Mask having plating layers and method of manufacturing the same
A mask and a method of manufacturing the same are disclosed. The method of manufacturing a mask includes forming a conductive layer on a pattern region and an auxiliary region around the pattern region of a substrate, placing the substrate including the conductive layer in a plating bath, forming a plating layer on the conductive layer, and separating the substrate and the conductive layer from the plating layer.
1. A mask, comprising:
a pattern region in a plurality of cell regions, the pattern region having a first plating layer; and
an auxiliary region configured to be around the pattern region, the auxiliary region having a second plating layer;
wherein the second plating layer between the plurality of cell regions positioned adjacent to a central portion of the plurality of cell regions has a different width than the second plating layer between the plurality of cell regions positioned adjacent to an outer peripheral portion of the plurality of cell regions.
2. The mask of claim 1 , wherein:
the first plating layer is in a central portion and a peripheral portion of the pattern region, and
the auxiliary region is configured to have a thickness of the first plating layer in the central portion of the pattern region that is equal to a thickness in the peripheral portion of the pattern region.
3. The mask of claim 1 , wherein a width of the first plating layer is different from a width of the second plating layer.
4. The mask of claim 1 , wherein the auxiliary region is a region other than the pattern region.
5. The mask of claim 1 , wherein the first plating layer and the second plating layer are formed of the same material.
6. A mask, comprising:
a substrate including a plurality of cell regions;
a first plating layer in the plurality of cell regions;
a second plating layer in an outer periphery of the plurality of cell regions; and
a third plating layer between the plurality of cell regions, one of the second plating layer and the third plating layer having a same thickness as a thickness of the first plating layer;
wherein the third plating layer positioned adjacent to a central portion of the plurality of cell regions has a different width than the third plating layer positioned adjacent to an outer peripheral portion of the plurality of cell regions.
7. The mask of claim 6 , wherein the second plating layer and the third plating layer are configured to have the same thickness as the first plating layer in the plurality of cell regions.
8. The mask of claim 6 , wherein one of the second plating layer and the third plating layer is configured to have different widths and to have the same thickness of the first plating layer in the plurality of cell regions.
9. The mask of claim 6 , wherein the first plating layer, the second plating layer, and the third plating layer are formed of the same material.