Substrate processing apparatus, and temperature control method
A substrate processing apparatus includes a stage on which a substrate is placed, wherein the stage includes a first plate, a first temperature adjustment mechanism configured to control a temperature of the first plate, a second plate provided below the first plate, a second temperature adjustment mechanism configured to control a temperature of the second plate, and a fastening member configured to fasten the first plate and the second plate.
1. A substrate processing apparatus comprising:
a stage on which a substrate is placed, and
a controller,
wherein the stage includes:
a first plate;
a first temperature adjustment mechanism configured to control a temperature of the first plate;
a second plate provided below the first plate;
a second temperature adjustment mechanism configured to control a temperature of the second plate; and
a fastening member configured to fasten the first plate and the second plate;
wherein the controller is configured to control the first temperature adjustment mechanism and the second temperature adjustment mechanism, and
wherein the controller controls the first temperature adjustment mechanism and the second temperature adjustment mechanism such that the first plate and the second plate have a same temperature at a same timing.
2. The substrate processing apparatus of claim 1 , wherein the stage includes an electrostatic chuck provided on the first plate and on which the substrate is placed.
3. The substrate processing apparatus of claim 2 , further comprising a sensor configured to measure a shape of the first plate.
4. The substrate processing apparatus of claim 3 , wherein the sensor includes a plurality of strain sensors provided on at least one of an upper surface of the first plate, a bottom surface of the first plate, and a bottom surface of the electrostatic chuck and configured to measure the shape of the first plate.
5. The substrate processing apparatus of claim 4 , wherein the fastening member is a screw that is inserted into a screw hole provided in an outer periphery of the first plate and in an outer periphery of the second plate to fasten the first plate and the second plate.
6. The substrate processing apparatus of claim 5 , wherein the first plate and the second plate are made of a same type of metal.
7. The substrate processing apparatus of claim 3 , wherein the sensor includes a plurality of laser interferometers provided below the second plate, and configured to irradiate a bottom surface of the first plate with a laser beam that has passed through a through-hole penetrating the second plate so as to measure the shape of the first plate.
8. The substrate processing apparatus of claim 1 , wherein the fastening member is a screw that is inserted into a screw hole provided in an outer periphery of the first plate and in an outer periphery of the second plate to fasten the first plate and the second plate.
9. The substrate processing apparatus of claim 1 , wherein the first plate and the second plate are made of a same type of metal.
10. A method of controlling a temperature of a stage including a first plate, a first temperature adjustment mechanism configured to control a temperature of the first plate, a second plate provided below the first plate, a second temperature adjustment mechanism configured to control a temperature of the second plate, and a fastening member configured to fasten the first plate and the second plate, the method comprising:
(a) measuring a shape of a substrate placed on the stage; and
(b) controlling the first temperature adjustment mechanism or the second temperature adjustment mechanism based on the measured shape of the substrate,
wherein, in (b), the first temperature adjustment mechanism or the second temperature adjustment mechanism is controlled with reference to histories of temperature changes of the first plate and the second plate stored in a storage part in advance and information indicating a correlation between the temperature changes of the first plate and the second plate and a change in the shape of the first plate.
11. The method of claim 10 , further comprising:
(c) measuring, after (b), the shape of the first plate.
12. A substrate processing apparatus comprising:
a stage on which a substrate is placed, and
a controller,
wherein the stage includes:
a first plate;
a first temperature adjustment mechanism configured to control a temperature of the first plate;
a second plate provided below the first plate;
a second temperature adjustment mechanism configured to control a temperature of the second plate; and
a fastening member configured to fasten the first plate and the second plate,
wherein the controller is configured to control the first temperature adjustment mechanism and the second temperature adjustment mechanism, and
wherein the controller controls the first temperature adjustment mechanism and the second temperature adjustment mechanism to change the temperature of the second plate while maintaining the temperature of the first plate constant.
13. The substrate processing apparatus of claim 12 , wherein the stage includes an electrostatic chuck provided on the first plate and on which the substrate is placed.
14. The substrate processing apparatus of claim 13 , further comprising a sensor configured to measure a shape of the first plate.
15. The substrate processing apparatus of claim 14 , wherein the sensor includes a plurality of strain sensors provided on at least one of an upper surface of the first plate, a bottom surface of the first plate, and a bottom surface of the electrostatic chuck and configured to measure the shape of the first plate.
16. The substrate processing apparatus of claim 15 , wherein the fastening member is a screw that is inserted into a screw hole provided in an outer periphery of the first plate and in an outer periphery of the second plate to fasten the first plate and the second plate.
17. The substrate processing apparatus of claim 16 , wherein the first plate and the second plate are made of a same type of metal.
18. The substrate processing apparatus of claim 14 , wherein the sensor includes a plurality of laser interferometers provided below the second plate, and configured to irradiate a bottom surface of the first plate with a laser beam that has passed through a through-hole penetrating the second plate so as to measure the shape of the first plate.
19. The substrate processing apparatus of claim 12 , wherein the fastening member is a screw that is inserted into a screw hole provided in an outer periphery of the first plate and in an outer periphery of the second plate to fasten the first plate and the second plate.
20. The substrate processing apparatus of claim 12 , wherein the first plate and the second plate are made of a same type of metal.