Method of transferring micro-light emitting diodes

1. A method of transferring micro-light emitting diodes, the method comprising:

preparing a transfer substrate comprising a first groove, a second groove, and a third groove;

forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove;

transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light;

removing the first transfer prevention film formed on the second groove;

transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light;

removing the second transfer prevention film formed on the third groove; and

transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.

2. The method of claim 1 , wherein the first transfer prevention film is removable by an organic solution, and the second transfer prevention film is removable by an alkali solution.

3. The method of claim 1 , wherein the first transfer prevention film has a first pattern having a first volume, and the second transfer prevention film has a second pattern having a second volume that is greater than the first volume.

4. The method of claim 3 , wherein the first transfer prevention film and the second transfer prevention film have a same height.

5. The method of claim 3 , wherein, after the removing of the first transfer prevention film, the second transfer prevention film remains on the third groove and has a third volume that is less than or equal to a difference between the first volume and the second volume.

6. The method of claim 3 , wherein the first transfer prevention film has a dot pattern, a stripe pattern, a lattice pattern, or a concentric pattern, and the second transfer prevention film comprises a thin film that fills the third groove.

7. The method of claim 1 , wherein the first transfer prevention film and the second transfer prevention film include a same material, and

wherein the method further comprises selectively removing the first transfer prevention film formed on the second groove using a mask that exposes the first transfer prevention film and blocks the second transfer prevention film.

8. The method of claim 7 , wherein the first transfer prevention film and the second transfer prevention film have thicknesses equal to depths of the second groove and the third groove, respectively.

9. The method of claim 1 , wherein the first transfer prevention film and the second transfer prevention film include a hydrophobic thin film.

10. The method of claim 9 , further comprising selectively removing the first transfer prevention film formed on the second groove using a mask that exposes the first transfer prevention film and blocks the second transfer prevention film.

11. The method of claim 9 , wherein the hydrophobic thin film has a thickness that is less than depths of the second groove and the third groove.

12. The method of claim 1 , wherein the transferring of the first micro-light emitting diode, the second micro-light emitting diode, and the third micro-light emitting diode comprises supplying a liquid into the first groove, the second groove, and the third groove, supplying a corresponding micro-light emitting diode, among the first micro-light emitting diode, the second micro-light emitting diode, and the third micro-light emitting diode, on to the transfer substrate, and scanning the transfer substrate with an absorbent that absorbs the liquid.

13. The method of claim 12 , wherein the supplying of the liquid comprises at least one of a spraying method, a dispensing method, an inkjet dot method, or a method of flowing the liquid to the transfer substrate.

14. The method of claim 12 , wherein the liquid includes at least one of water, ethanol, alcohol, polyol, ketone, halocarbon, acetone, flux, or an organic solvent.

15. The method of claim 12 , wherein the absorbent includes fabric, tissue, polyester fiber, paper or a wiper.