IP Library Granted Patent US 11,636,336
Granted Patent B2
US 11,636,336 · App. 16/729,453 · Granted Apr 25, 2023

Training device and training method for neural network model

Inventors: Mao-Yu Huang (Yunlin County, TW); Po-Yen Hsieh (Taichung, TW); Chih-Neng Liu (Tainan, TW); Tsann-Tay Tang (Taipei, TW)
Assignee: Industrial Technology Research Institute
G06N3/08G01N21/956G06N3/045G06T7/001G01N2021/95646G06T2207/30148G06T2207/30152
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Quick Facts
Patent No.
US 11,636,336
App. No.
16/729,453
Filed
Dec 29, 2019
Granted
Apr 25, 2023
Kind
B2
Art Unit
2482
USPC
706/25
Abstract

A training device and a training method for a neural network model. The training method includes: obtaining a data set; completing, according to the data set, a plurality of artificial intelligence (AI) model trainings to generate a plurality of models corresponding to the plurality of AI model trainings respectively; selecting, according to a first constraint, a first model set from the plurality of models; and selecting, according to a second constraint, the neural network model from the first model set.

Claims (34)

1. A training device for a neural network model, comprising:

a transceiver;

a storage medium, storing a plurality of modules; and

a processor, coupled to the storage medium and the transceiver, and accessing and executing the plurality of modules, wherein the plurality of modules comprise:

a data collection module, obtaining a data set through the transceiver; and

a training module, completing a plurality of artificial intelligence (AI) model trainings according to the data set to generate a plurality of models corresponding to the plurality of AI model trainings respectively, selecting a first model set from the plurality of models according to a first constraint, and selecting the neural network model from the first model set according to a second constraint, wherein the first constraint is a first indicator of a confusion matrix and the second constraint is a second indicator of the confusion matrix, wherein the first constraint is different from the second constraint

wherein the data collection module receives defect samples and normal samples through the transceiver and oversamples the defect samples to generate the data set in response to a ratio of the defect samples to the normal samples being less than a threshold.

2. The training device as claimed in claim 1 , wherein the training module selects a second model set from the first model set according to a third constraint and selects the neural network model from the second model set according to the second constraint.

3. The training device as claimed in claim 1 , wherein the training module selects the neural network model corresponding to a target condition from the first model set according to the second constraint.

4. The training device as claimed in claim 1 , wherein the training module selects the neural network model corresponding to the last iteration among the iterations of AI model training complied with the second constraint from the first model set according to the second constraint.

5. The training device as claimed in claim 1 , wherein the first constraint and the second constraint are associated with at least one of: a true negative rate (TNR), a true positive rate (TPR), a false negative rate (FNR), a false positive rate (FPR), a minimum error rate, an average error rate, a recall rate, or accuracy.

6. The training device as claimed in claim 1 , wherein the neural network model comprises an autoencoder neural network, a deep learning neural network, a deep residual learning neural network, and a restricted Boltzmann machine neural network, a recursive neural network, or a multilayer perception neural network.

7. The training device as claimed in claim 1 , wherein the data set is associated with an appearance of a printed circuit board, and the defect samples are associated with at least one of: inclusion of solder mask (S/M), scratch of S/M, pollution of S/M, copper exposure of S/M, uneven printing of S/M, skip printing of S/M, poor developing, board damage of S/M, wetting of S/M, inclusion of S/M organic solderability preservative (OSP), oxidation of S/M OSP, pollution of PAD gold plating, oxidation of PAD gold plating, copper exposure of PAD gold plating, blur text, wetting of PAD or normal.

8. The training device as claimed in claim 1 , wherein the data set is associated with an appearance of a semiconductor manufacturing wafer, and the defect samples are associated with at least one of: scratch, arrow, particle, discolor, or normal.

9. The training device as claimed in claim 1 , further comprising:

a graphical user interface, coupled to the processor, wherein the processor obtains the first constraint and the second constraint through the graphical user interface.

10. A training method for a neural network model, comprising:

obtaining a data set, comprising: receiving defect samples and normal samples and oversampling the defect samples to generate the data set in response to a ratio of the defect samples to the normal samples being less than a threshold;

completing a plurality of artificial intelligence (AI) model trainings according to the data set to generate a plurality of models corresponding to the plurality of AI model trainings respectively;

selecting a first model set from the plurality of models according to a first constraint; and

selecting the neural network model from the first model set according to a second constraint,

wherein the first constraint is a first indicator of a confusion matrix and the second constraint is a second indicator of the confusion matrix, wherein the first constraint is different from the second constraint.

11. The training method as claimed in claim 10 , wherein the step of selecting the neural network model from the first model set according to the second constraint comprises:

selecting a second model set from the first model set according to a third constraint and selecting the neural network model from the second model set according to the second constraint.

12. The training method as claimed in claim 10 , wherein the step of selecting the neural network model from the first model set according to the second constraint comprises:

selecting the neural network model corresponding to a target condition from the first model set according to the second constraint.

13. The training method as claimed in claim 10 , wherein the step of selecting the neural network model from the first model set according to the second constraint comprises:

selecting the neural network model corresponding to the last iteration among the iterations of AI model training complied with the second constraint from the first model set according to the second constraint.

14. The training method as claimed in claim 10 , wherein the first constraint and the second constraint are associated with at least one of: a true negative rate (TNR), a true positive rate (TPR), a false negative rate (FNR), a false positive rate (FPR), a minimum error rate, an average error rate, a recall rate, or accuracy.

15. The training method as claimed in claim 10 , wherein the neural network model comprises an autoencoder neural network, a deep learning neural network, a deep residual learning neural network, and a restricted Boltzmann machine neural network, a recursive neural network, or a multilayer perception neural network.

16. The training method as claimed in claim 10 , wherein the data set is associated with an appearance of a printed circuit board, and the defect samples are associated with at least one of: inclusion of solder mask (S/M), scratch of S/M, pollution of S/M, copper exposure of S/M, uneven printing of S/M, skip printing of S/M, poor developing, board damage of S/M, wetting of S/M, inclusion of S/M organic solderability preservative (OSP), oxidation of S/M OSP, pollution of PAD gold plating, oxidation of PAD gold plating, copper exposure of PAD gold plating, blur text, wetting of PAD, or normal.

17. The training method as claimed in claim 10 , wherein the data set is associated with an appearance of a semiconductor manufacturing wafer, and the defect samples are associated with at least one of: scratch, arrow, particle, discolor, or normal.

18. The training method as claimed in claim 10 , further comprising:

obtaining the first constraint and the second constraint through a graphical user interface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2019
From: HUANG, MAO-YU; HSIEH, PO-YEN; LIU, CHIH-NENG; TANG, TSANN-TAY
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 051390/0075 →
Priority Claims (1)
TW 108144234 · Dec 4, 2019 · national
Continuity (1)
Related Publication 20210174200A1 · Jun 10, 2021