Photoelectric conversion apparatus, solid-state image sensor and device
A photoelectric conversion apparatus comprises a first semiconductor region of a first conductivity type arranged between a first surface and a second surface, a second semiconductor region of the first conductivity type arranged between the first surface and the second surface and configured to accumulate a signal charge generated by incident light, a third semiconductor region of the first conductivity type arranged between the first surface and the second surface, a fourth semiconductor region of the first conductivity type arranged between the first surface and the second surface and in contact with the third semiconductor region, a first transfer electrode arranged on the first surface, a semiconductor region of the second conductivity type arranged between the third semiconductor region and the second surface, and a semiconductor region of the second conductivity type arranged between the fourth semiconductor region and the second surface.
1. A photoelectric conversion apparatus comprising:
a first semiconductor region of a first conductivity type arranged between a first surface and a second surface;
a second semiconductor region of the first conductivity type arranged between the first surface and the second surface and configured to accumulate a signal charge generated by incident light;
a third semiconductor region of the first conductivity type arranged between the first surface and the second surface;
a fourth semiconductor region of the first conductivity type arranged between the first surface and the second surface and is in contact with the third semiconductor region;
a fifth semiconductor region of a second conductivity type arranged between the fourth semiconductor region and the first surface;
a first transfer electrode arranged on the first surface and configured to form, in the first semiconductor region, a channel for transferring the signal charge accumulated in the second semiconductor region to the third semiconductor region;
a sixth semiconductor region of the second conductivity type arranged between the third semiconductor region and the second surface; and
a seventh semiconductor region of the second conductivity type arranged between the fourth semiconductor region and the second surface,
wherein the third semiconductor region overlaps at least a part of the first transfer electrode and at least a part of the sixth semiconductor region in a planar view,
the sixth semiconductor region and the seventh semiconductor region are electrically connected to each other,
an effective amount of dopant ions per unit area for the seventh semiconductor region is greater than an effective amount of dopant ions per unit area for forming the sixth semiconductor region, and
a depth from the first surface of a position where the seventh semiconductor region is arranged is not less than that of the sixth semiconductor region.
2. The apparatus according to claim 1 , wherein at least a part of the seventh semiconductor region overlaps the third semiconductor region in a planar view.
3. The apparatus according to claim 1 , wherein the effective amount of dopant ions per unit area for forming the sixth semiconductor region is not less than 5.5×10 11 /cm 2 and not more than 1.2×10 12 /cm 2 .
4. The apparatus according to claim 1 , further comprising a light-shielding membrane arranged on the first surface and configured to cover the fourth semiconductor region.
5. The apparatus according to claim 1 , further comprising:
a floating diffusion region of the first conductivity type; and
a second transfer electrode arranged on the first surface and configured to form, in the first semiconductor region, a channel for transferring the signal charge from the fourth semiconductor region to the floating diffusion region.
6. The apparatus according to claim 1 , further comprising:
a ninth semiconductor region of the second conductivity type,
wherein the ninth semiconductor region overlaps at least a part of the first transfer electrode and does not overlap the third semiconductor region in a planar view.
7. A solid-state image sensor comprising:
a pixel unit in which pixels, each including a photoelectric conversion apparatus defined in claim 1 , are arranged in a matrix;
a vertical scanning circuit configured to control the pixel unit to read out a signal from each pixel; and
a processing circuit configured to process the signal read out from the pixel.
8. A device that includes a photoelectric conversion apparatus defined in claim 1 ,
wherein the device further comprises at least one of
an optical apparatus corresponding to the photoelectric conversion apparatus;
a control apparatus configured to control the photoelectric conversion apparatus;
a processing apparatus configured to process a signal output from the photoelectric conversion apparatus;
a display apparatus configured to display information obtained by the photoelectric conversion apparatus;
a storage apparatus configured to store the information obtained by the photoelectric conversion apparatus; and
a mechanical apparatus configured to operate based on the information obtained by the photoelectric conversion apparatus.
9. A photoelectric conversion apparatus comprising:
a first semiconductor region of a first conductivity type arranged between a first surface and a second surface;
a second semiconductor region of the first conductivity type arranged between the first surface and the second surface and configured to accumulate a signal charge generated by incident light;
a third semiconductor region of the first conductivity type arranged between the first surface and the second surface;
a fourth semiconductor region of the first conductivity type arranged between the first surface and the second surface and is in contact with the third semiconductor region;
a fifth semiconductor region of a second conductivity type arranged between the fourth semiconductor region and the first surface;
a first transfer electrode arranged on the first surface and configured to form, in the first semiconductor region, a channel for transferring the signal charge accumulated in the second semiconductor region to the third semiconductor region;
a sixth semiconductor region of the second conductivity type arranged between the third semiconductor region and the second surface; and
an eighth semiconductor region of the second conductivity type arranged between the second and the sixth semiconductor regions and the second surface,
wherein the fourth semiconductor region does not overlap the sixth semiconductor region in a planar view, and the sixth semiconductor region and the eighth semiconductor region are electrically connected to each other.
10. The apparatus according to claim 9 , wherein the eighth semiconductor region overlaps the second semiconductor region in a planar view.
11. The apparatus according to claim 9 , wherein the effective amount of dopant ions per unit area for forming the sixth semiconductor region is not less than 5.5×10 11 /cm 2 and not more than 1.2×10 12 /cm 2 .
12. The apparatus according to claim 9 , further comprising a light-shielding membrane arranged on the first surface and configured to cover the fourth semiconductor region.
13. The apparatus according to claim 9 , further comprising:
a floating diffusion region of the first conductivity type; and
a second transfer electrode arranged on the first surface and configured to form, in the first semiconductor region, a channel for transferring the signal charge from the fourth semiconductor region to the floating diffusion region.
14. The apparatus according to claim 9 , further comprising:
a ninth semiconductor region of the second conductivity type,
wherein the ninth semiconductor region overlaps at least a part of the first transfer electrode and does not overlap the third semiconductor region in a planar view.
15. A solid-state image sensor comprising:
a pixel unit in which pixels; each including a photoelectric conversion apparatus defined in claim 9 , are arranged in a matrix;
a vertical scanning circuit configured to control the pixel it to read out a signal from each pixel; and
a processing circuit configured to process the signal read out from the pixel.
16. A device that includes a photoelectric conversion apparatus defined in claim 9 ,
wherein the device further comprises at least one of
an optical apparatus corresponding to the photoelectric conversion apparatus;
a control apparatus configured to control the photoelectric conversion apparatus;
a processing apparatus configured to process a signal output from the photoelectric conversion apparatus;
a display apparatus configured to display information obtained by the photoelectric conversion apparatus;
a storage apparatus configured to store the information obtained by the photoelectric conversion apparatus; and
a mechanical apparatus configured to operate based on the information obtained by the photoelectric conversion apparatus.
17. A photoelectric conversion apparatus comprising:
a first semiconductor region of a first conductivity type arranged between a first surface and a second surface;
a second semiconductor region of the first conductivity type arranged between the first surface and the second surface and configured to accumulate a signal charge generated by incident light;
a third semiconductor region of the first conductivity type arranged between the first surface and the second surface;
a first transfer electrode arranged on the first surface and configured to form, in the first semiconductor region, a channel for transferring the signal charge accumulated in the second semiconductor region to the third semiconductor region; and
a semiconductor region of a second conductivity type which is arranged between the third semiconductor region and the second surface and overlaps at least a part of the third semiconductor region,
wherein the third semiconductor region and the first transfer electrode at least partially overlap each other in a planar view, and
an effective amount of dopant ions per unit area of the semiconductor region of the second conductivity type is not less than 5.5×10 11 /cm 2 and not more than 1.2×10 12 /cm 2 .
18. The apparatus according to claim 17 , further comprising:
a ninth semiconductor region of the second conductivity type,
wherein the ninth semiconductor region overlaps at least a part of the first transfer electrode and does not overlap the third semiconductor region in a planar view.
19. A solid-state image sensor comprising:
a pixel unit in which pixels, each including a photoelectric conversion apparatus defined in claim 17 , are arranged in a matrix;
a vertical scanning circuit configured to control the pixel unit to read out a signal from each pixel; and
a processing circuit configured to process the signal read out from the pixel.
20. A device that includes a photoelectric conversion apparatus defined in claim 17 ,
wherein the device further comprises at least one of
an optical apparatus corresponding to the photoelectric conversion apparatus;
a control apparatus configured to control the photoelectric conversion apparatus;
a processing apparatus configured to process a signal output from the photoelectric conversion apparatus;
a display apparatus configured to display information obtained by the photoelectric conversion apparatus;
a storage apparatus configured to store the information obtained by the photoelectric conversion apparatus; and
a mechanical apparatus configured to operate based on the information obtained by the photoelectric conversion apparatus.