IC socket for semiconductor
Provided is an IC socket for a semiconductor capable of preventing adhesion of dust to a photodetection surface provided on an opposite side of a contact surface of an image sensor with no contact with the photodetection surface. The IC socket for a semiconductor includes: a seat ( 12 ) that has an attachment surface ( 12 a ) to which an image sensor ( 60 ) is attached; a base ( 10 ) that has a placement surface ( 10 b ) on which the seat ( 12 ) is placed and a secured surface ( 10 a ) located on an opposite side of the placement surface ( 10 b ) and secured to an inspection substrate; and a lid member ( 18 ) that does not come into contact with the image sensor ( 60 ) and that covers a back surface region ( 80 ) on a side of a back surface ( 64 ) of the image sensor ( 60 ) when the image sensor ( 60 ) is attached to the seat ( 12 ).
1. An IC socket for a semiconductor comprising: a seat that has an attachment surface to which an image sensor is attached;
a base that has a placement surface on which the seat is placed and a secured surface located on an opposite side of the placement surface and to be secured to an inspection substrate;
a lid member that does not come into contact with the image sensor and that covers a back surface region located on a side of a back surface of the image sensor when the image sensor is attached to the seat; and
a cover that is attached so as to slide relative to the base in a perpendicularly intersecting direction that perpendicularly intersects the attachment surface,
wherein the lid member follows the sliding of the cover to cover and release the back surface region.
2. The IC socket for a semiconductor according to claim 1 , further comprising:
a support shaft that attaches the lid member to the cover such that the lid member is able to turn; and
a releasing mechanism that follows a motion of sliding the cover in a pressing direction directed from a side of the placement surface to a side of the secured surface to cause the lid member to turn around the support shaft so as to release the back surface region.
3. The IC socket for a semiconductor according to claim 1 , further comprising a releasing mechanism that includes a push rod that is secured to the base, is provided to stand in the perpendicularly intersecting direction, and abuts on the lid member to press the lid member in an opening direction.
4. The IC socket for a semiconductor according to claim 1 ,
wherein the lid member has a notch portion at an edge of a distal end located on an opposite side of the support shaft and edges of side surfaces connected to both ends of the edge of the distal end, and
the cover has an abutting portion that has a shape corresponding to the notched portion and touch the notch portion when the lid member is in a closed state.
5. The IC socket for a semiconductor according to claim 1 ,
wherein the lid member has a first lid member and a second lid member, and
the first lid member and the second lid member are disposed to face each other in a same plane.
6. The IC socket for a semiconductor according to claim 1 ,
wherein the lid member has a first lid member and a second lid member, and wherein the first lid member has a notch portion at an edge of a distal end located on an opposite side of the support shaft, and
the second lid member has, at a distal end, an abutting portion that has a shape corresponding to the notched portion and touch the notch portion when the lid member is in a closed state.
7. The IC socket for a semiconductor according to claim 1 , further comprising:
a tubular guide rib that is provided to stand in a pulling direction directed from the secured surface to the placement surface and that surrounds the attachment surface,
wherein when the lid member is in a closed state, the lid member abuts on an end portion of the guide rib on a side of the pulling direction.
8. The IC socket for a semiconductor according to claim 1 , further comprising:
a biasing mechanism that biases the lid member such that the lid member is brought into a closed state.