Temporary bonding of glass pairs using cationic surfactants and/or organic salts
Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a coating layer comprising a cationic surfactant or a coating layer comprising an organic salt, and associated deposition methods. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (? 500° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.
1. An article comprising:
a first sheet comprising a first bonding surface;
a second sheet comprising a second bonding surface;
a modification layer comprising a third bonding surface, the modification layer comprising one or more cationic surfactants,
wherein the modification layer couples the first sheet to the second sheet.
2. An article, comprising:
a first sheet comprising a first bonding surface;
a second sheet comprising a second bonding surface;
a modification layer comprising a third bonding surface, the modification layer comprising a cationic surfactant,
wherein the modification layer couples the first sheet to the second sheet, and
wherein the cationic surfactant comprises a head group comprising a charged nitrogen selected from the group consisting of primary, secondary, tertiary, or quaternary ammonium, pyridinium, and combinations thereof.
3. An article, comprising:
a first sheet comprising a first bonding surface;
a second sheet comprising a second bonding surface;
a modification layer comprising a third bonding surface, the modification layer comprising a cationic surfactant,
wherein the modification layer couples the first sheet to the second sheet, and
wherein the cationic surfactant comprises at least one C 4 -C 24 hydrophobic group.
4. An article, comprising:
a first sheet comprising a first bonding surface;
a second sheet comprising a second bonding surface;
a modification layer comprising a third bonding surface, the modification layer comprising a cationic surfactant,
wherein the modification layer couples the first sheet to the second sheet, and
wherein the cationic surfactant is selected from the group consisting of cetyltrimethylammonium bromide, cetylpyridinium chloride, octyltrimethylammonium bromide, and 1-butylpyridinium chloride.
5. An article, comprising:
a first sheet comprising a first bonding surface;
a second sheet comprising a second bonding surface;
a modification layer comprising a third bonding surface, the modification layer comprising a cationic surfactant,
wherein the modification layer couples the first sheet to the second sheet, and
wherein the cationic surfactant is substantially free of oxygen.
6. The article of claim 1 , wherein the modification layer comprises an average thickness of from about 0.1 nm to about 10 nm.
7. The article of any of the claims 6 , wherein the thickness of the modification layer is sub-monolayer.
8. The article of claim 7 , wherein the modification layer demonstrates an increasing water contact angle with increasing surfactant concentration.
9. An article, comprising:
a first sheet comprising a first bonding surface;
a second sheet comprising a second bonding surface;
a modification layer comprising a third bonding surface, the modification layer comprising a cationic surfactant,
wherein the modification layer couples the first sheet to the second sheet,
wherein the modification layer comprises an average thickness of from about 0.1 nm to about 10 nm,
wherein the thickness of the modification layer is sub-monolayer
wherein the modification layer demonstrates an increasing water contact angle with increasing surfactant concentration, and
wherein the cationic surfactant is cetyltrimethylammonium bromide.
10. The article of claim 1 wherein the third bonding surface is bonded with the second bonding surface with a bond energy of from about 150 to about 750 mJ/m 2 after holding the article at 350° C. for 2 hours.
11. The article of claim 1 wherein the third bonding surface is bonded with the second bonding surface with a bond energy of from about 100 to about 500 mJ/m 2 after holding the article at 370° C. for 30 minutes.
12. The article of claim 1 , wherein the third bonding surface is bonded with the second bonding surface with a bond energy of from about 300 to about 500 mJ/m 2 after holding the article at 370° C. for 30 minutes.
13. The article of claim 1 , wherein a change in percent blister area of the modification layer is less than 3% after holding the article at 350° C. for 2 hours.
14. The article of claim 13 , wherein the change in percent blister area of the modification layer is less than 1%.
15. The article of claim 14 , wherein the change in percent blister area of the modification layer is less than 0.1%.
16. The article of claim 1 , wherein a change in percent blister area of the modification layer is less than 3% after holding the article at 370° C. for 30 minutes.
17. The article of claim 16 , wherein the change in percent blister area of the modification layer is less than 0.1%.
18. The article of claim 1 wherein an average thickness of the second sheet is equal to or less than about 300 microns.
19. The article of claim 18 wherein the average thickness of the second sheet is less than an average thickness of the first sheet.
20. The article of claim 19 wherein the average thickness of the first sheet is equal to or greater than about 200 microns.
21. The article of claim 2 , wherein the modification layer comprises an average thickness of from about 0.1 nm to about 10 nm.
22. The article of claim 3 , wherein the modification layer comprises an average thickness of from about 0.1 nm to about 10 nm.
23. The article of claim 4 , wherein the modification layer comprises an average thickness of from about 0.1 nm to about 10 nm.
24. The article of claim 5 , wherein the modification layer comprises an average thickness of from about 0.1 nm to about 10 nm.