,
an external connection terminal arranged on the second principal surface of the mount board, and
a bare-chip acoustic wave filter arranged on the second principal surface of the mount board,
wherein
the bare-chip acoustic wave filter includes:
a piezoelectric substrate having a first principal substrate surface and a second principal substrate surface on opposite sides of the piezoelectric substrate;
an interdigital transducer (IDT) electrode provided on the first principal substrate surface of the piezoelectric substrate; and
a plurality of pad electrodes provided over the first principal substrate surface of the piezoelectric substrate, wherein
the radio-frequency module further includes a plurality of bumps bonded to the plurality of pad electrodes and the mount board, and
the IDT electrode is arranged in a space between the piezoelectric substrate and the mount board by the plurality of pad electrodes, the plurality of bumps, the piezoelectric substrate, and the mount board.